Enhancement mode RF device and fabrication method
    1.
    发明授权
    Enhancement mode RF device and fabrication method 失效
    增强型RF器件及其制造方法

    公开(公告)号:US06528405B1

    公开(公告)日:2003-03-04

    申请号:US09506844

    申请日:2000-02-18

    IPC分类号: H01L2128

    摘要: An enhancement mode RF device and method of fabrication includes a stack of compound semiconductor layers, including a central layer defining a device channel, a doped cap layer, and a buffer epitaxially grown on a substrate. Source and drain implant areas, extending at least into the buffer, are formed to define an implant free area in the device channel between the source and drain. Source and drain metal contacts are positioned on an upper surface of the central layer. Several layers of insulation and dielectric are positioned over the device and a gate opening is formed and filled with gate metal. During epitaxial growth, the doped cap layer is tailored with a thickness and a doping to optimize channel performance including gate-drain breakdown voltage and channel resistance.

    摘要翻译: 增强型RF器件和制造方法包括:化合物半导体层的堆叠,包括限定器件沟道的中心层,掺杂的覆盖层和在衬底上外延生长的缓冲层。 形成至少延伸到缓冲器中的源极和漏极注入区域,以在源极和漏极之间的器件沟道中限定无植入区域。 源极和漏极金属触点位于中心层的上表面上。 绝缘和电介质的几层位于器件上方,并形成栅极开口并填充栅极金属。 在外延生长期间,掺杂的覆盖层是通过厚度和掺杂来调整的,以优化沟道性能,包括栅 - 漏击穿电压和沟道电阻。

    Advanced RF enhancement-mode FETs with improved gate properties
    2.
    发明授权
    Advanced RF enhancement-mode FETs with improved gate properties 有权
    先进的RF增强型FET,具有改进的栅极性能

    公开(公告)号:US06893947B2

    公开(公告)日:2005-05-17

    申请号:US10179769

    申请日:2002-06-25

    摘要: A method for fabricating an RF enhancement mode FET (30) having improved gate properties is provided. The method comprises the steps of providing (131) a substrate (31) having a stack of semiconductor layers (32-35) formed thereon, the stack including a cap layer (35) and a central layer (33) defining a device channel, forming (103) a photoresist pattern (58) over the cap layer, thereby defining a masked region and an unmasked region, and, in any order, (a) creating (105) an implant region (36, 37) in the unmasked region, and (b) removing (107) the cap layer from the unmasked region. By forming the implant region and cap region with no overlap, a device with low current leakage may be achieved.

    摘要翻译: 提供了一种制造具有改进的栅极特性的RF增强型FET(30)的方法。 该方法包括以下步骤:提供(131)具有形成在其上的半导体层(32-35)的堆叠的衬底(31),所述堆叠包括限定器件沟道的覆盖层(35)和中心层(33) 在所述盖层上形成(103)光致抗蚀剂图案(58),由此限定掩蔽区域和未掩蔽区域,并且以任何顺序,(a)在所述未掩蔽区域中产生(105)植入区域(36,37) ,和(b)从未掩蔽区域移除(107)盖层。 通过不重叠地形成注入区域和盖子区域,可以实现具有低电流泄漏的装置。

    Multi-gate enhancement mode RF switch and bias arrangement
    3.
    发明授权
    Multi-gate enhancement mode RF switch and bias arrangement 有权
    多栅极增强模式RF开关和偏置布置

    公开(公告)号:US07504677B2

    公开(公告)日:2009-03-17

    申请号:US11092264

    申请日:2005-03-28

    IPC分类号: H01L29/80 H01L21/337

    摘要: Methods and apparatus are provided for RF switches (100, 200). In a preferred embodiment, the apparatus comprises one or more multi-gate n-channel enhancement mode FET transistors (50, 112, 114). When used in pairs (112, 114) each has its source (74, 133) coupled to a first common RF I/O port (116) and drains coupled respectively to second and third RF I/O ports (118, 120), and gates (136, 138), coupled respectively to first and second control terminals (122, 124). The multi-gate regions (66, 68) of the FETs (50) are parallel coupled, spaced-apart and serially arranged between source (72) and drain (76). Lightly doped n-regions (Ldd, Lds) are provided serially arranged between the spaced-apart multi-gate regions (66, 68), the lightly doped n-regions (Ldd, Lds) being separated by more heavily doped n-regions (84). Bias resistances (132, 134) are provided between the sources (72, 133) and control terminals (122, 124) so as to provide a DC path between the control terminals (122, 124) that maintains the source (72, 133) voltage at the proper bias potential for enhancement mode operation.

    摘要翻译: 提供了用于RF开关(100,200)的方法和装置。 在优选实施例中,该装置包括一个或多个多栅极n沟道增强型FET晶体管(50,112,114)。 当成对使用时,每个都具有耦合到第一公共RF I / O端口(116)的源极(74,133)和分别耦合到第二和第三RF I / O端口(118,120)的漏极, 和分别耦合到第一和第二控制端(122,124)的门(136,138)。 FET(50)的多栅极区域(66,68)平行耦合,间隔开并且串联地布置在源极(72)和漏极(76)之间。 轻度掺杂的n区(Ldd,Lds)被串行地布置在间隔开的多栅极区(66,68)之间,轻掺杂的n-区(Ldd,Lds)被更重掺杂的n区分离( 84)。 偏置电阻(132,134)设置在源极(72,133)和控制端子(122,124)之间,以便在维持源极(72,133)和控制端子(122,124)之间提供DC路径, 电压处于适当的偏置电位,用于增强模式操作。

    Enhancement mode transceiver and switched gain amplifier integrated circuit
    4.
    发明授权
    Enhancement mode transceiver and switched gain amplifier integrated circuit 有权
    增强型收发器和开关增益放大器集成电路

    公开(公告)号:US07345545B2

    公开(公告)日:2008-03-18

    申请号:US11092070

    申请日:2005-03-28

    IPC分类号: H03F3/16

    CPC分类号: H03G1/0088

    摘要: Methods and apparatus are provided for RF switches (504, 612) integrated in a monolithic RF transceiver IC (500) and switched gain amplifier (600). Multi-gate n-channel enhancement mode FETs (50, 112, 114, Q1-3, Q4-6) are used with single gate FETs (150), resistors (Rb, Rg, Re, R1-R17) and capacitors (C1-C3) formed by the same manufacturing process. The multiple gates (68) of the FETs (50, 112, 114, Q1-3, Q4-6) are parallel coupled, spaced-apart and serially arranged between source (72) and drain (76). When used in pairs (112, 114) to form a switch (504) for a transceiver (500) each FET has its source (74) coupled to an antenna RF I/O port (116, 501) and drains coupled respectively to second and third RF I/O ports (118, 120; 507, 521) leading to the receiver side (530) or transmitter side (532) of the transceiver (500). The gates (136, 138) are coupled to control ports (122, 124; 503, 505; 606, 608). When used in pairs (Q1-3, Q4-6) to form a variable switched attenuator, the first FET (Q1-3) is a pass device and the second FET (Q4-6) is a shunt device that respectively bridge two series resistors (R1, R2) and block a shunt resistor (R3) of a T-type attenuator.

    摘要翻译: 为集成在单片RF收发器IC(500)和开关增益放大器(600)中的RF开关(504,612)提供了方法和装置。 多栅极n沟道增强型FET(50,112,114,Q 1-3,Q 4-6)与单栅极FET(150),电阻器(Rb,Rg,Re,R 1 -R 17) 和通过相同制造工艺形成的电容器(C 1 -C 3)。 FET(50,112,114,Q1-3,Q4-6)的多个栅极(68)被平行耦合,间隔开并且串联地布置在源极(72)和漏极(76)之间。 当成对使用(112,114)形成用于收发器(500)的开关(504)时,每个FET的源极(74)耦合到天线RF I / O端口(116,501),并且分别耦合到第二 以及通向收发器(500)的接收机侧(530)或发射机侧(532)的第三RF I / O端口(118,120; 507,521)。 门(136,138)被耦合到控制端口(122,124; 503,505; 606,608)。 当成对使用(Q 1 - 3,Q 4 - 6)以形成可变开关衰减器时,第一FET(Q1-3)是通过器件,第二FET(Q 4 - 6)是分流器件, 分别桥接两个串联电阻(R 1,R 2)并阻塞T型衰减器的分流电阻(R 3)。

    Balun transformer with improved harmonic suppression
    6.
    发明授权
    Balun transformer with improved harmonic suppression 有权
    平衡变压器具有改进的谐波抑制

    公开(公告)号:US07683733B2

    公开(公告)日:2010-03-23

    申请号:US12025315

    申请日:2008-02-04

    IPC分类号: H03H7/42 H01P5/00

    摘要: An electronic assembly includes a substrate (66), a balun transformer (42) formed on the substrate (66) and including a first winding (50) and a second winding (52), each having respective first and second ends, and a reaction circuit component (48) formed on the substrate (66) and electrically coupled to the second winding (52) between the first and second ends thereof. The balun transformer (42) and the reaction circuit component (48) jointly form a harmonically suppressed balun transformer having a fundamental frequency, and the reaction circuit component (48) is tuned such that the harmonically suppressed balun transformer resonates at a selected harmonic of the fundamental frequency.

    摘要翻译: 电子组件包括衬底(66),形成在衬底(66)上并包括第一绕组(50)和第二绕组(52)的平衡不平衡变压器(42),每个具有相应的第一和第二端,以及反应 电路部件(48),形成在所述基板(66)上并且在所述第一和第二端之间电连接到所述第二绕组(52)。 平衡 - 不平衡变压器(42)和反应电路部件(48)共同形成具有基频的谐波抑制平衡不平衡变压器,并且调谐反应电路部件(48),使得谐波抑制的平衡不平衡变压器以所选择的谐波谐振 基频

    Method of manufacturing a semiconductor component that includes self-aligning a gate electrode to a field plate
    8.
    发明授权
    Method of manufacturing a semiconductor component that includes self-aligning a gate electrode to a field plate 失效
    制造半导体部件的方法,其包括将栅电极自对准到场板

    公开(公告)号:US06939781B2

    公开(公告)日:2005-09-06

    申请号:US10609106

    申请日:2003-06-27

    摘要: In one embodiment of the invention, a semiconductor component includes a semiconductor substrate (110), a first dielectric layer (120) above the semiconductor substrate, a first ohmic contact region (410) and a second ohmic contact region (420) above the semiconductor substrate, a gate electrode (1120) above the semiconductor substrate and between the first ohmic contact region and the second ohmic contact region, a field plate (210) above the first dielectric layer and between the gate electrode and the second ohmic contact region, a second dielectric layer (310) above the field plate, the first dielectric layer, the first ohmic contact region, and the second ohmic contact region, and a third dielectric layer (910) between the gate electrode and the field plate and not located above the gate electrode or the field plate.

    摘要翻译: 在本发明的一个实施例中,半导体部件包括半导体衬底(110),半导体衬底上方的第一介电层(120),半导体上方的第一欧姆接触区(410)和第二欧姆接触区(420) 衬底,半导体衬底之上和第一欧姆接触区域和第二欧姆接触区域之间的栅极电极(1120),在第一介电层上方以及栅电极和第二欧姆接触区域之间的场板(210), 位于场板上方的第二电介质层(310),第一电介质层,第一欧姆接触区域和第二欧姆接触区域,以及栅电极和场板之间的第三介电层(910) 栅电极或场板。

    BALUN SIGNAL TRANSFORMER AND METHOD OF FORMING
    10.
    发明申请
    BALUN SIGNAL TRANSFORMER AND METHOD OF FORMING 有权
    巴伦信号变换器及其形成方法

    公开(公告)号:US20100026411A1

    公开(公告)日:2010-02-04

    申请号:US12183755

    申请日:2008-07-31

    IPC分类号: H03H7/42

    摘要: A balanced-unbalanced (balun) signal transformer includes an unbalanced port, a balanced port coupled to the unbalanced port, the balanced port comprising a first terminal and a second terminal, a first capacitor coupled to the first terminal, a first inductor coupled to ground and the first capacitor, a second capacitor coupled to the second terminal, and a second inductor coupled to ground and the second capacitor. The transformer may also include a third capacitor coupled to a terminal of the unbalanced port; and a third inductor coupled to the third capacitor and the third terminal.

    摘要翻译: 平衡不平衡(balun)信号变压器包括不平衡端口,耦合到不平衡端口的平衡端口,平衡端口包括第一端子和第二端子,耦合到第一端子的第一电容器,耦合到地的第一电感器 并且第一电容器,耦合到第二端子的第二电容器和耦合到地的第二电感器和第二电容器。 变压器还可以包括耦合到不平衡端口的端子的第三电容器; 以及耦合到所述第三电容器和所述第三端子的第三电感器。