Vertical-type semiconductor device having repetitive-pattern layer
    1.
    发明授权
    Vertical-type semiconductor device having repetitive-pattern layer 失效
    具有重复图案层的垂直型半导体器件

    公开(公告)号:US07342265B2

    公开(公告)日:2008-03-11

    申请号:US11012116

    申请日:2004-12-16

    摘要: A semiconductor device is fabricated to include a withstand-voltage assurance layer designed into a multi-dimensional super junction structure and a group of trench gate electrodes, each of which penetrating a body layer in contact with the multi-dimensional super junction structure to reach the multi-dimensional super junction structure, so that dispersions of an on-resistance of the semiconductor device can be reduced. When a position at which the group of trench gate electrodes is created is shifted in one direction, the size of an overlap area common to the group of trench gate electrodes and an n-type column changes. However, the group of trench gate electrodes is oriented in such a way that the changes in overlap-area size are minimized.

    摘要翻译: 半导体器件被制造成包括设计成多维超结结构的耐压保证层和一组沟槽栅极电极,每个沟槽栅电极穿透与多维超结结构接触的体层以达到 多维超结结构,能够降低半导体装置的导通电阻的分散。 当形成沟槽栅电极组的位置在一个方向上移动时,沟槽栅电极组和n型列共同的重叠区域的尺寸改变。 然而,沟槽栅电极组被定向成使得重叠区域尺寸的变化最小化。

    Semiconductor device and design-aiding program
    2.
    发明申请
    Semiconductor device and design-aiding program 失效
    半导体器件和设计辅助程序

    公开(公告)号:US20050133859A1

    公开(公告)日:2005-06-23

    申请号:US11012116

    申请日:2004-12-16

    摘要: A semiconductor device is fabricated to include a withstand-voltage assurance layer designed into a multi-dimensional super junction structure and a group of trench gate electrodes, each of which penetrating a body layer in contact with the multi-dimensional super junction structure to reach the multi-dimensional super junction structure, so that dispersions of an on-resistance of the semiconductor device can be reduced. When a position at which the group of trench gate electrodes is created is shifted in one direction, the size of an overlap area common to the group of trench gate electrodes and an n-type column changes. However, the group of trench gate electrodes is oriented in such a way that the changes in overlap-area size are minimized.

    摘要翻译: 半导体器件被制造成包括设计成多维超结结构的耐压保证层和一组沟槽栅极电极,每个沟槽栅电极穿透与多维超结结构接触的体层以达到 多维超结结构,能够降低半导体装置的导通电阻的分散。 当形成沟槽栅电极组的位置在一个方向上移动时,沟槽栅电极组和n型列共同的重叠区域的尺寸改变。 然而,沟槽栅电极组被定向成使得重叠区域尺寸的变化最小化。

    Semiconductor device having super junction structure and method for manufacturing the same
    3.
    发明申请
    Semiconductor device having super junction structure and method for manufacturing the same 有权
    具有超结结构的半导体器件及其制造方法

    公开(公告)号:US20070013412A1

    公开(公告)日:2007-01-18

    申请号:US11472547

    申请日:2006-06-22

    IPC分类号: H03K19/091

    摘要: A semiconductor device includes: a cell region; a terminal region; a lower semiconductor layer; a intermediate semiconductor layer on the lower semiconductor layer including a super junction structure; a terminal upper semiconductor layer on the intermediate semiconductor layer; a terminal contact semiconductor region on a surface portion of the terminal upper semiconductor layer adjacent to the cell region; an insulation layer on the terminal upper semiconductor layer having a first part adjacent to the cell region with a small thickness and a second part adjacent to the first part with a large thickness; and a conductive layer in the cell region and a part of the terminal region, the conductive layer extending from the cell region to the part of the terminal region beyond the first part of the insulation layer.

    摘要翻译: 半导体器件包括:单元区域; 终端区域 下半导体层; 包括超级结结构的下半导体层上的中间半导体层; 中间半导体层上的端子上半导体层; 在所述端子上半导体层的与所述单元区域相邻的表面部分上的端子接触半导体区域; 端子上半导体层上的绝缘层具有邻近具有小厚度的单元区域的第一部分和与厚度较大的第一部分相邻的第二部分; 以及在所述单元区域和所述端子区域的一部分中的导电层,所述导电层从所述单元区域延伸到所述绝缘层的所述第一部分之外的所述端子区域的所述部分。

    Semiconductor device having super junction structure and method for manufacturing the same
    4.
    发明授权
    Semiconductor device having super junction structure and method for manufacturing the same 有权
    具有超结结构的半导体器件及其制造方法

    公开(公告)号:US07342422B2

    公开(公告)日:2008-03-11

    申请号:US11472547

    申请日:2006-06-22

    IPC分类号: H01L25/00 H03K19/00

    摘要: A semiconductor device includes: a cell region; a terminal region; a lower semiconductor layer; a intermediate semiconductor layer on the lower semiconductor layer including a super junction structure; a terminal upper semiconductor layer on the intermediate semiconductor layer; a terminal contact semiconductor region on a surface portion of the terminal upper semiconductor layer adjacent to the cell region; an insulation layer on the terminal upper semiconductor layer having a first part adjacent to the cell region with a small thickness and a second part adjacent to the first part with a large thickness; and a conductive layer in the cell region and a part of the terminal region, the conductive layer extending from the cell region to the part of the terminal region beyond the first part of the insulation layer.

    摘要翻译: 半导体器件包括:单元区域; 终端区域 下半导体层; 包括超级结结构的下半导体层上的中间半导体层; 中间半导体层上的端子上半导体层; 在所述端子上半导体层的与所述单元区域相邻的表面部分上的端子接触半导体区域; 端子上半导体层上的绝缘层具有邻近具有小厚度的单元区域的第一部分和与厚度较大的第一部分相邻的第二部分; 以及在所述单元区域和所述端子区域的一部分中的导电层,所述导电层从所述单元区域延伸到所述绝缘层的所述第一部分之外的所述端子区域的所述部分。