利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

21 条记录 (耗时 0.036 秒)

    Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards
    1.
    发明授权
    Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards 有权
    用于电光封装的装置和方法，其有助于将光缆耦合到印刷电路板

    公开(公告)号：US06749345B1

    公开(公告)日：2004-06-15

    申请号：US10155743

    申请日：2002-05-24

    申请人： Stephen Andrew Gee ,  Luu Thanh Nguyen ,  Ken Pham ,  Jia Liu ,  William Paul Mazotti ,  Bruce Carlton Roberts ,  Peter Deane

    发明人： Stephen Andrew Gee ,  Luu Thanh Nguyen ,  Ken Pham ,  Jia Liu ,  William Paul Mazotti ,  Bruce Carlton Roberts ,  Peter Deane

    IPC分类号： G02B638

    CPC分类号： G02B6/4277 ,  G02B6/421 ,  G02B6/424 ,  G02B6/425 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/428 ,  G02B6/4292

    摘要： Electro-optical packages that embed the electronics of the packages directly to the optical cabling, provide short electrical connection paths for high performance, and that provide a robust interconnects. A first electro-optical package includes an integrated circuit and a connector sleeve configured to receive a plug-in optical assembly from the underside of the PC board. The plug-in optical assembly includes a backing piece and an opto-electric device mounted onto the backing piece. An electrical connection is provided between the opto-electric device and a contact location on the backing piece and a contact is provided between the contact location on the backing piece and the integrated circuit. With a second electro-optical package, an integrated circuit having an active surface facing in a first direction and an opto-electric device having contact points facing a second direction are provided. The integrated circuit and the opto-electric are positioned with respect to one another such that a direct electrical connection can be formed between the active surface of the integrated circuit and the contact points of the opto-electrical device.

    摘要翻译： 将封装的电子元件直接嵌入光缆的电光封装，为高性能提供短的电连接路径，并提供稳健的互连。 第一电光学封装包括集成电路和连接器套管，其被配置为从PC板的下侧接收插入式光学组件。 插入式光学组件包括背衬片和安装在背衬片上的光电装置。 在光电装置和背衬片上的接触位置之间提供电连接，并且在背衬片上的接触位置和集成电路之间提供触点。 通过第二电光封装，提供具有面向第一方向的有源表面的集成电路和具有面向第二方向的接触点的光电装置。 集成电路和光电相对于彼此定位，使得可以在集成电路的有源表面和光电装置的接触点之间形成直接电连接。

    Ceramic optical sub-assembly for optoelectronic modules
    2.
    发明授权
    Ceramic optical sub-assembly for optoelectronic modules 有权
    陶瓷光电子组件用于光电模块

    公开(公告)号：US07269027B2

    公开(公告)日：2007-09-11

    申请号：US11344721

    申请日：2006-01-31

    申请人： Jia Liu ,  Luu Thanh Nguyen ,  Ken Pham ,  William Paul Mazotti ,  Bruce Carlton Roberts ,  Stephen Andrew Gee ,  John P. Briant

    发明人： Jia Liu ,  Luu Thanh Nguyen ,  Ken Pham ,  William Paul Mazotti ,  Bruce Carlton Roberts ,  Stephen Andrew Gee ,  John P. Briant

    IPC分类号： H05K7/02

    CPC分类号： H01S5/02284 ,  H01S5/4025

    摘要： Optoelectronic components, specifically, ceramic optical sub-assemblies are described. In one aspect, the optoelectronic component includes a ceramic base substrate having a pair of angled (or substantially perpendicular) faces. The electrical traces are formed directly on the ceramic surfaces and extend between the pair of faces. A semiconductor chip assembly is mounted on the first face of the ceramic base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the ceramic base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. It is particularly well adapted for use with vertical cavity surface emitting lasers (or laser arrays) and detectors (or detector arrays). In some embodiments, at least the cathode of the photonic device is soldered directly to a cathode pad on the base substrate. Similarly, in some embodiments, the semiconductor chip assembly is electrically connected to the base substrate by direct soldering. Specific base substrate structures are disclosed as well.

    摘要翻译： 光电子部件，特别是陶瓷光学子组件被描述。 在一个方面，光电子部件包括具有一对成角度（或大致垂直）面的陶瓷基底基板。 电迹线直接形成在陶瓷表面上并在一对面之间延伸。 半导体芯片组件安装在陶瓷基底基板的第一面上，光子器件安装在第二面上。 半导体芯片组件和光子器件都与陶瓷基底衬底上的迹线电连接。 半导体芯片组件通常被布置成电连接到外部设备。 光子器件通常布置成与一根或多根光纤光学通信。 所描述的结构可以与各种各样的光子器件一起使用。 它特别适用于垂直腔表面发射激光（或激光阵列）和检测器（或检测器阵列）。 在一些实施例中，光子器件的至少阴极直接焊接到基底衬底上的阴极焊盘。 类似地，在一些实施例中，半导体芯片组件通过直接焊接电连接到基底基板。 还公开了特定的基底结构。

    Ceramic optical sub-assembly for optoelectronic modules
    3.
    发明授权
    Ceramic optical sub-assembly for optoelectronic modules 有权

    公开(公告)号：US07023705B2

    公开(公告)日：2006-04-04

    申请号：US10165711

    申请日：2002-06-06

    申请人： Jia Liu ,  Luu Thanh Nguyen ,  Ken Pham ,  William Paul Mazotti ,  Bruce Carlton Roberts ,  Stephen Andrew Gee ,  John P. Briant

    发明人： Jia Liu ,  Luu Thanh Nguyen ,  Ken Pham ,  William Paul Mazotti ,  Bruce Carlton Roberts ,  Stephen Andrew Gee ,  John P. Briant

    IPC分类号： H05K7/02

    CPC分类号： H05K1/0219 ,  G02B6/4201 ,  H05K1/189 ,  H05K3/403 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/10121

    摘要： Optoelectronic components, specifically, ceramic optical sub-assemblies are described. In one aspect, the optoelectronic component includes a ceramic base substrate having a pair of angled (or substantially perpendicular) faces. The electrical traces are formed directly on the ceramic surfaces and extend between the pair of faces. A semiconductor chip assembly is mounted on the first face of the ceramic base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the ceramic base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. It is particularly well adapted for use with vertical cavity surface emitting lasers (or laser arrays) and detectors (or detector arrays). In some embodiments, at least the cathode of the photonic device is soldered directly to a cathode pad on the base substrate. Similarly, in some embodiments, the semiconductor chip assembly is electrically connected to the base substrate by direct soldering. Specific base substrate structures are disclosed as well.