公开(公告)号：US20050281947A1

公开(公告)日：2005-12-22

申请号：US11115214

申请日：2005-04-27

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

IPC分类号： B05B15/12 ,  B05C3/09 ,  B05C9/06 ,  B05C11/10 ,  B05C13/00 ,  B05C15/00 ,  B05D3/12 ,  B65H1/00 ,  C23C2/00 ,  C23C18/16 ,  C23C18/31 ,  C25D17/06 ,  H01L21/00 ,  H01L21/288 ,  H01L21/68 ,  H01L21/683 ,  H01L21/768

CPC分类号： H01L21/288 ,  C23C2/003 ,  C23C18/1619 ,  C23C18/163 ,  C23C18/1642 ,  H01L21/6708 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/76849

摘要： A substrate processing unit, by employing the processing unit to carry out different processings with different processing liquids, can make a reduction in the space for carrying out the entire process of substrate processing and a reduction in the energy necessary for substrate transportation. The substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; an pan surrounding the periphery of the substrate holder; an cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing the top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids; wherein the pan and the cell each have an individual liquid discharge line.

摘要翻译： 基板处理单元通过使用处理单元对不同的处理液进行不同的处理，可以减少用于进行基板处理的整个处理的空间并降低基板输送所需的能量。 基板处理单元包括：用于保持基板的可垂直移动的基板保持器; 围绕衬底保持器的周边的锅; 位于基板保持器下方并在锅内的电池，在其内部具有化学处理部分; 以及能够封闭电池的顶部开口的电池盖，具有用于分开喷射至少两种类型的处理液体的多个喷嘴; 其中所述锅和所述池各自具有单独的液体排出管线。

公开(公告)号：US20090092469A1

公开(公告)日：2009-04-09

申请号：US11996432

申请日：2006-08-25

申请人： Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Ryo Kato

发明人： Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Ryo Kato

IPC分类号： H01L21/677 ,  B08B7/00 ,  C25D17/06

CPC分类号： H01L21/68707 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68728

摘要： To provide a substrate processing unit, a substrate transfer method, a substrate cleansing process unit, and a substrate plating apparatus that make it possible for a substrate carry-in mechanism such as a robot arm to quickly release hold on the substrate after carrying in the substrate so as to shorten the time for holding the substrate and improve throughput. The substrate processing unit 10 includes a substrate holding mechanism 10 for holding the substrate 11 in a specified holding position, and a processing mechanism 32 for applying a specified process to the substrate held with the substrate holding mechanism in which a substrate guide mechanism 20 is provided with a guide pin 15 for guiding the substrate to vicinity of a holding position. The substrate holding mechanism has a plural number of rollers 14 on an outer periphery of the holding position of the substrate, with the plural number of rollers adapted to hold the substrate by supporting the periphery of the substrate from sides thereof in the vicinity of the holding position, and the roller has an integral structure made up of a large diameter portion and a small diameter portion formed above the large diameter portion, with an upper portion of the large diameter portion having a shoulder portion for the substrate in transfer to be temporarily placed on, and with the shoulder portion formed with a sloped surface sloping down toward its periphery.

摘要翻译： 为了提供一种基板处理单元，基板转印方法，基板清洁处理单元和基板电镀设备，其使得诸如机器人臂之类的基板输入机构可以在携带该基板处理单元之后快速地释放保持在基板上 以缩短保持基板的时间并提高生产量。 基板处理单元10包括用于将基板11保持在指定的保持位置的基板保持机构10和用于对被设置有基板引导机构20的基板保持机构保持的基板进行规定处理的处理机构32 具有用于将基板引导到保持位置附近的引导销15。 基板保持机构在基板的保持位置的外周具有多个辊14，多个辊适于通过从保持基板附近的侧面支撑基板的周边来保持基板 并且所述辊具有由形成在所述大直径部分上方的大直径部分和小直径部分构成的整体结构，所述大直径部分的上部具有用于传送的基板的肩部临时放置 并且肩部形成有朝向其周边倾斜的倾斜表面。

公开(公告)号：US07368016B2

公开(公告)日：2008-05-06

申请号：US11115214

申请日：2005-04-27

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

IPC分类号： B05B15/04 ,  B05B7/06 ,  B05C3/00 ,  B05C13/02 ,  B08B3/00 ,  B08B3/02

CPC分类号： H01L21/288 ,  C23C2/003 ,  C23C18/1619 ,  C23C18/163 ,  C23C18/1642 ,  H01L21/6708 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/76849

摘要： A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.

摘要翻译： 基板处理单元包括：用于保持基板的可垂直移动的基板保持器; 围绕衬底保持器的周边的平底锅; 位于基板保持器下方并在锅内的电池，在其内部具有化学处理部分; 以及能够封闭电池的顶部开口的电池盖，具有用于分别喷射至少两种类型的处理液体的多个喷嘴，其中锅和电池单元各自具有单独的液体排出管线。

公开(公告)号：US07735450B2

公开(公告)日：2010-06-15

申请号：US12076834

申请日：2008-03-24

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

IPC分类号： B05C13/02

CPC分类号： H01L21/288 ,  C23C2/003 ,  C23C18/1619 ,  C23C18/163 ,  C23C18/1642 ,  H01L21/6708 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/76849

摘要： A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.

摘要翻译： 基板处理单元包括：用于保持基板的可垂直移动的基板保持器; 围绕衬底保持器的周边的平底锅; 位于基板保持器下方并在锅内的电池，在其内部具有化学处理部分; 以及能够封闭电池的顶部开口的电池盖，具有用于分别喷射至少两种类型的处理液体的多个喷嘴，其中锅和电池单元各自具有单独的液体排出管线。

公开(公告)号：US20080178800A1

公开(公告)日：2008-07-31

申请号：US12076834

申请日：2008-03-24

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

IPC分类号： B05C3/02

CPC分类号： H01L21/288 ,  C23C2/003 ,  C23C18/1619 ,  C23C18/163 ,  C23C18/1642 ,  H01L21/6708 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/76849

摘要： A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.

公开(公告)号：US08225803B2

公开(公告)日：2012-07-24

申请号：US13100484

申请日：2011-05-04

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motojima

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motojima

IPC分类号： B08B13/00

CPC分类号： H01L21/68721 ,  C23C18/163 ,  C23C18/1632 ,  C23C18/1886 ,  C25D7/123 ,  C25D17/001 ,  H01L21/67126 ,  H01L21/67766 ,  Y10S134/901

摘要： A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.

摘要翻译： 基板处理方法和装置可以可靠地执行能够在基板的表面的必要区域中均匀镀覆的预镀处理。 基板处理方法对作为预镀处理的基板的表面进行清洗处理和催化剂赋予处理，然后在基板的赋予催化剂的表面上化学镀金属膜。 在通过催化剂赋予处理赋予催化剂的区域的基板的表面的更宽的区域中进行清洗处理。

公开(公告)号：US07575636B2

公开(公告)日：2009-08-18

申请号：US11455777

申请日：2006-06-20

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

IPC分类号： B05C3/02

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

摘要翻译： 本发明涉及通过将基板浸渍在处理液中而用于电镀基板或加工基板的基板处理装置。 本发明的基板处理装置包括：用于搬入和取出基板的装载/卸载区域; 用于清洁衬底的清洁区域; 以及用于电镀基板的电镀区域。 装载/卸载区域设置有具有多个干用设计的手的基板传送机器人，安装有用于容纳基板的盒的装载端口和用于将基板从面朝上翻转的干式设计的反转机 面对下来

公开(公告)号：US20060243205A1

公开(公告)日：2006-11-02

申请号：US11455777

申请日：2006-06-20

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Daj

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Daj

IPC分类号： B05C3/02 ,  B05C13/00

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

公开(公告)号：US07087117B2

公开(公告)日：2006-08-08

申请号：US10712348

申请日：2003-11-14

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

IPC分类号： B05C5/02 ,  B23H7/00

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

公开(公告)号：US20090291624A1

公开(公告)日：2009-11-26

申请号：US12534465

申请日：2009-08-03

申请人： Seiji KATSUOKA ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

发明人： Seiji KATSUOKA ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

IPC分类号： B24B37/04 ,  B24B41/06

CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。