-
公开(公告)号：US07789988B2
公开(公告)日：2010-09-07
申请号：US11723239
申请日：2007-03-19
CPC分类号： B29C63/0013 , H01L21/67132 , Y10T156/1089 , Y10T156/1184 , Y10T156/1961
摘要： A peripheral edge of a protective tape joined to a front face of a semiconductor wafer is snagged on a needle having a sharp tip end so as to be partially separated from the front face of the semiconductor wafer; thus, a separated portion is formed. Next, an operation of joining a separating tape to a surface of the protective tape is started from the separated portion, and the protective tape is separated together with the separating tape from the front face of the semiconductor wafer with the separated portion as a starting end.
摘要翻译： 连接到半导体晶片的前表面的保护带的外围边缘被阻塞在具有尖锐尖端的针上，从而与半导体晶片的前表面部分地分离; 因此，形成分离部分。 接下来，从分离部开始将分离带接合到保护带的表面的操作，并且保护带与分离带从半导体晶片的前表面分离，分离部分作为起始端 。
-
公开(公告)号：US20090095418A1
公开(公告)日：2009-04-16
申请号：US12242453
申请日：2008-09-30
IPC分类号： B29C71/04
CPC分类号： H01L21/67132 , Y10T156/1158 , Y10T156/19
摘要： The ultraviolet ray is applied on the surface of the protective tape from an ultraviolet ray generator. In addition, the ultraviolet ray having intensity higher than that from the ultraviolet ray generator is applied on spot on the wafer edge by an irradiation gun. In this case, the ultraviolet ray intensity and the rotation speed of the holding table are controlled by a controller so that the ultraviolet irradiation amount per unit area of the wafer edge portion becomes equal to that to the joining surface of the protective tape.
摘要翻译： 紫外线从紫外线发生器施加在保护带的表面上。 此外，通过照射枪在晶片边缘上点上施加强度高于紫外线发生器的紫外线。 在这种情况下，通过控制器控制保持台的紫外线强度和旋转速度，使得晶片边缘部的每单位面积的紫外线照射量与保护带的接合面相等。
-
公开(公告)号：US06235144B1
公开(公告)日：2001-05-22
申请号：US09203263
申请日：1998-12-01
申请人： Masayuki Yamamoto , Makoto Namikawa , Eiji Toyoda , Shigeji Kuroda , Saburo Miyamoto , Takao Matsushita
发明人： Masayuki Yamamoto , Makoto Namikawa , Eiji Toyoda , Shigeji Kuroda , Saburo Miyamoto , Takao Matsushita
IPC分类号： B32B3500
CPC分类号： H01L21/67132 , B08B7/00 , B08B7/0028 , B08B7/0035 , B29C63/0013 , G03F7/42 , Y10T156/11 , Y10T156/1158 , Y10T156/1189
摘要： A resist removing apparatus for removing an unwanted resist pattern from a surface of wafer W by applying an adhesive tape to the surface of wafer W having the resist patterns formed thereon, and separating the adhesive tape from the surface of wafer W. The apparatus includes an adhesive removing mechanism 13 for treating the surface of wafer W after the adhesive tape is separated therefrom. The adhesive removing mechanism 13 may be effective when constructed to jet ozone to the surface of wafer W heated, to irradiate the surface of wafer W heated, with ultraviolet rays, or to jet ozone to the surface of wafer W heated and irradiate the surface with ultraviolet rays.
摘要翻译： 一种抗蚀剂去除装置，用于通过在其上形成有抗蚀剂图案的晶片W的表面上涂布粘合带，从晶片W的表面除去不需要的抗蚀剂图案，并将粘合带从晶片W的表面分离。该装置包括： 粘合剂去除机构13，用于在粘合带分离之后处理晶片W的表面。 当粘合剂去除机构13被构造成将臭氧喷射到被加热的晶片W的表面上，以紫外线照射加热的晶片W的表面，或者将臭氧喷射到加热并照射表面的晶片W的表面时， 紫外线。
-
4.发明授权公开(公告)号：US07078262B2
公开(公告)日：2006-07-18
申请号：US10303816
申请日：2002-11-26
CPC分类号： H01L21/67748 , H01L21/67132 , H01L21/6838 , Y10S414/135
摘要： A wafer formed thin through a back grinding process is placed on a support table included in an alignment stage. When a faulty suction is caused by a warp of the wafer, a surface of wafer is pressed by a pressing plate to be corrected and held by suction. The wafer held by suction is transported, along with the alignment stage, to a mount frame preparing unit at the next step. The wafer is received while being held by suction by a chuck table contacting the surface of wafer.
-
公开(公告)号：US6099675A
公开(公告)日：2000-08-08
申请号：US203497
申请日：1998-12-01
申请人： Masayuki Yamamoto , Makoto Namikawa , Eiji Toyoda , Shigeji Kuroda , Saburo Miyamoto , Takao Matsushita
发明人： Masayuki Yamamoto , Makoto Namikawa , Eiji Toyoda , Shigeji Kuroda , Saburo Miyamoto , Takao Matsushita
CPC分类号： B29C63/0013 , Y10S156/922 , Y10T156/11
摘要： An adhesive tape is applied to an article covered with a resist pattern. The article with the adhesive tape applied thereto is rapidly cooled to form cracks in the resist pattern on the surface of the article to weaken the cohesion between the resist pattern and the surface of the article. After the cooling, the adhesive tape is separated from the article, whereby the resist pattern is removed with the adhesive tape from the surface of the article.
摘要翻译： 将粘合带施加到被抗蚀图案覆盖的物品上。 施加有胶粘带的制品被快速冷却以在制品的表面上的抗蚀剂图案中形成裂纹，以削弱抗蚀剂图案和制品的表面之间的内聚力。 冷却后，粘合带与制品分离，由此用胶带从制品的表面除去抗蚀剂图案。
-
公开(公告)号：US20070284038A1
公开(公告)日：2007-12-13
申请号：US11723239
申请日：2007-03-19
IPC分类号： B32B37/02
CPC分类号： B29C63/0013 , H01L21/67132 , Y10T156/1089 , Y10T156/1184 , Y10T156/1961
摘要： A peripheral edge of a protective tape joined to a front face of a semiconductor wafer is snagged on a needle having a sharp tip end so as to be partially separated from the front face of the semiconductor wafer; thus, a separated portion is formed. Next, an operation of joining a separating tape to a surface of the protective tape is started from the separated portion, and the protective tape is separated together with the separating tape from the front face of the semiconductor wafer with the separated portion as a starting end.
摘要翻译： 连接到半导体晶片的前表面的保护带的外围边缘被阻塞在具有尖锐尖端的针上，从而与半导体晶片的前表面部分地分离; 因此，形成分离部分。 接下来，从分离部开始将分离带接合到保护带的表面的操作，并且保护带与分离带从半导体晶片的前表面分离，分离部分作为起始端 。
-
公开(公告)号：US5759336A
公开(公告)日：1998-06-02
申请号：US746647
申请日：1996-11-13
IPC分类号： B08B7/00 , G03F7/42 , H01L21/027 , H05K3/00 , H01L21/30
CPC分类号： B08B7/0028 , G03F7/427 , H05K3/0079 , Y10T156/1189
摘要： A resist removing apparatus for removing unnecessary resist patterns from articles such as semiconductor substrates efficiently by using adhesive tape. A tape applicator unit is movable horizontally to apply the adhesive tape in strip form to a wafer supported on an applicator table. Then, a set of the tape applicator unit and a tape separator unit and a set of the applicator table and a separator table are moved horizontally relative to each other to shift the separator table under the wafer supported through the adhesive tape. A next wafer is transported to and placed on the applicator table in an unloaded state. The tape applicator unit and tape separator unit are moved horizontally and simultaneously to apply the adhesive tape to the wafer on the applicator table and separate the adhesive tape from the wafer on the separator table at the same time.
摘要翻译： 一种抗蚀剂去除装置，通过使用胶粘带有效地去除了诸如半导体衬底的物品的不必要的抗蚀剂图案。 带施加器单元可水平移动以将带状的粘合带施加到支撑在施加器台上的晶片。 然后，一组带施加器单元和带分离器单元以及一组施加器台和分离器台相对于彼此水平移动，以使分离台在通过胶带支撑的晶片下移动。 下一个晶片在卸载状态下被运送到敷料台上并放置在敷料台上。 带施加器单元和带分离器单元水平地和同时移动，以将粘合带施加到施加器台上的晶片上，同时将胶带与分离器台上的晶片分离。
-
公开(公告)号：US09180207B2
公开(公告)日：2015-11-10
申请号：US14008703
申请日：2012-03-29
IPC分类号： A01K67/027 , A01K67/033 , A61K49/00 , G01N33/50
CPC分类号： A61K49/0008 , A01K67/0276 , A01K67/0278 , A01K2217/075 , A01K2227/105 , A01K2267/01 , A01K2267/0381 , G01N33/502 , G01N2333/505
摘要： The present invention relates to a model animal spontaneously developing anemia. More specifically, the invention relates to a transgenic non-human mammal spontaneously developing anemia associated with a postnatal decrease in production of erythropoietin (Epo), Epo-producing cells prepared from the transgenic non-human mammal, and a screening method using the Epo-producing cells.
摘要翻译： 本发明涉及自发发生贫血的模型动物。 更具体地说，本发明涉及与转基因非人哺乳动物制备的产生促红细胞生成素（Epo），产生Epo的细胞产生相关的与自发发生的贫血有关的转基因非人哺乳动物，以及使用Epo- 生产细胞。
-
9.发明授权Storage system and data management method with application specific storage tiers 有权具有应用程序存储层的存储系统和数据管理方法公开(公告)号：US09052823B2
公开(公告)日：2015-06-09
申请号：US12988653
申请日：2010-05-18
申请人： Masayuki Yamamoto , Yoshiaki Eguchi , Azusa Sudo
发明人： Masayuki Yamamoto , Yoshiaki Eguchi , Azusa Sudo
CPC分类号： G06F3/0605 , G06F3/0649 , G06F3/0665 , G06F3/0685
摘要： Proposes the realization of the performance stability operation of virtual volumes and the stabilized access performance for the virtual volumes in the storage apparatus. In the storage apparatus which configures a pool of multiple types of storage tiers of different performances, provides virtual volumes to the host computer and, in accordance with a write request from an application to a virtual volume, assigns pages to the relevant virtual volume from the pool, a policy associating an application with the virtual volume with which the relevant application reads/writes data, a storage tier to assign pages to the relevant virtual volume, and the priority of the relevant storage tier is managed and, in accordance with a write request from the application, complying with the corresponding policy, among the storage tiers associated with the corresponding virtual volume, pages are assigned from the storage tier of the higher priority to the relevant virtual volume.
摘要翻译： 提出实现虚拟卷的性能稳定性操作和存储设备中虚拟卷的稳定访问性能。 在配置不同性能的多种类型的存储层的存储装置中，向主计算机提供虚拟卷，并且根据从应用到虚拟卷的写请求，将页面从相应的虚拟卷分配给 池，将应用与相关应用读取/写入数据的虚拟卷相关联的策略，将页面分配给相关虚拟卷的存储层，并且管理相关存储层的优先级，并且根据写入 在与相应的虚拟卷相关联的存储层之中，从应用程序请求符合相应的策略，页面从较高优先级的存储层分配给相关的虚拟卷。
-
公开(公告)号：US08862805B2
公开(公告)日：2014-10-14
申请号：US13140327
申请日：2011-06-07
申请人： Akira Yamamoto , Masayuki Yamamoto
发明人： Akira Yamamoto , Masayuki Yamamoto
CPC分类号： G06F3/0619 , G06F3/0608 , G06F3/064 , G06F3/0665 , G06F3/067 , G06F3/0688
摘要： A storage system has a plurality of flash packages, and a storage controller for receiving a write request from a host and sending a write-data write request based on data conforming to this write request to a write-destination flash package. A virtual capacity, which is larger than the physical capacity of the flash package, is defined in the storage controller. The storage system compresses the write data, and writes the compressed write data to the write-destination flash chip.
摘要翻译： 存储系统具有多个闪存封装，以及存储控制器，用于从主机接收写入请求，并且基于符合该写入请求的数据将写入数据写入请求发送到写入目的地闪存封装。 在存储控制器中定义大于闪存包的物理容量的虚拟容量。 存储系统压缩写入数据，并将压缩的写入数据写入到写入目的地闪存芯片。
-
-
-
-
-
-
-
-
-
搜索结果
502 条记录 (耗时 0.025 秒)
