MEMS Deformable Lens Assembly and Process Flow

    公开(公告)号:US20230236341A1

    公开(公告)日:2023-07-27

    申请号:US18158017

    申请日:2023-01-23

    IPC分类号: G02B3/14 H10N30/20

    CPC分类号: G02B3/14 H10N30/2047

    摘要: A glass membrane deformation assembly configured to deform a glass membrane includes: a deformable glass membrane having a first surface and a second surface; a piezoelectric layer affixed to a first surface of the deformable glass membrane, wherein the piezoelectric layer is controllably deformable via a voltage potential; a structural member affixed to at least a first portion of the second surface of the deformable glass membrane; and a deformable lens assembly affixed to at least a second portion of the second surface of the deformable glass membrane; wherein the controllably deformation of the piezoelectric layer is configured to controllably deform the deformable glass membrane and the deformable lens assembly.

    MEMS Assembly and Process Flow
    6.
    发明申请

    公开(公告)号:US20230097412A1

    公开(公告)日:2023-03-30

    申请号:US17936699

    申请日:2022-09-29

    IPC分类号: H02N1/00

    摘要: A temporary MEMS-based locking assembly is configured to temporarily compress electrically conductive flexures and includes: a first locking structure coupled to a first portion of a MEMS conductive assembly; a second locking structure coupled to a second portion of the MEMS conductive assembly, wherein: the electrically conductive flexures are positioned between the first portion of the MEMS conductive assembly and the second portion of the MEMS conductive assembly, and the first and second locking structures are configured to engage each other upon the compression of the electrically conductive flexures to effectuate the locking of the first portion of the MEMS conductive assembly with respect to the second portion of the MEMS conductive assembly.

    MEMS Flexure Assembly
    9.
    发明公开

    公开(公告)号:US20240154543A1

    公开(公告)日:2024-05-09

    申请号:US18502438

    申请日:2023-11-06

    IPC分类号: H02N1/00

    CPC分类号: H02N1/008

    摘要: An electrically-conductive, MEMS flexure assembly includes: a first MEMS subportion including a first plurality of electrically-conductive pads; a second MEMS subportion including a second plurality of electrically-conductive pads; and a plurality of MEMS electrically-conductive flexures electrically coupling the first plurality of electrically-conductive pads on the first MEMS subportion and the second plurality of electrically-conductive pads on the second MEMS subportion.