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1.发明申请Polymer composite formed article, printed wiring board using the formed article, and methods of producing them 审中-公开高分子复合成型体，使用成形体的印刷线路板及其制造方法公开(公告)号：US20070116938A1
公开(公告)日：2007-05-24
申请号：US10582558
申请日：2005-02-18
申请人： Masayuki Tobita , Toru Kimura , Hisashi Aoki , Naoyuki Shimoyama , Tsukasa Ishigaki , Mitsukazu Ochi , Miyuki Harada
发明人： Masayuki Tobita , Toru Kimura , Hisashi Aoki , Naoyuki Shimoyama , Tsukasa Ishigaki , Mitsukazu Ochi , Miyuki Harada
IPC分类号： D04H13/00
CPC分类号： C08G59/28 , B32B15/08 , B32B15/092 , B32B15/20 , B32B27/04 , B32B27/18 , B32B27/38 , B32B2250/03 , B32B2250/40 , B32B2274/00 , B32B2307/202 , B32B2307/206 , B32B2457/08 , C08G59/5033 , C08J5/24 , C08J2363/00 , C08K7/02 , H05K1/0366 , H05K2201/0129 , H05K2201/0141 , H05K2201/0287 , H05K2201/029 , H05K2201/068 , Y10T428/249924 , C08L63/00
摘要： A thermoplastic polymer composite formed article or a thermoplastic polymer composite formed article formed from a thermoplastic polymer or a thermoplastic polymer and a fiber, wherein the fiber is arranged along a first plane and the molecular chains of the thermoplastic polymer or thermoplastic polymer is oriented in the direction intersecting with the first plane, and the molecular chains of the thermoplastic polymer or thermoplastic polymer has a degree (a) of orientation in a range of 0.5 or more and less than 1.0, and wherein the thermal expansion coefficients of said formed article in the direction along the first plane and in the direction intersecting with the first plane are both 5×10−6 to 50×10−6 (/K), and the difference between the thermal expansion coefficient in the direction along the first plane and the thermal expansion coefficient in the direction intersecting with the first plane is 30×10−6 (/K) or less.
摘要翻译： 由热塑性聚合物或热塑性聚合物和纤维形成的热塑性聚合物复合成型制品或热塑性聚合物复合成型制品，其中纤维沿着第一平面布置，热塑性聚合物或热塑性聚合物的分子链定向于 方向与第一平面相交，并且热塑性聚合物或热塑性聚合物的分子链具有在0.5以上且小于1.0的范围内的取向度（a），并且其中所述成型制品的热膨胀系数在 沿着第一平面和与第一平面相交的方向的方向均为5×10 -6〜50×10 -6（/ K），热膨胀系数 沿着第一平面的方向和与第一平面相交的方向的热膨胀系数为30×10 -6（/ K）以下。
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2.发明授权公开(公告)号：US07079405B2
公开(公告)日：2006-07-18
申请号：US10617517
申请日：2003-07-11
IPC分类号： H02M3/335
CPC分类号： C09K19/3809 , B29C70/88 , B29C71/00 , B29C71/0081 , B29K2077/00 , B29K2077/10 , B29K2105/0079 , B29K2995/0013
摘要： A thermal conductive polymer molded article is formed by molding a thermotropic liquid crystalline composition comprised mainly of a thermotropic liquid crystalline polymer, wherein the thermal conductive polymer molded article is formed by applying a magnetic field or an electric field to the thermotropic liquid crystalline composition melted by heating so that the thermal conductive polymer molded article has a first thermal conductivity (λ1) higher than a second thermal conductivity (λ2) of a molded article formed by molding the thermotropic liquid crystalline polymer without the application of the field. The thermal conductive polymer molded article preferably has a first thermal conductivity (λ1) of between 0.7 and 20 W/(m·K). Preferably, the thermotropic liquid crystalline polymer comprises at least one polymer selected from (A) a wholly aromatic polyester and (B) a wholly aromatic polyester amide.
摘要翻译： 导热聚合物模制品通过模制一种主要由热致液晶聚合物组成的热致液晶组合物而形成，其中通过向由热致液晶组合物熔化的热致变液晶组合物施加磁场或电场而形成导热聚合物模塑制品 加热，使得导热聚合物模塑制品具有比通过模塑成型制成的模塑制品的第二热导率（λ/ 2> 2）高的第一热导率（λ<1/2） 热致液晶聚合物无应用领域。 导热聚合物模塑制品优选具有0.7至20W /（m.K）之间的第一热导率（λ<1/2）。 优选地，热致液晶聚合物包含至少一种选自（A）全芳族聚酯和（B）全芳族聚酯酰胺的聚合物。
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公开(公告)号：US07347955B2
公开(公告)日：2008-03-25
申请号：US10686384
申请日：2003-10-14
申请人： Masayuki Tobita , Naoyuki Shimoyama , Tsukasa Ishigaki , Hisashi Aoki , Toru Kimura , Tsunehisa Kimura , Masafumi Yamato
发明人： Masayuki Tobita , Naoyuki Shimoyama , Tsukasa Ishigaki , Hisashi Aoki , Toru Kimura , Tsunehisa Kimura , Masafumi Yamato
CPC分类号： C09K19/3809 , C09K19/38 , C09K19/3838 , C09K19/52 , Y10T428/24994 , Y10T428/249942
摘要： A mold product comprising liquid crystal composition for conducting heat. The liquid crystal composition contains liquid crystal polymer having an orientation degree α obtained by equation 1 below: Orientation degree α=(180−Δβ)/180 equation 1 In equation 1, Δβ is a half width in the intensity distribution obtained by fixing peak scattering angle in X-ray diffraction measurement and by varying the azimuth angle from 0 to 360 degrees, and orientation degree α is in a range between 0.5 and 1.0.
摘要翻译： 一种包含用于传导热量的液晶组合物的模具产品。 该液晶组合物含有具有以下等式1得到的取向度α的液晶聚合物：<？in-line-formula description =“In-line formula”end =“lead”？>取向度α=（180-Deltabeta） 方程式1 <？in-line-formula description =“In-line Formulas”end =“tail”？>在等式1中，Deltabeta是通过固定X射线衍射中的峰值散射角得到的强度分布的半宽度 并且通过将方位角从0变化到360度，并且取向度α在0.5和1.0之间的范围内。
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4.发明授权公开(公告)号：US07189778B2
公开(公告)日：2007-03-13
申请号：US10623860
申请日：2003-07-21
CPC分类号： B29C55/00 , B29C70/62 , B29C70/88 , B29K2105/18 , B29K2995/0013 , C09K19/3809 , C09K2019/521 , Y10T428/1352 , Y10T428/24994 , Y10T428/249945
摘要： A thermally conductive polymer molded article formed by molding a thermally conductive composition which comprises a liquid crystalline polymer and thermally conductive filler having magnetic anisotropy, wherein the liquid crystalline polymer and the thermally conductive filler are oriented in a predetermined direction by a magnetic field. The thermally conductive composition contains 100 parts by weight of the liquid crystalline polymer and 5 to 800 parts by weight of the thermally conductive filler having magnetic anisotropy. The thermally conductive filler has a thermal conductivity in at least one direction higher than the thermal conductivity of the liquid crystalline polymer.
摘要翻译： 一种导热聚合物模制品，其通过模制包含液晶聚合物和具有磁各向异性的导热填料的导热组合物而形成，其中液晶聚合物和导热填料通过磁场沿预定方向取向。 导热组合物含有100重量份液晶聚合物和5至800重量份具有磁各向异性的导热填料。 导热填料在比液晶聚合物的热导率高至少一个方向上具有导热性。
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公开(公告)号：US20080004191A1
公开(公告)日：2008-01-03
申请号：US11478482
申请日：2006-06-29
申请人： Tsukasa Ishigaki
发明人： Tsukasa Ishigaki
IPC分类号： C10M113/08
CPC分类号： C10M169/02 , C10M107/28 , C10M2201/0616 , C10M2201/0626 , C10M2201/0876 , C10M2209/0863 , C10N2210/02 , C10N2210/03 , C10N2220/021 , C10N2240/20 , C10N2250/10 , C10M2205/0285
摘要： A thermal conductive grease used for diffusion of heat generated in electronic appliances is provided. The thermal conductive grease comprises: (A) a base oil having a viscosity of 112 to 770 mm2 at 40° C. and comprising a copolymer of an unsaturated dicarboxylic acid dibutyl ester and an α-olefin; and (B) a thermal conductive filler filled in the base oil. The thermal conductive grease does not include conventionally used silicone oil so that insulating substances will not be formed in the thermal conductive grease.
摘要翻译： 提供了用于在电子设备中产生的热扩散的导热油脂。 导热油脂包括：（A）在40℃下粘度为112至770mm 2的基础油，并且包含不饱和二羧酸二丁酯和α-烯烃的共聚物; 和（B）填充在基础油中的导热填料。 导热油脂不包括常规使用的硅油，从而不会在导热油脂中形成绝缘物质。
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公开(公告)号：US20080295959A1
公开(公告)日：2008-12-04
申请号：US12121938
申请日：2008-05-16
申请人： Tsukasa Ishigaki , Yutaka Nakanishi , Hisashi Aoki
发明人： Tsukasa Ishigaki , Yutaka Nakanishi , Hisashi Aoki
CPC分类号： C09J133/04 , C08F220/26 , C09J4/06
摘要： A thermally conductive adhesive composition contains a polymerizable (meth)acrylic compound (A) comprising at least one of a (meth)acrylic monomer and a (meth)acrylic oligomer, an organic peroxide (B), a thermally conductive filler (C) and a vanadium compound (D). The volume ratio α of the polymerizable (meth)acrylic compound (A) to the thermally conductive filler (C) determined by the following formula (1) is 0.40 to 0.65. 40 to 100% by mass of the thermally conductive filler (C) is subjected to hydrophobic surface treatment. Volume ratio α=Volume of Thermally conductive filler (C)/(Volume of Polymerizable(meth)acrylic compound (A)+Volume of Thermally conductive filler (C)) (1)
摘要翻译： 导热性粘合剂组合物含有包含（甲基）丙烯酸系单体和（甲基）丙烯酸系低聚物，有机过氧化物（B），导热性填料（C）和导热性填充剂（C）中的至少一种的聚合性（甲基）丙烯酸系化合物 钒化合物（D）。 由下式（1）确定的可聚合（甲基）丙烯酸化合物（A）与导热性填料（C）的体积比α为0.40〜0.65。 40〜100质量％的导热性填料（C）进行疏水性表面处理。 体积比α=导热填料的体积（C）/（聚合性（甲基）丙烯酸化合物的体积（A））+体积比 导热填料（C））（1）<？in-line-formula description =“In-line Formulas”end =“tail”？>
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