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公开(公告)号：US20170239756A1
公开(公告)日：2017-08-24
申请号：US15435856
申请日：2017-02-17
Applicant: Materion Corporation
Inventor： Ramesh Kothandapani , SinLi Tan , Chee Kong Lee
IPC: B23K35/02 , B23K35/30 , B23K26/38 , B23K26/40 , H01L23/10 , B23K1/19 , C22C5/02 , H01L21/48 , H01L23/053 , B23K35/26 , B23K26/16
CPC classification number: B23K35/0222 , B23K1/19 , B23K26/16 , B23K26/38 , B23K26/40 , B23K35/0233 , B23K35/268 , B23K35/3013 , B23K2103/52 , C22C5/02 , H01L21/4817 , H01L23/053 , H01L23/10 , H01L2924/16195
Abstract: Methods of making solder preforms are disclosed. A ribbon of raw material is received, and a first annular solder preform is formed by laser cutting the ribbon. The edges of the first annular solder preform can then be cleaned. The cutout section removed from the middle of the first annular solder preform can then be laser cut to form a second annular solder preform that is smaller than the first annular solder preform.
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公开(公告)号：US10357841B2
公开(公告)日：2019-07-23
申请号：US15380247
申请日：2016-12-15
Applicant: Materion Corporation
Inventor： Ramesh Kothandapani , Chee Kong Lee
IPC: B23K31/02 , B23K1/00 , B23K35/02 , H05K5/00 , H05K5/03 , H05K5/04 , H01L23/04 , H01S5/022 , B23K35/30 , C22C5/02 , H05K5/06 , B23K101/40 , B32B38/08 , H01L21/50
Abstract: A cap assembly for optical communications comprising a housing that includes a front side perpendicular from a bottom side, opposing parallel first and second sides perpendicular from the bottom side, and a back side disposed perpendicularly between the first side and the second side offset from respective ends of the first side and the second side opposite the front side. The back side includes an opening there-through and a three-sided ledge formed along an interior of the first side leg, an exterior of the back side, and an interior of the second side leg. The cap assembly further includes a window configured to contact the three-sided ledge of the back side, the glass panel covering the opening there-through and attached to the assembly via a solder pre-form.
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公开(公告)号：US10163743B2
公开(公告)日：2018-12-25
申请号：US15598706
申请日：2017-05-18
Applicant: Materion Corporation
Inventor： Richard J. Koba , Chee Kong Lee , Wei Chuan Goh , Sin Yee Chin
IPC: H01L23/10 , H01L21/48 , H01L23/047 , H01L21/52
Abstract: An air cavity package includes a flange and a pedestal extending upward from the flange. A dielectric frame is joined to the flange and surrounds the pedestal. The semiconductor die is placed on the pedestal, which reduces the length of the wires joining the die to the leads of the air cavity package.
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公开(公告)号：US20170338161A1
公开(公告)日：2017-11-23
申请号：US15598706
申请日：2017-05-18
Applicant: Materion Corporation
Inventor： Richard J. Koba , Chee Kong Lee , Wei Chuan Goh , Sin Yee Chin
CPC classification number: H01L23/10 , H01L21/4803 , H01L21/52 , H01L23/047
Abstract: An air cavity package includes a flange and a pedestal extending upward from the flange. A dielectric frame is joined to the flange and surrounds the pedestal. The semiconductor die is placed on the pedestal, which reduces the length of the wires joining the die to the leads of the air cavity package.
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Patent Agency Ranking
公开(公告)号：US20170323837A1
公开(公告)日：2017-11-09
申请号：US15590144
申请日：2017-05-09
Applicant: Materion Corporation
Inventor： Richard J. Koba , Chee Kong Lee , Wei Chuan Goh , Sin Yee Chin
IPC: H01L23/14 , H01L23/36 , H01L23/28 , H01L23/373 , H01L23/10
CPC classification number: H01L23/14 , H01L23/04 , H01L23/047 , H01L23/10 , H01L23/28 , H01L23/36 , H01L23/3738
Abstract: An air cavity package includes a dielectric frame that is formed from an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic. The dielectric frame is joined to a flange using a high temperature silicone adhesive. Leads may be bonded to the dielectric frame using a high temperature organic adhesive, a direct bond, or by brazing.
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公开(公告)号：US09560781B2
公开(公告)日：2017-01-31
申请号：US14335042
申请日：2014-07-18
Applicant: Materion Corporation
Inventor： Ramesh Kothandapani , Chee Kong Lee
CPC classification number: B23K1/0016 , B23K35/0222 , B23K35/3013 , B23K2101/40 , B32B38/08 , C22C5/02 , H01L21/50 , H01L23/04 , H01L2924/0002 , H01S5/02296 , H05K5/0095 , H05K5/03 , H05K5/04 , H05K5/062 , Y10T156/1052 , H01L2924/00
Abstract: A cap assembly for optical communications comprising a housing that includes a front side perpendicular from a bottom side, opposing parallel first and second sides perpendicular from the bottom side, and a back side disposed perpendicularly between the first side and the second side offset from respective ends of the first side and the second side opposite the front side. The back side includes an opening there-through and a three-sided ledge formed along an interior of the first side leg, an exterior of the back side, and an interior of the second side leg. The cap assembly further includes a window configured to contact the three-sided ledge of the back side, the window covering the opening there-through and attached to the assembly via a solder pre-form.
Abstract translation: 一种用于光通信的盖组件，包括壳体，该壳体包括从底侧垂直的前侧，与底侧垂直的相对的平行的第一和第二侧;以及垂直于第一侧和第二侧之间偏离各自端部的后侧 的第一侧和与前侧相对的第二侧。 后侧包括沿着第一侧腿的内部，后侧的外部和第二侧腿的内部形成的开口，以及沿着第一侧腿的内部形成的三面凸缘。 盖组件还包括构造成接触后侧的三面凸缘的窗口，窗口覆盖其中的开口并经由焊料预成型件附接到组件。
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公开(公告)号：US11227806B2
公开(公告)日：2022-01-18
申请号：US15590144
申请日：2017-05-09
Applicant: Materion Corporation
Inventor： Richard J. Koba , Chee Kong Lee , Wei Chuan Goh , Sin Yee Chin
IPC: H01L23/14 , H01L23/047 , H01L23/04 , H01L23/10 , H01L23/28 , H01L23/36 , H01L23/373
Abstract: An air cavity package includes a dielectric frame that is formed from an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic. The dielectric frame is joined to a flange using a high temperature silicone adhesive. Leads may be bonded to the dielectric frame using a high temperature organic adhesive, a direct bond, or by brazing.
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公开(公告)号：US20170095870A1
公开(公告)日：2017-04-06
申请号：US15380247
申请日：2016-12-15
Applicant: Materion Corporation
Inventor： Ramesh Kothandapani , Chee Kong Lee
CPC classification number: B23K1/0016 , B23K35/0222 , B23K35/3013 , B23K2101/40 , B32B38/08 , C22C5/02 , H01L21/50 , H01L23/04 , H01L2924/0002 , H01S5/02296 , H05K5/0095 , H05K5/03 , H05K5/04 , H05K5/062 , Y10T156/1052 , H01L2924/00
Abstract: A cap assembly for optical communications comprising a housing that includes a front side perpendicular from a bottom side, opposing parallel first and second sides perpendicular from the bottom side, and a back side disposed perpendicularly between the first side and the second side offset from respective ends of the first side and the second side opposite the front side. The back side includes an opening there-through and a three-sided ledge formed along an interior of the first side leg, an exterior of the back side, and an interior of the second side leg. The cap assembly further includes a window configured to contact the three-sided ledge of the back side, the glass panel covering the opening there-through and attached to the assembly via a solder pre-form.
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公开(公告)号：US20170069560A1
公开(公告)日：2017-03-09
申请号：US14652326
申请日：2015-05-22
Applicant: MATERION CORPORATION
Inventor： Richard J. Koba , Chee Kong Lee , Wei Chuan Goh , Joelle Ng
IPC: H01L23/373 , H01L23/047 , H01L21/48 , H01L23/10
CPC classification number: H01L23/373 , H01L21/4807 , H01L21/4871 , H01L23/047 , H01L23/10 , H01L23/36 , H01L23/3731 , H01L23/3732 , H01L23/3735 , H01L23/3736 , H01L23/3738 , H01L2924/0002 , H01L2924/00
Abstract: An air cavity package includes a dielectric frame that is formed from a polyimide or a liquid crystal polymer (LCP). The dielectric frame is joined to a flange and to electrical leads using a polyimide adhesive.
Abstract translation: 气腔封装包括由聚酰亚胺或液晶聚合物（LCP）形成的电介质框架。 使用聚酰亚胺粘合剂将电介质框架连接到凸缘和电引线。
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