公开(公告)号：US20080001240A1

公开(公告)日：2008-01-03

申请号：US11710571

申请日：2007-02-26

申请人： Masanori Minamio ,  Tetsumasa Maruo ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Tetsumasa Maruo ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

IPC分类号： H01L31/0203 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L27/14683 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455 ,  H01L2924/20752

摘要： A solid state image pickup device 1 includes a substrate 10 on which a solid state image pickup element 14 is mounted and a transparent component 11. A polymerization initiator for bonding the substrate 10 and the transparent component 11 is onium salt having a halogen-containing aromatic compound as an anion.

摘要翻译： 固态图像拾取装置1包括其上安装有固态图像拾取元件14的基板10和透明部件11。 用于接合基板10和透明部件11的聚合引发剂是具有含卤素的芳族化合物作为阴离子的鎓盐。

公开(公告)号：US20090140405A1

公开(公告)日：2009-06-04

申请号：US12210490

申请日：2008-09-15

申请人： Tetsumasa Maruo ,  Masanori Minamio ,  Kiyokazu Itoi

发明人： Tetsumasa Maruo ,  Masanori Minamio ,  Kiyokazu Itoi

IPC分类号： H01L23/02

CPC分类号： H01L23/10 ,  H01L23/055 ,  H01L24/45 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes: a semiconductor element; a package body having the semiconductor element bonded inside thereof and electrically connected to the semiconductor element; a lid-like member covering the semiconductor element, and bonded to the package body to form a hollow structure; and a bonding member for bonding the package body and the lid-like member to each other. The bonding member is a resin adhesive containing an epoxy resin, a polymerization initiator, and a filling material, and a content of the filling material in the bonding member is 30 wt % to 60 wt %.

摘要翻译： 半导体器件包括：半导体元件; 封装体，其内部具有半导体元件，并与半导体元件电连接; 覆盖半导体元件的盖状构件，并且结合到封装主体以形成中空结构; 以及用于将封装体和盖状构件彼此接合的接合构件。 接合部件是含有环氧树脂，聚合引发剂和填充材料的树脂粘合剂，接合部件中的填充材料的含量为30重量％〜60重量％。

公开(公告)号：US20080185603A1

公开(公告)日：2008-08-07

申请号：US11968763

申请日：2008-01-03

申请人： Kiyokazu Itoi ,  Toshiyuki Fukuda ,  Yoshiki Takayama ,  Tetsushi Nishio ,  Tetsumasa Maruo

发明人： Kiyokazu Itoi ,  Toshiyuki Fukuda ,  Yoshiki Takayama ,  Tetsushi Nishio ,  Tetsumasa Maruo

IPC分类号： H01L33/00 ,  H01L31/0203 ,  H01L31/18

CPC分类号： A61B1/05 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14687 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H04N5/2251 ,  H04N5/2252 ,  H04N5/2254 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical device is equipped with a light receiving region 16a and a peripheral circuit region 22 located around the light receiving region 16a on a major surface of an light receiving element 11a; electrodes for external connection 15 electrically connected to the peripheral circuit region 22 formed on a back surface opposite to the major surface of the light receiving element 11a; a transparent member 12 covering the light receiving region 16a adhered on the major surface of the light receiving element 11a with a light-transmitting adhesive 13; and a molding resin 14 for coating side surfaces of the transparent member 12 and the major surface of the light receiving element 11a excluding the region covered with the transparent member 12.

摘要翻译： 光学装置配备有光接收区域16a和在光接收元件11a的主表面上的光接收区域16a周围的外围电路区域22; 电连接到形成在与光接收元件11a的主表面相反的背面上的外围电路区域22的外部连接电极15; 覆盖受光元件11a的主表面上的光接收区域16a的透光构件12，其具有透光性粘合剂13; 以及用于涂覆透明构件12的侧表面和光接收元件11a的主表面的模制树脂14，除了被透明构件12覆盖的区域。

公开(公告)号：US08455902B2

公开(公告)日：2013-06-04

申请号：US13193075

申请日：2011-07-28

申请人： Kiyokazu Itoi ,  Toshiyuki Fukuda ,  Yoshiki Takayama ,  Tetsushi Nishio ,  Tetsumasa Maruo

发明人： Kiyokazu Itoi ,  Toshiyuki Fukuda ,  Yoshiki Takayama ,  Tetsushi Nishio ,  Tetsumasa Maruo

IPC分类号： H01L31/0203

CPC分类号： A61B1/05 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14687 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H04N5/2251 ,  H04N5/2252 ,  H04N5/2254 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical device is equipped with a light receiving region 16a and a peripheral circuit region 22 located around the light receiving region 16a on a major surface of an light receiving element 11a; electrodes for external connection 15 electrically connected to the peripheral circuit region 22 formed on a back surface opposite to the major surface of the light receiving element 11a; a transparent member 12 covering the light receiving region 16a adhered on the major surface of the light receiving element 11a with a light-transmitting adhesive 13; and a molding resin 14 for coating side surfaces of the transparent member 12 and the major surface of the light receiving element 11a excluding the region covered with the transparent member 12.

摘要翻译： 光学装置配备有光接收区域16a和位于光接收元件11a的主表面上的光接收区域16a周围的外围电路区域22; 电连接到形成在与光接收元件11a的主表面相反的背面上的外围电路区域22的外部连接用电极15; 透明构件12，用透光性粘接剂13覆盖粘接在受光元件11a的主表面上的受光区域16a; 以及用于涂覆透明构件12的侧表面和除了透明构件12覆盖的区域之外的光接收元件11a的主表面的模塑树脂14。

公开(公告)号：US08013350B2

公开(公告)日：2011-09-06

申请号：US11968763

申请日：2008-01-03

申请人： Kiyokazu Itoi ,  Toshiyuki Fukuda ,  Yoshiki Takayama ,  Tetsushi Nishio ,  Tetsumasa Maruo

发明人： Kiyokazu Itoi ,  Toshiyuki Fukuda ,  Yoshiki Takayama ,  Tetsushi Nishio ,  Tetsumasa Maruo

IPC分类号： H01L31/0203

CPC分类号： A61B1/05 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14687 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H04N5/2251 ,  H04N5/2252 ,  H04N5/2254 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical device is equipped with a light receiving region 16a and a peripheral circuit region 22 located around the light receiving region 16a on a major surface of an light receiving element 11a; electrodes for external connection 15 electrically connected to the peripheral circuit region 22 formed on a back surface opposite to the major surface of the light receiving element 11a; a transparent member 12 covering the light receiving region 16a adhered on the major surface of the light receiving element 11a with a light-transmitting adhesive 13; and a molding resin 14 for coating side surfaces of the transparent member 12 and the major surface of the light receiving element 11a excluding the region covered with the transparent member 12.

摘要翻译： 光学装置配备有光接收区域16a和位于光接收元件11a的主表面上的光接收区域16a周围的外围电路区域22; 电连接到形成在与光接收元件11a的主表面相反的背面上的外围电路区域22的外部连接用电极15; 透明构件12，用透光性粘接剂13覆盖粘接在受光元件11a的主表面上的受光区域16a; 以及用于涂覆透明构件12的侧表面和除了透明构件12覆盖的区域之外的光接收元件11a的主表面的模塑树脂14。

公开(公告)号：US08080855B2

公开(公告)日：2011-12-20

申请号：US12407837

申请日：2009-03-20

申请人： Tetsumasa Maruo ,  Masanori Minamio ,  Satoru Waga ,  Tetsushi Nishio

发明人： Tetsumasa Maruo ,  Masanori Minamio ,  Satoru Waga ,  Tetsushi Nishio

IPC分类号： H01L29/93

CPC分类号： H01L33/483 ,  H01L27/14618 ,  H01L27/14685 ,  H01L31/0203 ,  H01L33/52 ,  H01L33/58 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to the present invention, a protective seal S1 for protecting a transparent member 11 is composed of an organic base 16, adhesive layers 17, and a second adhesive layer 18 having low adhesion. The adhesive layers 17 are provided only on edges corresponding, on the organic base 16, to sides 11b of the transparent member and the second adhesive layer 18 is provided on a portion corresponding, on the organic base 16, to a surface 11a of the transparent member. The organic base 16 is fixed to the sides 11b and the surface 11a of the transparent member 11 with the adhesive layers 17 and 18.

摘要翻译： 根据本发明，用于保护透明构件11的保护密封件S1由有机基底16，粘合剂层17和具有低粘合力的第二粘合剂层18组成。 粘合剂层17仅设置在有机基底16上的与透明构件的侧面11b对应的边缘上，并且第二粘合剂层18设置在与有机基底16对应的部分上的透明构件的表面11a上 会员。 有机基底16用粘合剂层17和18固定到透明构件11的侧面11b和表面11a。

公开(公告)号：US20090236613A1

公开(公告)日：2009-09-24

申请号：US12407837

申请日：2009-03-20

申请人： Tetsumasa Maruo ,  Masanori Minamio ,  Satoru Waga ,  Tetsushi Nishio

发明人： Tetsumasa Maruo ,  Masanori Minamio ,  Satoru Waga ,  Tetsushi Nishio

IPC分类号： H01L33/00 ,  H01L21/50

CPC分类号： H01L33/483 ,  H01L27/14618 ,  H01L27/14685 ,  H01L31/0203 ,  H01L33/52 ,  H01L33/58 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to the present invention, a protective seal S1 for protecting a transparent member 11 is composed of an organic base 16, adhesive layers 17, and a second adhesive layer 18 having low adhesion. The adhesive layers 17 are provided only on edges corresponding, on the organic base 16, to sides 11b of the transparent member and the second adhesive layer 18 is provided on a portion corresponding, on the organic base 16, to a surface 11a of the transparent member. The organic base is fixed to the sides 11b and the surface 11a of the transparent member 11 with the adhesive layers 17 and 18.

摘要翻译： 根据本发明，用于保护透明构件11的保护密封件S1由有机基底16，粘合剂层17和具有低粘合力的第二粘合剂层18组成。 粘合剂层17仅设置在有机基底16上的与透明构件的侧面11b对应的边缘上，并且第二粘合剂层18设置在与有机基底16对应的部分上的透明构件的表面11a上 会员。 有机基底用粘合剂层17和18固定在透明构件11的侧面11b和表面11a上。