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公开(公告)号:US10186742B2
公开(公告)日:2019-01-22
申请号:US13803385
申请日:2013-03-14
申请人: Marc Eisenzweig Sherwin , Robert S. Howell , Pavel Borodulin , Harold Clifton Hearne, III , Nabil Abdel-Meguid El-Hinnawy , Robert Miles Young
发明人: Marc Eisenzweig Sherwin , Robert S. Howell , Pavel Borodulin , Harold Clifton Hearne, III , Nabil Abdel-Meguid El-Hinnawy , Robert Miles Young
IPC分类号: H01P1/10 , H01L45/02 , H03K19/173 , H01L45/00 , H03K19/177
摘要: One embodiment of the invention includes a reconfigurable circuit comprising a phase-change material switch. The phase-change material switch includes an actuation portion configured to receive a control signal having one of a first state and a second state and to emit a first heat profile in response to the first state of the control signal and a second heat profile in response to the second state of the control signal. The phase-change material switch also includes a switch portion comprising a phase-change material in proximity with the actuation portion. The switch portion can be selectable between a conducting state in response to the first heat profile to conduct an input signal from an input to an output of the phase-change material switch and a blocking state in response to the second heat profile to substantially block the input signal from the input to the output.
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公开(公告)号:US09257647B2
公开(公告)日:2016-02-09
申请号:US13828351
申请日:2013-03-14
申请人: Pavel Borodulin , Nabil Abdel-Meguid El-Hinnawy , Robert Miles Young , Robert S. Howell , John R. Mason, Jr. , Brian Paul Wagner , Matthew Russell King , Evan B. Jones , Michael J. Lee , Marc Eisenzweig Sherwin
发明人: Pavel Borodulin , Nabil Abdel-Meguid El-Hinnawy , Robert Miles Young , Robert S. Howell , John R. Mason, Jr. , Brian Paul Wagner , Matthew Russell King , Evan B. Jones , Michael J. Lee , Marc Eisenzweig Sherwin
IPC分类号: H01L45/00
CPC分类号: H01L45/1625 , H01L45/06 , H01L45/1206 , H01L45/1226 , H01L45/126 , H01L45/1286 , H01L45/144 , H01L45/1641 , H01L45/1666
摘要: A phase change material (PCM) switch is disclosed that includes a resistive heater element, and a PCM element proximate the resistive heater element. A thermally conductive electrical insulating barrier layer positioned between the PCM heating element and the resistive heating element, and conductive lines extend from ends of the PCM element and control lines extend from ends of the resistive heater element.
摘要翻译: 公开了一种相变材料(PCM)开关,其包括电阻加热器元件和靠近电阻加热器元件的PCM元件。 定位在PCM加热元件和电阻加热元件之间的导热电绝缘阻挡层,导电线从PCM元件的端部延伸,控制线从电阻加热元件的端部延伸。
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公开(公告)号:US20140264230A1
公开(公告)日:2014-09-18
申请号:US13828351
申请日:2013-03-14
申请人: PAVEL BORODULIN , Nabil Abdel-Meguid El-Hinnawy , Robert Miles Young , Robert S. Howell , John R. Mason , Brian Paul Wagner , Matthew Russell King , Evan B. Jones , Michael J. Lee , Mark Eisenzweig Sherwin
发明人: PAVEL BORODULIN , Nabil Abdel-Meguid El-Hinnawy , Robert Miles Young , Robert S. Howell , John R. Mason , Brian Paul Wagner , Matthew Russell King , Evan B. Jones , Michael J. Lee , Mark Eisenzweig Sherwin
IPC分类号: H01L45/00
CPC分类号: H01L45/1625 , H01L45/06 , H01L45/1206 , H01L45/1226 , H01L45/126 , H01L45/1286 , H01L45/144 , H01L45/1641 , H01L45/1666
摘要: A phase change material (PCM) switch is disclosed that includes a resistive heater element, and a PCM element proximate the resistive heater element. A thermally conductive electrical insulating barrier layer positioned between the PCM heating element and the resistive heating element, and conductive lines extend from ends of the PCM element and control lines extend from ends of the resistive heater element
摘要翻译: 公开了一种相变材料(PCM)开关,其包括电阻加热器元件和靠近电阻加热器元件的PCM元件。 位于PCM加热元件和电阻加热元件之间的导热电绝缘阻挡层,导线从PCM元件的端部延伸,控制线从电阻加热元件的端部延伸
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4.
公开(公告)号:US10854600B2
公开(公告)日:2020-12-01
申请号:US16577629
申请日:2019-09-20
申请人: Justin Andrew Parke , Eric J. Stewart , Robert S. Howell , Howell George Henry , Bettina Nechay , Harlan Carl Cramer , Matthew Russell King , Shalini Gupta , Ronald G. Freitag , Karen Marie Renaldo
发明人: Justin Andrew Parke , Eric J. Stewart , Robert S. Howell , Howell George Henry , Bettina Nechay , Harlan Carl Cramer , Matthew Russell King , Shalini Gupta , Ronald G. Freitag , Karen Marie Renaldo
IPC分类号: H01L21/338 , H01L27/088 , H01L21/8252 , H01L21/308 , H01L29/66 , H01L29/778 , H01L27/06 , H01L29/20 , H01L29/06
摘要: A method of forming an integrated circuit can include forming a heterostructure over a substrate structure, wherein the given substrate structure comprises a given semiconductor material. The method can include etching a castellated channel region in an e-mode device area of the heterostructure that defines a plurality of ridge channels interleaved between a plurality of trenches, the ridge channels comprising another semiconductor material. The method can also include forming an isolation region on the heterostructure to electrically isolate the e-mode device area from a d-mode device area of the heterostructure. The method can further include forming a mask with an opening that defines a castellated gate opening overlying the castellated channel region and the mask defines an opening overlaying a single planar gate overlying the d-mode device area of the heterostructure. The method can also include performing a contact fill with conductive material to form a castellated gate contact.
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公开(公告)号:US07514301B2
公开(公告)日:2009-04-07
申请号:US11524246
申请日:2006-09-21
CPC分类号: H01L27/1203 , B81C1/0019 , B82Y10/00 , B82Y30/00 , H01F41/041 , H01L21/84 , H01L27/10
摘要: A method for fabricating nanocoils and improved nanocoils fabricated therefrom. Embodiments of the method utilizing deep reactive ion etching (DRIE). A method for fabricating nanocoils includes providing a silicon-on-insulator (SOI) wafer, in which SOI wafer includes buried oxide layer, patterning one or more devices into a layer of silicon on top of the buried oxide layer, depositing tensile stressed nitride layer on the top silicon layer, patterning coiling arm structure on top silicon layer, patterning an overlapping etch window mask on bottom side of SOI wafer using, in which patterning overlapping etch window mask removes SOI wafer and exposes buried oxide layer in width greater than coiling arm structure, and releasing coiling arm structure so that coiling arm coils to form nanocoil. In embodiments, DRIE is utilized to pattern the overlapping etch window mask.
摘要翻译: 一种用于制造纳米线和由其制造的改进的纳米薄膜的方法。 利用深反应离子蚀刻(DRIE)的方法的实施例。 制造纳米线的方法包括提供绝缘体上硅(SOI)晶片,其中SOI晶片包括掩埋氧化物层,将一个或多个器件图案化成掩埋氧化物层顶部的硅层,沉积拉应力氮化物层 在顶层硅层上,在顶部硅层上图案化卷取臂结构,在SOI晶片的底侧上构图重叠的蚀刻窗口掩模,其中图案化重叠的蚀刻窗口掩模移除SOI晶片并暴露出大于卷取臂的宽度的掩埋氧化物层 结构和释放卷取臂结构,使卷绕臂线圈形成纳米油。 在实施例中,DRIE用于对重叠的蚀刻窗口掩模进行图案化。
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公开(公告)号:US10804387B1
公开(公告)日:2020-10-13
申请号:US16360828
申请日:2019-03-21
IPC分类号: H01L29/778 , H01L29/15 , H01L29/08 , H01L29/66 , H01L21/02
摘要: A vertical transistor is provided that includes a base structure and a superlattice structure overlying the base structure. The superlattice structure comprises a multichannel ridge having sidewalls. The multichannel ridge comprises a plurality of heterostructures that each form a channel of the multichannel ridge. The vertical transistor also includes a source region that overlies the base structure and is in contact with a first end of the superlattice structure, a floating drain that overlies the base structure and is in contact with a second end of the superlattice structure, and a drain. When the vertical transistor is in an ‘ON’ state, current flows from the source region through the channels of the multichannel ridge to the floating drain, which funnels the current to the drain through at least a portion of the base structure.
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7.
公开(公告)号:US10468406B2
公开(公告)日:2019-11-05
申请号:US14509750
申请日:2014-10-08
申请人: Justin Andrew Parke , Eric J. Stewart , Robert S. Howell , Howell George Henry , Bettina Nechay , Harlan Carl Cramer , Matthew Russell King , Shalini Gupta , Ronald G. Freitag , Karen Marie Renaldo
发明人: Justin Andrew Parke , Eric J. Stewart , Robert S. Howell , Howell George Henry , Bettina Nechay , Harlan Carl Cramer , Matthew Russell King , Shalini Gupta , Ronald G. Freitag , Karen Marie Renaldo
IPC分类号: H01L29/15 , H01L27/088 , H01L21/8252 , H01L21/308 , H01L29/66 , H01L29/778 , H01L27/06 , H01L29/20 , H01L29/06
摘要: A circuit is provided that includes a castellated channel device that comprises a heterostructure overlying a substrate structure, a castellated channel device area formed in the heterostructure that defines a plurality of ridge channels interleaved between a plurality of trenches, and a three-sided castellated conductive gate contact that extends across the castellated channel device area. The three-sided gate contact substantially surrounds each ridge channel around their tops and their sides to overlap a channel interface of heterostructure of each of the plurality of ridge channels. The three-sided castellated conductive gate contact extends along at least a portion of a length of each ridge channel.
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公开(公告)号:US09773897B2
公开(公告)日:2017-09-26
申请号:US14676285
申请日:2015-04-01
申请人: Bettina A. Nechay , Robert S. Howell , Eric J. Stewart , Howell George Henry , Justin Andrew Parke , Ronald G. Freitag
发明人: Bettina A. Nechay , Robert S. Howell , Eric J. Stewart , Howell George Henry , Justin Andrew Parke , Ronald G. Freitag
IPC分类号: H01L29/02 , H01L29/10 , H01L29/778 , H01L29/78 , H01L29/423 , H01L29/40 , H01L29/20
CPC分类号: H01L29/7783 , H01L29/1054 , H01L29/2003 , H01L29/404 , H01L29/4236 , H01L29/42364 , H01L29/7851
摘要: A transistor device is provided that includes a base structure and a superlattice structure that overlies the base structure. The superlattice structure comprises a multichannel ridge having sides that extend to the base structure. The multichannel ridge comprises a plurality of heterostructures that each form a channel of the multichannel ridge. A three-sided gate configuration is provided that wraps around and substantially surrounds the top and sides of the multichannel ridge along at least a portion of its depth. The three-sided gate configuration is configured to re-distribute peak electric fields along the three-sided gate configuration to facilitate the increase in breakdown voltage of the transistor device.
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9.
公开(公告)号:US09755021B2
公开(公告)日:2017-09-05
申请号:US15186193
申请日:2016-06-17
申请人: Karen M. Renaldo , Eric J. Stewart , Robert S. Howell , Howell George Henry , Harlan Carl Cramer , Justin Andrew Parke , Matthew Russell King
发明人: Karen M. Renaldo , Eric J. Stewart , Robert S. Howell , Howell George Henry , Harlan Carl Cramer , Justin Andrew Parke , Matthew Russell King
IPC分类号: H01L29/66 , H01L29/15 , H01L29/778 , H01L21/02 , H01L21/76 , H01L29/06 , H01L21/302 , H01L29/423 , H01L29/20 , H01L21/8252 , H01L27/06 , H01L27/085 , H01L21/3065 , H01L21/768 , H01L29/205 , H01L29/417 , H01L29/51
CPC分类号: H01L29/155 , H01L21/0254 , H01L21/302 , H01L21/3065 , H01L21/7605 , H01L21/76224 , H01L21/76877 , H01L21/8252 , H01L27/0605 , H01L27/085 , H01L29/0642 , H01L29/0649 , H01L29/2003 , H01L29/205 , H01L29/41725 , H01L29/42316 , H01L29/518 , H01L29/66431 , H01L29/66462 , H01L29/7783
摘要: An integrated circuit is disclosed that includes a single channel device having a first portion of a single shared heterostructure overlying a substrate structure in a single channel device area, and a gate contact that is in contact with the first portion of the single shared heterostructure. The integrated circuit also includes a multichannel device comprising a second portion of the single shared heterostructure overlying the substrate structure in a multichannel device area, a barrier layer overlying the second portion of the single shared heterorstructure, and a superlattice structure overlying the barrier layer, the superlattice structure comprising a plurality of heterostructures. An isolation region in the single shared heterostructure electrical isolates the single channel device from the multichannel device.
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公开(公告)号:US09466679B2
公开(公告)日:2016-10-11
申请号:US14459006
申请日:2014-08-13
申请人: Eric J. Stewart , Howell George Henry , Robert S. Howell , Matthew Russell King , Justin Andrew Parke , Bettina Nechay , Harlan Carl Cramer , Karen Marie Renaldo , Ronald G. Freitag
发明人: Eric J. Stewart , Howell George Henry , Robert S. Howell , Matthew Russell King , Justin Andrew Parke , Bettina Nechay , Harlan Carl Cramer , Karen Marie Renaldo , Ronald G. Freitag
IPC分类号: H01L29/06 , H01L29/423 , H01L29/66 , H01L29/778 , H01L29/20
CPC分类号: H01L29/42316 , H01L29/0657 , H01L29/2003 , H01L29/66462 , H01L29/7783
摘要: A device is provided that comprises a first pillar disposed in a first region and overlying a base structure, and a second pillar disposed in a second region and overlying the base structure and being spaced apart from the first pillar by a device region. A bridge is disposed in the device region with a first end connected to the first pillar and a second end connected to the second pillar. The bridge includes a top, sides, and a bottom. The bridge is formed from one or more heterostructures with an undercut opening extending from the bottom to an underlying structure. A four-sided conductive contact wraps around and substantially surrounds the bridge around its top, its sides, and its bottom along at least a portion of its length between the first and second end.
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