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公开(公告)号：US07999376B2
公开(公告)日：2011-08-16
申请号：US11814596
申请日：2006-01-25
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L23/552 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/06517 , H01L2225/06527 , H01L2225/06555 , H01L2225/06582 , H01L2924/00014 , H01L2924/09701 , H01L2924/15151 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An object of the present invention is to provide a semiconductor device by packaging a plurality of semiconductor chips three-dimensionally in a smaller thickness, with a smaller footprint, at the lower cost without using any other components and through a simpler manufacturing process of the semiconductor device than with the conventional methods.A flip chip packaging structure is formed by directly connecting a first semiconductor chip (101) reduced in thickness by back grinding and a substrate (105) via a bump electrode (102) to a wiring pattern (106). Also, a second semiconductor chip (103) is formed with an electrode (104) that is higher than the sum of the thickness of the first semiconductor chip (101) and the height of the electrode (102), and the electrode (104) is directly connected to the wiring pattern (106) on the substrate (105), whereby the most-compact three-dimensional semiconductor packaged device is produced.
摘要翻译： 本发明的目的是提供一种半导体器件，其通过以更低的成本在更小的厚度下以更小的厚度三维地封装多个半导体芯片，而不使用任何其它部件，并且通过半导体的更简单的制造工艺 装置比常规方法。 倒装芯片封装结构通过直接连接通过背面研磨将厚度减小的第一半导体芯片（101）和基板（105）经由凸块电极（102）直接连接到布线图案（106）而形成。 此外，第二半导体芯片（103）形成有电极（104），其高于第一半导体芯片（101）的厚度和电极（102）的高度之和，并且电极（104） 直接连接到基板（105）上的布线图案（106），由此制造最紧凑的三维半导体封装装置。
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公开(公告)号：US20080265436A1
公开(公告)日：2008-10-30
申请号：US11814596
申请日：2006-01-25
CPC分类号： H01L25/0657 , H01L23/552 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/06517 , H01L2225/06527 , H01L2225/06555 , H01L2225/06582 , H01L2924/00014 , H01L2924/09701 , H01L2924/15151 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An object of the present invention is to provide a semiconductor device by packaging a plurality of semiconductor chips three-dimensionally in a smaller thickness, with a smaller footprint, at the lower cost without using any other components and through a simpler manufacturing process of the semiconductor device than with the conventional methods.A flip chip packaging structure is formed by directly connecting a first semiconductor chip (101) reduced in thickness by back grinding and a substrate (105) via a bump electrode (102) to a wiring pattern (106). Also, a second semiconductor chip (103) is formed with an electrode (104) that is higher than the sum of the thickness of the first semiconductor chip (101) and the height of the electrode (102), and the electrode (104) is directly connected to the wiring pattern (106) on the substrate (105), whereby the most-compact three-dimensional semiconductor packaged device is produced.
摘要翻译： 本发明的目的是提供一种半导体器件，其通过以更低的成本在更小的厚度下以更小的厚度三维地封装多个半导体芯片，而不使用任何其它部件，并且通过半导体的更简单的制造工艺 装置比常规方法。 倒装芯片封装结构通过直接连接通过背面研磨将厚度减小的第一半导体芯片（101）和基板（105）经由凸块电极（102）直接连接到布线图案（106）而形成。 此外，第二半导体芯片（103）形成有电极（104），其高于第一半导体芯片（101）的厚度和电极（102）的高度之和，并且电极（104） 直接连接到基板（105）上的布线图案（106），由此制造最紧凑的三维半导体封装装置。
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公开(公告)号：US20090178837A1
公开(公告)日：2009-07-16
申请号：US12093511
申请日：2006-02-20
IPC分类号： H05K1/14
CPC分类号： H05K3/361 , H05K1/117 , H05K3/323 , H05K2201/09663 , H05K2201/09781 , H05K2203/167
摘要： The present invention provides a circuit board connecting structure enabled to obtain the reliable connection between circuit patterns by restricting the elongation of a flexible base material even when connecting portions are arranged in a face-to-face configuration and are press-contacted with each other.A circuit board connecting structure 10 includes a first circuit board 11, and a second circuit board 12. The circuit board connecting structure 10 is configured so that when a first connecting portion 13 and a second connecting portion 14 are sandwiched by a pair of pressing jigs 18, 19 and are press-contacted with each other, one 23 of first outer dummy terminals is accommodated between columns of ones 33, 33 of second outer dummy terminals, while the other first outer dummy terminal 24 is accommodated between columns of the other ones 34, 34 of the second outer dummy terminals.
摘要翻译： 本发明提供了一种电路板连接结构，能够通过限制柔性基底材料的伸长率来获得电路图案之间的可靠连接，即使当连接部分以面对面构造布置并且彼此压接时。 电路板连接结构10包括第一电路板11和第二电路板12.电路板连接结构10被构造成使得当第一连接部13和第二连接部14被一对按压夹具夹持时 如图18,19所示，彼此压接，第二外部虚拟端子中的一个第二外部虚拟端子中的一个23被容纳在第二外部虚拟端子的33,33的列之间，而另一个第一外部虚拟端子24容纳在另一个 34,34的第二外部虚拟终端。
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公开(公告)号：US08054646B2
公开(公告)日：2011-11-08
申请号：US12093511
申请日：2006-02-20
CPC分类号： H05K3/361 , H05K1/117 , H05K3/323 , H05K2201/09663 , H05K2201/09781 , H05K2203/167
摘要： The present invention provides a circuit board connecting structure enabled to obtain the reliable connection between circuit patterns by restricting the elongation of a flexible base material even when connecting portions are arranged in a face-to-face configuration and are press-contacted with each other. A circuit board connecting structure 10 includes a first circuit board 11, and a second circuit board 12. The circuit board connecting structure 10 is configured so that when a first connecting portion 13 and a second connecting portion 14 are sandwiched by a pair of pressing jigs 18, 19 and are press-contacted with each other, one 23 of first outer dummy terminals is accommodated between columns of ones 33, 33 of second outer dummy terminals, while the other first outer dummy terminal 24 is accommodated between columns of the other ones 34, 34 of the second outer dummy terminals.
摘要翻译： 本发明提供了一种电路板连接结构，能够通过限制柔性基底材料的伸长率来获得电路图案之间的可靠连接，即使当连接部分以面对面构造布置并且彼此压接时。 电路板连接结构10包括第一电路板11和第二电路板12.电路板连接结构10被构造成使得当第一连接部13和第二连接部14被一对按压夹具夹持时 如图18,19所示，彼此压接，第二外部虚拟端子中的一个第二外部虚拟端子中的一个23被容纳在第二外部虚拟端子的33,33的列之间，而另一个第一外部虚拟端子24容纳在另一个 34，34的第二外部虚拟终端。
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5.发明授权Connecting structure of circuit board, connecting part of circuit board and electronic device 失效电路板的连接结构，电路板的连接部分和电子设备公开(公告)号：US08018737B2
公开(公告)日：2011-09-13
申请号：US12097960
申请日：2005-12-22
CPC分类号： H05K3/361 , H05K3/3494 , H05K2201/062 , H05K2201/09145 , H05K2203/0278
摘要： The invention provides a connecting structure of a circuit board, a connecting part of the circuit board, and an electronic device capable of alleviating a temperature difference between the connecting parts under hot pressure welding. A connecting structure 10 of a circuit board comprises a first circuit board 11 and a second circuit board 12, with a first connecting part 15 and a second connecting part 16 opposedly disposed via an adhesive 13. The first connecting part 15 and the second connecting part 16 are pinched by a pair of pressurizing jigs 20 and subjected to hot pressure welding so that first circuit patterns 17 and second circuit patterns 18 are in contact with each other. In the connecting structure 10 of the circuit board, the first circuit board 11 is a soft base material 21, and a heat-insulating layer 28, having lower thermal conductivity than the soft base material 21, is provided on only a part 27 of the region corresponding to the first connecting part 15 on the rear surface 21B of the soft base material 21.
摘要翻译： 本发明提供了一种电路板的连接结构，电路板的连接部分和能够在热压焊接下减轻连接部件之间的温差的电子设备。 电路板的连接结构10包括第一电路板11和第二电路板12，第一连接部分15和第二连接部分16经由粘合剂13相对设置。第一连接部分15和第二连接部分 16被一对加压夹具20夹紧，并进行热压焊，使得第一电路图案17和第二电路图案18彼此接触。 在电路基板的连接结构体10中，第一电路基板11是软质基材21，仅在软质基材21的热传导率较低的隔热层28上设置 对应于软基材21的背面21B上的第一连接部15的区域。
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6.发明申请Connecting Structure Of Circuit Board, Connecting Part of Circuit Board and Electronic Device 失效电路板，电路板和电子设备连接部分的连接结构公开(公告)号：US20090176384A1
公开(公告)日：2009-07-09
申请号：US12097960
申请日：2005-12-22
CPC分类号： H05K3/361 , H05K3/3494 , H05K2201/062 , H05K2201/09145 , H05K2203/0278
摘要： The invention provides a connecting structure of a circuit board, a connecting part of the circuit board, and an electronic device capable of alleviating a temperature difference between the connecting parts under hot pressure welding. A connecting structure 10 of a circuit board comprises a first circuit board 11 and a second circuit board 12, with a first connecting part 15 and a second connecting part 16 opposedly disposed via an adhesive 13. The first connecting part 15 and the second connecting part 16 are pinched by a pair of pressurizing jigs 20 and subjected to hot pressure welding so that first circuit patterns 17 and second circuit patterns 18 are in contact with each other. In the connecting structure 10 of the circuit board, the first circuit board 11 is a soft base material 21, and a heat-insulating layer 28, having lower thermal conductivity than the soft base material 21, is provided on only a part 27 of the region corresponding to the first connecting part 15 on the rear surface 21B of the soft base material 21.
摘要翻译： 本发明提供了一种电路板的连接结构，电路板的连接部分和能够在热压焊接下减轻连接部件之间的温差的电子设备。 电路板的连接结构10包括第一电路板11和第二电路板12，第一连接部分15和第二连接部分16经由粘合剂13相对设置。第一连接部分15和第二连接部分 16被一对加压夹具20夹紧，并进行热压焊，使得第一电路图案17和第二电路图案18彼此接触。 在电路基板的连接结构体10中，第一电路基板11是软质基材21，仅在软质基材21的热传导率较低的隔热层28上设置 对应于软基材21的背面21B上的第一连接部15的区域。
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7.发明授权Information processing apparatus, information processing method, program, and recording medium 失效信息处理装置，信息处理方法，程序和记录介质公开(公告)号：US08774603B2
公开(公告)日：2014-07-08
申请号：US12127269
申请日：2008-05-27
申请人： Toru Miyake , Kei Hiraizumi , Yoshinori Takagi , Masato Akao , Yasunobu Node , Yoshihito Fujiwara , Kazutaka Ando , Naoki Kobayashi , Michimasa Obana , Yoshihiro Takahashi , Takeyuki Fujii , Masanori Machimura , Toru Nakagawa , Yusuke Kajio , Yasuhiro Fujimori , Tetsujiro Kondo
发明人： Toru Miyake , Kei Hiraizumi , Yoshinori Takagi , Masato Akao , Yasunobu Node , Yoshihito Fujiwara , Kazutaka Ando , Naoki Kobayashi , Michimasa Obana , Yoshihiro Takahashi , Takeyuki Fujii , Masanori Machimura , Toru Nakagawa , Yusuke Kajio , Yasuhiro Fujimori , Tetsujiro Kondo
IPC分类号： H04N5/761
CPC分类号： H04N5/85 , G11B27/034 , H04N9/8205
摘要： An information processing apparatus includes reproduction control means for controlling reproduction of a first parameter in order to reproduce an edit applied to a first image, generation means for generating a second parameter from a plurality of first parameters reproduced by the reproduction control means, and edit means for editing the first image based on the second parameter generated by the generation means, and generating a second image.
摘要翻译： 一种信息处理装置，包括：再现控制装置，用于控制第一参数的再现以再现应用于第一图像的编辑;生成装置，用于根据由再现控制装置再现的多个第一参数产生第二参数;编辑装置 用于基于由生成装置生成的第二参数来编辑第一图像，以及生成第二图像。
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8.发明申请公开(公告)号：US20100026511A1
公开(公告)日：2010-02-04
申请号：US12507951
申请日：2009-07-23
IPC分类号： G06F13/42
CPC分类号： G06F11/0751 , G06F11/079
摘要： An information processing apparatus includes a pattern extraction unit, a rule extraction unit, and a reflection information generation unit. The pattern extraction unit is configured to extract an operation pattern of each of users from operation history information obtained from a plurality of devices to be operated, the operation history information at least including information regarding operation histories of the users and device states. The rule extraction unit is configured to extract incorrect operation patterns from the operation patterns extracted by the pattern extraction unit, the incorrect operation patterns being operation patterns caused by incorrect operations performed by the users. The reflection information generation unit is configured to identify a cause of the incorrect operations from types of the incorrect operation patterns and generate, based on the cause of the incorrect operations, reflection information configured to be reflected in functions of the devices to be operated.
摘要翻译： 信息处理装置包括图案提取单元，规则提取单元和反射信息生成单元。 模式提取单元被配置为从要被操作的多个设备获得的操作历史信息中提取每个用户的操作模式，所述操作历史信息至少包括关于用户的操作历史和设备状态的信息。 规则提取单元被配置为从由模式提取单元提取的操作模式中提取不正确的操作模式，错误的操作模式是由用户执行的不正确操作引起的操作模式。 反射信息生成单元被配置为根据不正确的操作模式的类型来识别错误操作的原因，并且基于错误操作的原因，生成被配置为反映在要被操作的设备的功能中的反射信息。
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公开(公告)号：US20050240296A1
公开(公告)日：2005-10-27
申请号：US11158880
申请日：2005-06-22
CPC分类号： H04R5/04 , G10L19/02 , G11C7/16 , G11C2207/16 , H04R1/1016 , H04R1/1041 , H04R5/033 , H04R2201/103 , H04R2430/03
摘要： A small-sized audio signal reproducing apparatus for hearing reproduced audio signals with the aid of a headphone is disclosed. Digitized and compression encoded audio signals, stored in a semiconductor memory, are read out so as to undergo a decoding operation, which is an inverse operation to compression encoding, to reproduce the audio signals, and the reproduced signals are heard by the headphone. The apparatus may be significantly reduced in size and weight as compared to the apparatus in which a tape or a disk is used as the recording medium.
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公开(公告)号：US06695477B1
公开(公告)日：2004-02-24
申请号：US08747910
申请日：1996-11-12
IPC分类号： H04R110
CPC分类号： H04R1/1041 , G11C7/16 , H04R1/1008 , H04R1/1016 , H04R5/033 , H04R2201/103
摘要： A small-sized audio signal reproducing apparatus for hearing reproduced audio signals with the aid of a headphone is disclosed. Digitized and compression encoded audio signals, stored in a semiconductor memory, are read out so as to undergo a decoding operation, which is an inverse operation to compression encoding, to reproduce the audio signals, and the reproduced signals are heard by the headphone. The apparatus may be significantly reduced in size and weight as compared to the apparatus in which a tape or a disk is used as the recording medium.
摘要翻译： 公开了一种借助于耳机用于听到再现的音频信号的小尺寸音频信号再现装置。 存储在半导体存储器中的数字化和压缩编码的音频信号被读出，以便进行与压缩编码相反的操作的解码操作，以再现音频信号，再现的信号由耳机听到。 与使用带或盘作为记录介质的装置相比，该装置的尺寸和重量可以显着减小。
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