公开(公告)号：US20240416420A1

公开(公告)日：2024-12-19

申请号：US18717531

申请日：2022-06-21

Applicant: Mitsubishi Electric Corporation

Inventor： Daiji MORITA ,  Nobuyuki SUMI ,  Hisashi YAMADA

IPC: B22F10/22 ,  B22F10/36 ,  B22F12/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

Abstract: An additive manufacturing apparatus includes: a machining head; a beam nozzle through which a beam emitted from the machining head passes; a material feed unit that feeds a material to a workpiece; a first drive unit that moves a tip portion of the material relative to the workpiece; a second drive unit that moves the beam in a direction included in a reference plane perpendicular to a central axis of the beam nozzle; and a controller that determines, on the basis of a direction of travel, a direction of the movement of the beam, the direction of travel being included in the reference plane, the direction of travel being a direction in which the tip portion travels relative to the workpiece, and controls the first and second drive units such that the beam is movable in a manner different from movement of the tip portion relative to the workpiece.

公开(公告)号：US20220324057A1

公开(公告)日：2022-10-13

申请号：US17623636

申请日：2019-08-07

Applicant: Mitsubishi Electric Corporation

Inventor： Shigeru TAKUSHIMA ,  Daiji MORITA ,  Nobuyuki SUMI ,  Satoshi HATTORI ,  Takafumi FUJII ,  Shun KAYASHIMA

IPC: B23K26/342 ,  B23K26/03 ,  B23K26/046 ,  G01B11/06 ,  B22F10/22 ,  B22F12/90 ,  B22F12/41 ,  B22F10/36 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

Abstract: An additive manufacturing apparatus that forms an object by repeating additive machining of melting a machining material and adding, onto a workpiece, the machining material solidified includes: a height measurement unit that measures a height of the object formed at a machining position; and a control unit that controls a machining condition for adding the machining material to the machining position on the basis of a measurement result provided by the height measurement unit.

公开(公告)号：US20170207605A1

公开(公告)日：2017-07-20

申请号：US15315436

申请日：2015-07-24

Applicant: MITSUBISHI ELECTRIC CORPORATION

Inventor： Daiji MORITA ,  Masato KAWASAKI ,  Susumu KONNO ,  Tomotaka KATSURA ,  Shuichi FUJIKAWA

IPC: H01S5/40 ,  H01S5/022 ,  H01S5/14

CPC classification number: H01S5/4012 ,  H01S5/02288 ,  H01S5/141 ,  H01S5/143 ,  H01S5/4062 ,  H01S5/4087

Abstract: A semiconductor laser device, in which, between a wavelength dispersive element and a partially reflecting mirror, such an anamorphic prism pair is arranged that is configured to increase an angle formed by a regular oscillation optical axis of a regular oscillation beam emitted from each of light emitting points and a cross-coupling optical axis of a cross-coupling oscillation beam oscillating through a different one of the light emitting points. It is therefore possible to increase oscillation loss of the cross-coupling oscillation beam, thereby improving focusing properties, without increasing the device in size.

公开(公告)号：US20230321914A1

公开(公告)日：2023-10-12

申请号：US18024516

申请日：2020-10-15

Applicant: Mitsubishi Electric Corporation

Inventor： Nobuhiro SHINOHARA ,  Daiji MORITA

IPC: B29C64/393 ,  B29C64/364 ,  B29C64/295 ,  B29C64/118 ,  B29C64/227 ,  B29C64/35

CPC classification number: B29C64/393 ,  B29C64/364 ,  B29C64/295 ,  B29C64/118 ,  B29C64/227 ,  B29C64/35 ,  B33Y50/02

Abstract: An additive manufacturing method includes a step of measuring a temperature of an object of processing or a shaping material and outputting temperature data, a step of correcting basic commands based on a basic processing program and the temperature data, and determining post-correction commands including a material supply command, a heat source supply unit command, a drive command, and a gas supply command, a step of supplying the shaping material to a processing position of a shaped article based on the material supply command, a step of supplying a heat source to melt the shaping material supplied to the processing position based on the heat source supply unit command, a step of changing the relative position between the processing position and the shaped article based on the drive command, and a step of supplying, to the processing position, a shielding gas based on the gas supply command.

公开(公告)号：US20210323092A1

公开(公告)日：2021-10-21

申请号：US17270454

申请日：2019-04-04

Applicant: Mitsubishi Electric Corporation

Inventor： Daiji MORITA ,  Nobuhiro SHINOHARA ,  Yoshikazu NAKANO ,  Yoshikazu UKAI

IPC: B23K26/342 ,  B23K26/12 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

Abstract: An additive manufacturing apparatus includes: a material supply unit that supplies a build material to a process area of an additive target surface; an irradiation unit that irradiates the process area with a laser beam that melts the build material; and a control device that controls the material supply unit and the irradiation unit for creating at least a part of an object using a dot-shaped bead, the dot-shaped bead being formed of the build material melted by radiation of the laser beam. The additive manufacturing apparatus can improve the shape accuracy of the object.

公开(公告)号：US20180175590A1

公开(公告)日：2018-06-21

申请号：US15579780

申请日：2015-12-25

Applicant: Mitsubishi Electric Corporation

Inventor： Tatsuya YAMAMOTO ,  Daiji MORITA ,  Masato KAWASAKI ,  Kazuki KUBA ,  Junichi NISHIMAE ,  Tetsuo KOJIMA

IPC: H01S5/14 ,  H01S5/00 ,  H01S5/022 ,  H01S5/40 ,  H01S5/22

CPC classification number: H01S5/146 ,  H01S3/08027 ,  H01S3/0805 ,  H01S5/0071 ,  H01S5/0078 ,  H01S5/02288 ,  H01S5/141 ,  H01S5/143 ,  H01S5/22 ,  H01S5/4031 ,  H01S5/4062 ,  H01S5/4068 ,  H01S5/4087

Abstract: A semiconductor laser device includes: a semiconductor laser bar to output a plurality of beams with different wavelengths from a continuous light-emitting region; a light-condensing optical system to condense the beams; a wavelength-dispersive optical element having a wavelength dispersing function; an optical filter in which a wavelength of a beam that passes therethrough differs periodically; an aperture located on an optical path of the beams superimposed on an identical axis; and a partially reflecting mirror. A totally reflecting mirror is formed on a back side of the semiconductor laser bar, and wavelengths of a plurality of beams with different wavelengths reflected by the totally reflecting mirror and output from the semiconductor laser bar are respectively identical to wavelengths of beams that pass through the optical filter.

公开(公告)号：US20230294170A1

公开(公告)日：2023-09-21

申请号：US18022175

申请日：2020-08-26

Applicant: Mitsubishi Electric Corporation

Inventor： Shigeru TAKUSHIMA ,  Daiji MORITA

IPC: B22F10/22 ,  B22F12/44 ,  B22F10/85

CPC classification number: B22F10/22 ,  B22F12/44 ,  B22F10/85 ,  B23K26/342

Abstract: A 3D printing apparatus includes: a machining optical system including an objective lens, and configured to radiate machining light to a machining position; a measurement illumination unit that supplies illumination light for measuring a size of an object formed; a light-receiving element that detects reflected light that is the illumination light reflected by the object; a light-receiving optical system that concentrates the reflected light on the light-receiving element; a calculation unit that computes, through calculation using a detection result of the reflected light in the light-receiving element, a width of the object in a third direction perpendicular to a first direction in which the machining position is moved with respect to a workpiece and a second direction in which beads are stacked; and a control unit that controls a machining condition for forming the beads based on a computation result of the width of the object.

公开(公告)号：US20190363517A1

公开(公告)日：2019-11-28

申请号：US16338694

申请日：2017-03-01

Applicant: MITSUBISHI ELECTRIC CORPORATION

Inventor： Junichi NISHIMAE ,  Tomotaka KATSURA ,  Daiji MORITA ,  Hiroaki KUROKAWA

IPC: H01S5/40 ,  G02B27/10 ,  H01S5/10

Abstract: A laser oscillator includes: a plurality of laser media to emit laser beams having different wavelengths; a diffraction grating to emit, in a superimposed state, the laser beams incident from the laser media; a partially reflective element to reflect part of the laser beams emitted from the diffraction grating and return the part of the laser beams to the diffraction grating, and to transmit a remainder; and a plurality of lenses each disposed between a corresponding one of the laser media and the diffraction grating. The lenses are each disposed in an optical path formed between a corresponding one of the laser media and the diffraction grating, and the lenses superimpose the laser beams from the laser media on an incident surface of the diffraction grating such that the laser beams have an equal outer diameter.

公开(公告)号：US20190126395A1

公开(公告)日：2019-05-02

申请号：US16307188

申请日：2017-07-05

Applicant: Mitsubishi Electric Corporation

Inventor： Naoyuki NAKAMURA ,  Masaki SEGUCHI ,  Tomotaka KATSURA ,  Daiji MORITA

IPC: B23K26/06 ,  B23K26/36

Abstract: A laser machining apparatus includes: a laser oscillator that emits laser light (L) having a plurality of wavelengths; a transmission diffractive optical element (21) that allows the laser light (L) to pass therethrough; a machining lens (3) that concentrates the laser light (L) that has passed through the transmission diffractive optical element (21); a distance adjustment mechanism (31) that changes a distance between the transmission diffractive optical element (21) and the machining lens (3); and an angle adjustment mechanism (32) that changes an angle of the transmission diffractive optical element (21) to switch between a state in which the laser light (L) is dispersed by the transmission diffractive optical element (21) and then enters the machining lens (3) and a state in which the laser light (L) enters the machining lens (3) without being dispersed by the transmission diffractive optical element (21).

公开(公告)号：US20160344162A1

公开(公告)日：2016-11-24

申请号：US15112598

申请日：2015-01-22

Applicant: MITSUBISHI ELECTRIC CORPORATION

Inventor： Susumu KONNO ,  Masato KAWASAKI ,  Daiji MORITA ,  Tomotaka KATSURA ,  Shuichi FUJIKAWA

IPC: H01S5/40 ,  H01S3/08 ,  H01S5/0683 ,  H01S5/14

CPC classification number: H01S5/4012 ,  B23K26/0613 ,  B23K26/705 ,  C03B23/20 ,  H01S3/08059 ,  H01S5/06825 ,  H01S5/0683 ,  H01S5/14 ,  H01S5/143 ,  H01S5/4025 ,  H01S5/4062 ,  H01S5/4087

Abstract: A beam combining device causing beams from a plurality of light sources and one or a plurality of spare light sources to enter a beam combining optical system, and to be combined and output after passing through a beam combining element. The beam combining device is configured to: detect a failure in the plurality of light sources; and move at least a part of the respective light sources, the spare light source, and the beam combining optical system, to cause a beam to enter the beam combining optical system from the spare light source instead of a beam from the failed light source, and to cause the beam to be combined to beams from the plurality of light sources on an optical path after the beam combining element.

Abstract translation: 一种光束组合装置，其使得来自多个光源的光束和一个或多个备用光源进入光束组合光学系统，并且在通过光束组合元件之后被组合和输出。 所述光束组合装置被配置为：检测所述多个光源中的故障; 并且移动各个光源，备用光源和光束组合光学系统的至少一部分，以使光束从备用光源而不是来自故障光源的光束进入光束组合光学系统， 并且使光束在光束组合元件之后的光路上组合成来自多个光源的光束。