公开(公告)号：US20110175107A1

公开(公告)日：2011-07-21

申请号：US13005714

申请日：2011-01-13

申请人： Taro NISHIGUCHI ,  Makoto Sasaki ,  Shin Harada ,  Kyoko Okita ,  Hiroki Inoue ,  Shinsuke Fujiwara ,  Yasuo Namikawa

发明人： Taro NISHIGUCHI ,  Makoto Sasaki ,  Shin Harada ,  Kyoko Okita ,  Hiroki Inoue ,  Shinsuke Fujiwara ,  Yasuo Namikawa

IPC分类号： H01L29/16

CPC分类号： H01L21/02378 ,  H01L21/02002 ,  H01L21/02529 ,  H01L21/02667 ,  H01L21/30625 ,  H01L29/1608

摘要： A base portion is made of silicon carbide and has a main surface. At least one silicon carbide layer is provided on the main surface of the base portion in a manner exposing a region of the main surface along an outer edge of the main surface. At least one protection layer is provided on this region of the main surface of the base portion along the outer edge of the main surface. Thus, a silicon carbide substrate can be polished with high in-plane uniformity.

摘要翻译： 基部由碳化硅制成并具有主表面。 至少一个碳化硅层以沿着主表面的外边缘露出主表面的区域的方式设置在基部的主表面上。 沿着主表面的外缘在基部的主表面的该区域上设置至少一个保护层。 因此，可以以高的面内均匀性抛光碳化硅衬底。

公开(公告)号：US20120009761A1

公开(公告)日：2012-01-12

申请号：US13256991

申请日：2010-09-28

申请人： Taro Nishiguchi ,  Makoto Sasaki ,  Shin Harada ,  Kyoko Okita ,  Hiroki Inoue ,  Shinsuke Fujiwara ,  Yasuo Namikawa

发明人： Taro Nishiguchi ,  Makoto Sasaki ,  Shin Harada ,  Kyoko Okita ,  Hiroki Inoue ,  Shinsuke Fujiwara ,  Yasuo Namikawa

IPC分类号： H01L21/306 ,  H01L21/304

CPC分类号： C30B29/36 ,  C30B33/06

摘要： At least one single crystal substrate, each having a backside surface and made of silicon carbide, and a supporting portion having a main surface and made of silicon carbide, are prepared. In this preparing step, at least one of the backside surface and main surface is formed by machining. By this forming step, a surface layer having distortion in the crystal structure is formed on at least one of the backside surface and main surface. The surface layer is removed at least partially. Following this removing step, the backside surface and main surface are connected to each other.

摘要翻译： 制备至少一个具有背面并由碳化硅制成的单晶基板和具有主表面并由碳化硅制成的支撑部分。 在该制备步骤中，通过机械加工形成背面和主表面中的至少一个。 通过该形成步骤，在背面和主面中的至少一个上形成有晶体结构变形的表层。 表面层至少部分去除。 在该去除步骤之后，背面和主表面彼此连接。

公开(公告)号：US20120070605A1

公开(公告)日：2012-03-22

申请号：US13375287

申请日：2010-09-17

申请人： Makoto Sasaki ,  Shin Harada ,  Taro Nishiguchi ,  Kyoko Okita ,  Hiroki Inoue ,  Yasuo Namikawa ,  Shinsuke Fujiwara

发明人： Makoto Sasaki ,  Shin Harada ,  Taro Nishiguchi ,  Kyoko Okita ,  Hiroki Inoue ,  Yasuo Namikawa ,  Shinsuke Fujiwara

IPC分类号： B32B7/04 ,  B28D5/00 ,  C30B23/02 ,  C01B31/36 ,  B32B9/04

CPC分类号： C30B29/36 ,  C30B23/00 ,  H01L21/02002 ,  Y10T428/192

摘要： An SiC ingot includes a bottom face having 4 sides; four side faces extending from the bottom face in a direction intersecting the direction of the bottom face; and a growth face connected with the side faces located at a side opposite to the bottom face. At least one of the bottom face, the side faces, and the growth face is the {0001} plane, {1-100} plane, {11-20} plane, or a plane having an inclination within 10° relative to these planes.

摘要翻译： SiC锭包括具有4个侧面的底面; 四个侧面从与底面方向相交的方向从底面延伸; 以及与位于与底面相对的一侧的侧面连接的生长面。 底面，侧面和生长面中的至少一个是{0001}面，{1-100}面，{11-20}面，或相对于这些平面倾斜10°以内的平面 。

公开(公告)号：US08435866B2

公开(公告)日：2013-05-07

申请号：US13256991

申请日：2010-09-28

申请人： Taro Nishiguchi ,  Makoto Sasaki ,  Shin Harada ,  Kyoko Okita ,  Hiroki Inoue ,  Shinsuke Fujiwara ,  Yasuo Namikawa

发明人： Taro Nishiguchi ,  Makoto Sasaki ,  Shin Harada ,  Kyoko Okita ,  Hiroki Inoue ,  Shinsuke Fujiwara ,  Yasuo Namikawa

IPC分类号： H01L21/306 ,  H01L21/304

CPC分类号： C30B29/36 ,  C30B33/06

摘要： At least one single crystal substrate, each having a backside surface and made of silicon carbide, and a supporting portion having a main surface and made of silicon carbide, are prepared. In this preparing step, at least one of the backside surface and main surface is formed by machining. By this forming step, a surface layer having distortion in the crystal structure is formed on at least one of the backside surface and main surface. The surface layer is removed at least partially. Following this removing step, the backside surface and main surface are connected to each other.

摘要翻译： 制备至少一个具有背面并由碳化硅制成的单晶基板和具有主表面并由碳化硅制成的支撑部分。 在该制备步骤中，通过机械加工形成背面和主表面中的至少一个。 通过该形成步骤，在背面和主面中的至少一个上形成有晶体结构变形的表层。 表面层至少部分去除。 在该去除步骤之后，背面和主表面彼此连接。

公开(公告)号：US08629457B2

公开(公告)日：2014-01-14

申请号：US13005719

申请日：2011-01-13

申请人： Taro Nishiguchi ,  Makoto Sasaki ,  Shin Harada ,  Kyoko Okita ,  Hiroki Inoue ,  Shinsuke Fujiwara ,  Yasuo Namikawa

发明人： Taro Nishiguchi ,  Makoto Sasaki ,  Shin Harada ,  Kyoko Okita ,  Hiroki Inoue ,  Shinsuke Fujiwara ,  Yasuo Namikawa

IPC分类号： H01L33/18

CPC分类号： H01L33/16 ,  H01L33/007 ,  H01L33/32

摘要： A silicon carbide substrate has a first layer facing a semiconductor layer and a second layer stacked on the first layer. Dislocation density of the second layer is higher than dislocation density of the first layer. Thus, quantum efficiency and power efficiency of a light-emitting device can both be high.

摘要翻译： 碳化硅衬底具有面向半导体层的第一层和堆叠在第一层上的第二层。 第二层的位错密度高于第一层的位错密度。 因此，发光装置的量子效率和功率效率都可以高。

公开(公告)号：US20110284873A1

公开(公告)日：2011-11-24

申请号：US13146432

申请日：2010-09-28

申请人： Taro Nishiguchi ,  Makoto Sasaki ,  Shin Harada ,  Kyoko Okita ,  Hiroki Inoue ,  Shinsuke Fujiwara ,  Yasuo Namikawa

发明人： Taro Nishiguchi ,  Makoto Sasaki ,  Shin Harada ,  Kyoko Okita ,  Hiroki Inoue ,  Shinsuke Fujiwara ,  Yasuo Namikawa

IPC分类号： H01L29/161

CPC分类号： H01L29/66068 ,  H01L21/02529 ,  H01L21/02609 ,  H01L21/187 ,  H01L29/7802

摘要： A silicon carbide substrate has a substrate region and a support portion. The substrate region has a first single crystal substrate. The support portion is joined to a first backside surface of the first single crystal. The dislocation density of the first single crystal substrate is lower than the dislocation density of the support portion. At least one of the substrate region and the support portion has voids.

摘要翻译： 碳化硅衬底具有衬底区域和支撑部分。 衬底区域具有第一单晶衬底。 支撑部分连接到第一单晶的第一背面。 第一单晶基板的位错密度低于支撑部的位错密度。 衬底区域和支撑部分中的至少一个具有空隙。

公开(公告)号：US20110175108A1

公开(公告)日：2011-07-21

申请号：US13005719

申请日：2011-01-13

申请人： Taro Nishiguchi ,  Makoto Sasaki ,  Shin Harada ,  Kyoko Okita ,  Hiroki Inoue ,  Shinsuke Fujiwara ,  Yasuo Namikawa

发明人： Taro Nishiguchi ,  Makoto Sasaki ,  Shin Harada ,  Kyoko Okita ,  Hiroki Inoue ,  Shinsuke Fujiwara ,  Yasuo Namikawa

IPC分类号： H01L33/18

CPC分类号： H01L33/16 ,  H01L33/007 ,  H01L33/32

摘要： A silicon carbide substrate has a first layer facing a semiconductor layer and a second layer stacked on the first layer. Dislocation density of the second layer is higher than dislocation density of the first layer. Thus, quantum efficiency and power efficiency of a light-emitting device can both be high.

摘要翻译： 碳化硅衬底具有面向半导体层的第一层和堆叠在第一层上的第二层。 第二层的位错密度高于第一层的位错密度。 因此，发光装置的量子效率和功率效率都可以高。

公开(公告)号：US20120161157A1

公开(公告)日：2012-06-28

申请号：US13393235

申请日：2010-09-28

申请人： Hiroki Inoue ,  Shin Harada ,  Makoto Sasaki ,  Taro Nishiguchi ,  Kyoko Okita ,  Yasuo Namikawa

发明人： Hiroki Inoue ,  Shin Harada ,  Makoto Sasaki ,  Taro Nishiguchi ,  Kyoko Okita ,  Yasuo Namikawa

IPC分类号： H01L29/161

CPC分类号： H01L29/7802 ,  C30B29/36 ,  H01L21/02378 ,  H01L21/0243 ,  H01L21/02444 ,  H01L21/02447 ,  H01L21/0245 ,  H01L21/02529 ,  H01L21/02631 ,  H01L21/0475 ,  H01L29/1608 ,  H01L29/66068

摘要： A silicon carbide substrate, which achieves restrained warpage even when a different-type material layer made of a material other than silicon carbide, includes: a base layer made of silicon carbide; and a plurality of SiC layers arranged side by side on the base layer when viewed in a planar view and each made of single-crystal silicon carbide. A gap is formed between end surfaces of adjacent SiC layers.

摘要翻译： 即使当由不同于碳化硅的材料制成的不同类型的材料层时也能实现约束翘曲的碳化硅衬底包括：由碳化硅制成的基底层; 以及在平面图中观察时，在基底层上并排设置的多个SiC层，并且均由单晶碳化硅构成。 在相邻SiC层的端面之间形成间隙。

公开(公告)号：US20120126251A1

公开(公告)日：2012-05-24

申请号：US13388691

申请日：2011-02-25

申请人： Makoto Sasaki ,  Shin Harada ,  Takeyoshi Masuda ,  Keiji Wada ,  Hiroki Inoue ,  Taro Nishiguchi ,  Kyoko Okita ,  Yasuo Namikawa ,  Taku Horii

发明人： Makoto Sasaki ,  Shin Harada ,  Takeyoshi Masuda ,  Keiji Wada ,  Hiroki Inoue ,  Taro Nishiguchi ,  Kyoko Okita ,  Yasuo Namikawa ,  Taku Horii

IPC分类号： H01L29/24 ,  H01L21/04

CPC分类号： H01L29/7802 ,  H01L21/2007 ,  H01L21/3247 ,  H01L29/045 ,  H01L29/1608 ,  H01L29/66068

摘要： A method for manufacturing a silicon carbide substrate achieves reduced manufacturing cost. The method includes the steps of: preparing a base substrate and a SiC substrate; fabricating a stacked substrate by stacking the base substrate and the SiC substrate; fabricating a connected substrate by heating the stacked substrate; transferring a void, formed at a connection interface, in a thickness direction of the connected substrate by heating the connected substrate to cause the base substrate to have a temperature higher than that of the SiC substrate; and removing the void by removing a region including a main surface of the base substrate opposite to the SiC substrate.

摘要翻译： 制造碳化硅衬底的方法降低了制造成本。 该方法包括以下步骤：制备基底和SiC衬底; 通过堆叠基底基板和SiC基板来制造堆叠的基板; 通过加热堆叠的基板来制造连接的基板; 通过加热连接的基板，在连接的基板的厚度方向上形成在连接界面处形成的空隙，使得基底基板的温度高于SiC基板的温度; 并且通过去除包括与SiC衬底相对的基底衬底的主表面的区域来去除空隙。

公开(公告)号：US20110278595A1

公开(公告)日：2011-11-17

申请号：US13104275

申请日：2011-05-10

申请人： Taro Nishiguchi ,  Makoto Sasaki ,  Shin Harada ,  Kyoko Okita ,  Hiroki Inoue ,  Yasuo Namikawa

发明人： Taro Nishiguchi ,  Makoto Sasaki ,  Shin Harada ,  Kyoko Okita ,  Hiroki Inoue ,  Yasuo Namikawa

IPC分类号： H01L29/24 ,  C30B23/02 ,  H01L21/20 ,  B32B13/04

CPC分类号： H01L29/7802 ,  B32B9/00 ,  B32B13/04 ,  B32B2307/202 ,  B32B2307/732 ,  B32B2457/14 ,  C30B29/36 ,  C30B33/06 ,  H01L21/02378 ,  H01L21/02433 ,  H01L21/02529 ,  H01L21/02631 ,  H01L21/046 ,  H01L21/049 ,  H01L21/2007 ,  H01L29/045 ,  H01L29/1608 ,  H01L29/66068

摘要： A method for manufacturing a silicon carbide substrate includes the steps of: preparing a base substrate made of silicon carbide and a SiC substrate made of single-crystal silicon carbide; fabricating a stacked substrate by placing said SiC substrate on and in contact with a main surface of said base substrate; and connecting said base substrate and said SiC substrate to each other by heating said stacked substrate in a container to fall within a range of temperature equal to or greater than a sublimation temperature of silicon carbide constituting said base substrate. In the step of connecting said base substrate and said SiC substrate, a silicon carbide body made of silicon carbide and different from said base substrate and said SiC substrate is disposed in said container.

摘要翻译： 制造碳化硅基板的方法包括以下步骤：制备由碳化硅制成的基底基板和由单晶碳化硅制成的SiC基板; 通过将所述SiC衬底放置在所述基底衬底的主表面上并与之接触来制造堆叠衬底; 以及通过在容器中加热所述堆叠的基板而将所述基底基板和所述SiC基板彼此连接，以落入构成所述基底基板的碳化硅的升华温度以上的温度范围内。 在连接所述基底衬底和所述SiC衬底的步骤中，将由碳化硅制成并且与所述基底衬底和所述SiC衬底不同的碳化硅体设置在所述容器中。