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公开(公告)号：US11733267B2
公开(公告)日：2023-08-22
申请号：US16822896
申请日：2020-03-18
Applicant: MPI Corporation
Inventor： Che-Wei Lin , Ting-Ju Wu , Keng-Min Su , Chin-Yi Lin
CPC classification number: G01R1/07314 , G01R1/06733
Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.
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公开(公告)号：US10119991B2
公开(公告)日：2018-11-06
申请号：US14668374
申请日：2015-03-25
Applicant: MPI CORPORATION
Inventor： Tsung-Yi Chen , Horng-Kuang Fan , Ching-Hung Yang , Chung-Tse Lee , Chia-Yuan Kuo , Tien-Chia Li , Ting-Ju Wu , Shang-Jung Hsieh
Abstract: A vertical probe device includes a lower die having engaging holes and needle holes, a positioning film having limiting holes and needle holes, probe needles inserted through the needle holes, and supporters having at least an upper stopping surface and at least a lower stopping surface for moveably limiting the positioning film therebetween. Each supporter has a head, a neck passing through the limiting hole and having a length longer than the thickness of the positioning film, a body, and a tail inserted into the engaging hole, which are connected in order, and at least one of the upper and lower stopping surfaces. The supporters can prevent the positioning film from being lifted and flipped over and enables the positioning film to move so that the probe needles are reliable.
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Patent Agency Ranking
公开(公告)号：US20200309819A1
公开(公告)日：2020-10-01
申请号：US16822896
申请日：2020-03-18
Applicant: MPI Corporation
Inventor： Che-Wei Lin , Ting-Ju Wu , Keng-Min Su , Chin-Yi Lin
Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.
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公开(公告)号：US09465050B2
公开(公告)日：2016-10-11
申请号：US14643780
申请日：2015-03-10
Applicant: MPI CORPORATION
Inventor： Tsung-Yi Chen , Horng-Kuang Fan , Ching-Hung Yang , Chung-Tse Lee , Chia-Yuan Kuo , Tien-Chia Li , Ting-Ju Wu
CPC classification number: G01R3/00 , G01R1/073 , G01R1/07307 , G01R1/07314 , G01R1/0735 , G01R31/2601 , Y10T29/49117 , Y10T29/49718 , Y10T29/49895
Abstract: An assembling method for a vertical probe device includes steps of disposing a lower die on a jig by inserting supporting columns through jig holes of the lower die, fastening a positioning film on the supporting columns, installing probe needles and an upper die in a way that the positioning film is located between the upper and lower dies without contacting the upper die, unfastening the positioning film, and removing the jig so that the upper and lower dies, positioning film and probe needles constitute the device. A maintaining method for the device includes steps of inserting the supporting columns through the jig holes, fastening the positioning film to the jig, and removing the upper die. The probe needles and upper die are easily removed and installed and the probe needles are reliable. The vertical probe device is applicable for accommodating electronic components on the top thereof.
Abstract translation: 垂直探针装置的组装方法包括以下步骤：通过将支撑柱插入下模的夹具孔，将下模设置在夹具上，将定位膜紧固在支撑柱上，安装探针和上模， 定位膜位于上模和下模之间，不接触上模，松开定位膜，并移除夹具，使上，下模，定位膜和探针构成装置。 该装置的保持方法包括以下步骤：将支撑柱插入夹具孔中，将定位膜紧固到夹具上，并移除上模。 探头针和上模容易拆卸和安装，探针可靠。 垂直探针装置适用于在其顶部容纳电子部件。
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公开(公告)号：US20240118316A1
公开(公告)日：2024-04-11
申请号：US18544756
申请日：2023-12-19
Applicant: MPI Corporation
Inventor： Chin-Yi Lin , Che-Wei Lin , Ting-Ju Wu , Chien-Kai Hung
CPC classification number: G01R3/00 , G01R1/07342
Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.
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公开(公告)号：US11874313B2
公开(公告)日：2024-01-16
申请号：US17518311
申请日：2021-11-03
Applicant: MPI Corporation
Inventor： Chin-Yi Lin , Che-Wei Lin , Ting-Ju Wu , Chien-Kai Hung
CPC classification number: G01R3/00 , G01R1/07342
Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.
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公开(公告)号：US20220170961A1
公开(公告)日：2022-06-02
申请号：US17518311
申请日：2021-11-03
Applicant: MPI Corporation
Inventor： Chin-Yi Lin , Che-Wei Lin , Ting-Ju Wu , Chien-Kai Hung
Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.
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