公开(公告)号：US20070075324A1

公开(公告)日：2007-04-05

申请号：US11633566

申请日：2006-12-05

申请人： Masanori Minamio ,  Eizou Fujii ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Eizou Fujii ,  Toshiyuki Fukuda

IPC分类号： H01L33/00

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/18 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An optical device according to the present invention includes a device substrate, a translucent member, an optical element chip and a conductive portion. On a surface of the device substrate, an opening is provided so as to extend substantially in the vertical direction with respect to a surface of the device substrate and pass through the device substrate, the translucent member is provided so as to cover a first opening mouth of the opening, and the optical element chip is provided so as to cover the other opening mouth thereof. Part of the conductive portion is buried in the device substrate. The outline of the first opening mouth has a point-asymmetrical shape with respect to an approximate center point of the first opening mouth.

摘要翻译： 根据本发明的光学装置包括器件基板，透光部件，光学元件芯片和导电部分。 在器件基板的表面上，设置有开口部，其大致相对于器件基板的表面在垂直方向上延伸并穿过器件基板，所述透光部件设置成覆盖第一开口 并且光学元件芯片设置成覆盖其另一个开口。 导电部分的一部分被埋在器件衬底中。 第一开口的轮廓相对于第一开口的近似中心点具有点对称的形状。

公开(公告)号：US07166908B2

公开(公告)日：2007-01-23

申请号：US11244083

申请日：2005-10-06

申请人： Masanori Minamio ,  Eizou Fujii ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Eizou Fujii ,  Toshiyuki Fukuda

IPC分类号： H01L23/02

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/18 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An optical device according to the present invention includes a device substrate, a translucent member, an optical element chip and a conductive portion. On a surface of the device substrate, an opening is provided so as to extend substantially in the vertical direction with respect to a surface of the device substrate and pass through the device substrate, the translucent member is provided so as to cover a first opening mouth of the opening, and the optical element chip is provided so as to cover the other opening mouth thereof. Part of the conductive portion is buried in the device substrate. The outline of the first opening mouth has a point-asymmetrical shape with respect to an approximate center point of the first opening mouth.

公开(公告)号：US20060108656A1

公开(公告)日：2006-05-25

申请号：US11244083

申请日：2005-10-06

申请人： Masanori Minamio ,  Eizou Fujii ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Eizou Fujii ,  Toshiyuki Fukuda

IPC分类号： H01L31/0203

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/18 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An optical device according to the present invention includes a device substrate, a translucent member, an optical element chip and a conductive portion. On a surface of the device substrate, an opening is provided so as to extend substantially in the vertical direction with respect to a surface of the device substrate and pass through the device substrate, the translucent member is provided so as to cover a first opening mouth of the opening, and the optical element chip is provided so as to cover the other opening mouth thereof. Part of the conductive portion is buried in the device substrate. The outline of the first opening mouth has a point-asymmetrical shape with respect to an approximate center point of the first opening mouth.

摘要翻译： 根据本发明的光学装置包括器件基板，透光部件，光学元件芯片和导电部分。 在器件基板的表面上，设置有开口部，其大致相对于器件基板的表面在垂直方向上延伸并穿过器件基板，所述透光部件设置成覆盖第一开口 并且设置光学元件芯片以覆盖其另一个开口。 导电部分的一部分被埋在器件衬底中。 第一开口的轮廓相对于第一开口的近似中心点具有点对称的形状。

公开(公告)号：US07595540B2

公开(公告)日：2009-09-29

申请号：US11488062

申请日：2006-07-18

申请人： Toshiyuki Fukuda ,  Eizou Fujii ,  Yutaka Fukai ,  Yutaka Harada ,  Kiyokazu Itoi

发明人： Toshiyuki Fukuda ,  Eizou Fujii ,  Yutaka Fukai ,  Yutaka Harada ,  Kiyokazu Itoi

IPC分类号： H01L27/14 ,  H01L31/00

CPC分类号： H01L27/14618 ,  B81B7/0077 ,  B81C2203/0109 ,  B81C2203/058 ,  H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48997 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/16788 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device including a package (2) having a plurality of wall portions (9a) and a plurality of conductor portions (4), a semiconductor element such as a solid-state image pickup device (1) mounted in an internal space of the base, thin metal wires (5) electrically connecting the semiconductor element and the conductor portions (4) between the wall portions (9a), a resin sealing material (7) implanted in the spaces between the wall portions (9a), and a closing member such as a cover glass (6). The region for connecting the thin metal wires (5) and the wall portion (9a) region overlap each other, so that the device can be reduced in size and in height. The cover glass (6) can not move easily from the correct position because the wall portions (9a) serve as supporting columns, thereby improving the yield.

摘要翻译： 一种半导体器件，包括具有多个壁部分（9a）和多个导体部分（4）的封装（2），诸如固态图像拾取器件（1）的半导体元件，其安装在 电连接半导体元件和壁部分之间的导体部分（4）的薄金属线（5），植入在壁部分（9a）之间的空间中的树脂密封材料（7） 诸如盖玻璃（6）的构件。 用于连接细金属丝（5）和壁部（9a）区域的区域彼此重叠，使得该装置的尺寸和高度可以减小。 由于壁部（9a）作为支柱，因此盖玻璃（6）不能容易地从正确的位置移动，从而提高产量。

公开(公告)号：US20070018301A1

公开(公告)日：2007-01-25

申请号：US11488062

申请日：2006-07-18

申请人： Toshiyuki Fukuda ,  Eizou Fujii ,  Yutaka Fukai ,  Yutaka Harada ,  Kiyokazu Itoi

发明人： Toshiyuki Fukuda ,  Eizou Fujii ,  Yutaka Fukai ,  Yutaka Harada ,  Kiyokazu Itoi

IPC分类号： H01L23/02

CPC分类号： H01L27/14618 ,  B81B7/0077 ,  B81C2203/0109 ,  B81C2203/058 ,  H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48997 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/16788 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device including a package (2) having a plurality of wall portions (9a) and a plurality of conductor portions (4), a semiconductor element such as a solid-state image pickup device (1) mounted in an internal space of the base, thin metal wires (5) electrically connecting the semiconductor element and the conductor portions (4) between the wall portions (9a), a resin sealing material (7) implanted in the spaces between the wall portions (9a), and a closing member such as a cover glass (6). The region for connecting the thin metal wires (5) and the wall portion (9a) region overlap each other, so that the device can be reduced in size and in height. The cover glass (6) can not move easily from the correct position because the wall portions (9a) serve as supporting columns, thereby improving the yield.

摘要翻译： 一种半导体器件，包括具有多个壁部分（9a）和多个导体部分（4）的封装（2），诸如固态图像拾取器件（1）的半导体元件，其安装在 所述底座，将所述半导体元件与所述壁部（9a）之间的所述导体部（4）电连接的薄金属线（5），植入在所述壁部（9a）之间的空间中的树脂密封材料（7） 以及诸如盖玻璃（6）的封闭构件。 用于连接细金属丝（5）和壁部（9a）区域的区域彼此重叠，使得该装置的尺寸和高度可以减小。 由于壁部（9a）用作支柱，因此盖玻璃（6）不能容易地从正确的位置移动，从而提高产量。

公开(公告)号：US06903375B1

公开(公告)日：2005-06-07

申请号：US09613795

申请日：2000-07-11

申请人： Eizou Fujii

发明人： Eizou Fujii

IPC分类号： H01L21/00 ,  H01L23/04 ,  H01L27/14 ,  H01L27/15 ,  H01L31/12 ,  H04N5/335 ,  H04N5/361 ,  H01L33/00

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2924/0002 ,  H01L2924/00

摘要： Through holes are preformed in a ceramic sheet to form recessed portions at corners or side ends of a package 2 used for a solid-state image device. The package is positioned by allowing projections 52, 53, and 54 of a positioning jig 51 to come into contact with end faces 5 and 6 in the recessed portions along their shapes. The accuracy in combining a solid-state image element and a lens block is improved by using a method of positioning a package in which burrs caused when the package is produced by dividing a ceramic baked product do not affect the accuracy.

摘要翻译： 通孔在陶瓷片中预成型，以形成用于固态成像装置的封装2的拐角或侧端的凹部。 通过允许定位夹具51的突起52,53和54沿其形状在凹部中与端面5和6接触来定位封装。 通过使用定位包装的方法来提高组合固态图像元件和透镜块的精度，其中通过分割陶瓷烘焙产品来生产包装时产生的毛刺不会影响精度。