公开(公告)号：US20100017080A1

公开(公告)日：2010-01-21

申请号：US12424027

申请日：2009-04-15

申请人： Masanori SHIMIZU ,  Ryuji Chida ,  Takashi Yumoto ,  Kenichi Yamaguchi

发明人： Masanori SHIMIZU ,  Ryuji Chida ,  Takashi Yumoto ,  Kenichi Yamaguchi

IPC分类号： G06F19/00 ,  F16H61/662

CPC分类号： F16H61/66272 ,  F16H59/14 ,  F16H59/44 ,  F16H2059/446 ,  Y10T477/60 ,  Y10T477/619 ,  Y10T477/6237

摘要： A control apparatus for a continuously variable transmission includes a clamping force increase portion. The continuously variable transmission includes a pair of a primary pulley and a secondary pulley on which a transmission belt is wound. A shift of the continuously variable transmission is performed by changing effective diameters of the primary pulley and the secondary pulley. The clamping force increase portion increases a belt clamping force when it is determined that a torque capacity is decreased by determining that drive power input to the primary pulley is decreased by an amount equal to or larger than a predetermined amount while the secondary pulley is in a stopped state or a substantially stopped state, as compared to when it is determined that the torque capacity is not decreased.

摘要翻译： 用于无级变速器的控制装置包括夹紧力增大部分。 无级变速器包括一对初级带轮和次级带轮，其上缠绕有传动带。 通过改变主滑轮和次滑轮的有效直径来执行无级变速器的换档。 当通过确定输入到主滑轮的驱动功率减小等于或大于预定量的量来确定转矩容量被降低时，夹紧力增大部分增加皮带夹紧力，而次滑轮处于 与确定转矩容量没有降低的情况相比，停止状态或基本停止状态。

公开(公告)号：US20060160409A1

公开(公告)日：2006-07-20

申请号：US11277952

申请日：2006-03-30

申请人： Masanori SHIMIZU ,  Tadashi YANO ,  Tatsumi SETOMOTO ,  Nobuyuki Matsui ,  Tetsushi TAMURA

发明人： Masanori SHIMIZU ,  Tadashi YANO ,  Tatsumi SETOMOTO ,  Nobuyuki Matsui ,  Tetsushi TAMURA

IPC分类号： H01R3/00

CPC分类号： F21V29/70 ,  F21K9/23 ,  F21L4/00 ,  F21L4/005 ,  F21L4/027 ,  F21S2/00 ,  F21S6/00 ,  F21S6/003 ,  F21V7/0083 ,  F21V19/003 ,  F21V19/045 ,  F21Y2103/33 ,  F21Y2105/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/20 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/64 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01R12/714 ,  H01R33/225 ,  H05B33/0803 ,  H05B33/0821 ,  H05B33/0842 ,  H05B33/0863 ,  H05K1/05 ,  H05K1/112 ,  H05K1/117 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2224/05599

摘要： An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

摘要翻译： LED照明装置包括至少一个连接器和照明驱动电路。 连接器连接到可插入和可拆卸的卡式LED照明源，其包括已经安装在基板的一个表面上的多个LED。 照明驱动电路通过连接器电连接到卡型LED照明源。 卡式LED照明光源优选地包括金属基底基板和已经安装在金属基底基板的一个表面上的多个LED。 金属基底基板的不包括LED的背面与照明装置的一部分热接触。 与设置有LED的金属基底基板的表面上设置与连接器电连接的馈电端子。

公开(公告)号：US20080023718A1

公开(公告)日：2008-01-31

申请号：US11861378

申请日：2007-09-26

申请人： Tadashi YANO ,  Masanori SHIMIZU ,  Nobuyuki MATSUI ,  Tatsumi SETOMOTO ,  Tetsushi TAMURA

发明人： Tadashi YANO ,  Masanori SHIMIZU ,  Nobuyuki MATSUI ,  Tatsumi SETOMOTO ,  Tetsushi TAMURA

IPC分类号： H01L33/00

CPC分类号： H01L33/505 ,  H01L25/0753 ,  H01L33/508 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.

摘要翻译： LED灯包括基板，LED芯片和树脂部分。 LED芯片倒装芯片结合到基板上。 树脂部分覆盖LED芯片，并且包括将LED芯片的发射转换成具有比发射更长波长的光的至少一种类型的荧光体。 在该LED灯中，树脂部具有至少一个侧面。 侧表面与可以反射树脂部分的出射光的另一表面分离，包围LED芯片的侧表面并且至少部分弯曲。