-
公开(公告)号：US06664515B2
公开(公告)日：2003-12-16
申请号：US10119778
申请日：2002-04-11
IPC分类号： H05B368
CPC分类号： H01L21/67103 , H05B3/143 , H05B3/283
摘要： A technology that achieves a highly uniform temperature distribution on the surface of large-area semiconductor wafers and substrates for liquid crystals without prior measurement of the resistance-heating-element circuit and subsequent adjustment of the value of resistance. At least one current-receiving point 4 and at least one current-releasing point 5 are provided at the central portion of an insulating substrate 1. One or more resistance-heating-element circuits 2 are embedded in the insulating substrate spirally or pseudospirally from the central portion including the current-receiving point 4 to the peripheral portion of the insulating substrate 1. All the circuits merge with one another at the outermost portion. One or more resistance-heating-element circuits are separated at the outermost portion of the resistance-heating-element circuits and are formed spirally or pseudospirally from the outermost portion to the central portion including the current-releasing point 5.
-
公开(公告)号：US6025636A
公开(公告)日：2000-02-15
申请号：US951615
申请日：1997-10-16
申请人： Hideaki Nakahata , Masashi Narita , Kenjiro Higaki , Satoshi Fujii , Hiroyuki Kitabayashi , Shin-ichi Shikata
发明人： Hideaki Nakahata , Masashi Narita , Kenjiro Higaki , Satoshi Fujii , Hiroyuki Kitabayashi , Shin-ichi Shikata
CPC分类号： H03H9/02582
摘要： A surface acoustic wave device includes at least diamond, a single crystal LiNbO.sub.3 layer formed on the diamond, and an interdigital transducer formed in contact with the LiNbO.sub.3 layer and uses a surface acoustic wave (wavelength: .lambda..sub.n .mu.m) in an nth-order mode (n=1 or 2). When the thickness of the LiNbO.sub.3 layer is t.sub.1 (.mu.m), kh.sub.1 =2.pi.(t.sub.1 /.lambda..sub.n) and the cut orientation (.theta., .PHI., and .psi. represented by an Eulerian angle representation) with respect to the crystallographic fundamental coordinate system of the LiNbO.sub.3 layer are selected from values within specific ranges. Consequently, a surface acoustic wave device which increases the propagation velocity (V) of a surface acoustic wave and improves the electromechanical coupling coefficient (K.sup.2) is realized.
摘要翻译： 表面声波装置至少包括金刚石，形成在金刚石上的单晶LiNbO 3层和与LiNbO 3层接触形成的叉指换能器，并使用n阶的表面声波（波长：λnμm） 模式（n = 1或2）。 当LiNbO 3层的厚度为t1（μm）时，相对于晶体基础坐标系，kh1 =2π（t1 /λn）和切割取向（θ，PHI和由欧拉角表示的psi） 的LiNbO 3层选自特定范围内的值。 因此，实现了提高声表面波的传播速度（V）并提高机电耦合系数（K2）的声表面波装置。
-
3.发明授权Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate 有权半导体元件安装基板，使用该半导体元件安装基板的半导体装置及其制造方法公开(公告)号：US08178893B2
公开(公告)日：2012-05-15
申请号：US12087214
申请日：2006-12-21
IPC分类号： H01L33/64
CPC分类号： H01L24/27 , H01L23/14 , H01L23/3732 , H01L24/29 , H01L24/31 , H01L24/83 , H01L2224/2908 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/83801 , H01L2224/83805 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01S5/0213 , H01S5/02484 , H01L2924/01014 , H01L2924/00 , H01L2924/3512 , H01L2224/29144 , H01L2924/00012 , H01L2924/00014
摘要： The invention provides a semiconductor element mounting substrate that, by virtue of an improvement in thermal conduction efficiency between the substrate and another member, can reliably prevent, for example, a light emitting element such as a semiconductor laser from causing a defective operation by heat generation of itself, by taking full advantage of high thermal conductivity of a diamond composite material. In the semiconductor element mounting substrate, a connecting surface to be connected with the light emitting element or the like is finished such that the number, per unit area, of at least either recesses or protrusions having a depth or height of 10 μm to 40 μm and a surface-direction diametrical size of 10 μm to 3 mm is 50/cm2 or less, and on the connecting surface, a coating layer, which is formed of a solder or a brazing material, has a thickness of 1 μm to 30 μm, an arithmetic mean roughness Ra of a roughness curve showing a surface roughness of Ra≦2 μm, and a maximum height roughness Rz of Rz≦15 μm, and fills and covers the recesses or protrusions, is formed.
摘要翻译： 本发明提供了一种半导体元件安装基板，其通过提高基板与另一构件之间的热传导效率，可以可靠地防止例如半导体激光器等发光元件通过发热引起不良操作 本身，充分利用金刚石复合材料的高导热性。 在半导体元件安装基板中，与发光元件等连接的连接面被完成，使得每单位面积的至少一个深度或高度为10μm〜40μm的凹部或突起的数量 10μm至3mm的面方向直径尺寸为50 / cm 2以下，在连接面上，由焊料或钎焊材料形成的涂层的厚度为1μm〜30μm 形成表示粗糙度曲线的算术平均粗糙度Ra，表示粗糙度Ra＆lt; 1lE;2μm，最大高度粗糙度Rz为Rz＆lt; 1lE;15μm，填充并覆盖凹部或突起。
-
公开(公告)号：US5118658A
公开(公告)日：1992-06-02
申请号：US597696
申请日：1990-10-16
CPC分类号： B41M5/395 , Y10S428/913 , Y10S428/914 , Y10T428/31551
摘要： A heat transfer sheet including a substrate film having thereon a due layer including a dye and a binder, wherein the binder includes a urethane-modified cellulosic resin obtained by the reaction of a hydroxyl group-containing cellulosic resin with an isocyanate.
摘要翻译： 一种传热片，其包括其上具有染料和粘合剂的适当层的基底膜，其中所述粘合剂包括通过含羟基的纤维素树脂与异氰酸酯反应获得的氨基甲酸酯改性的纤维素树脂。
-
公开(公告)号：US08920148B2
公开(公告)日：2014-12-30
申请号：US13014034
申请日：2011-01-26
申请人： Masateru Nakagawa , Nobukazu Ike , Takuro Iwase , Tomohiro Umemura , Noriyasu Ariga , Katsunori Ishikawa , Masashi Narita
发明人： Masateru Nakagawa , Nobukazu Ike , Takuro Iwase , Tomohiro Umemura , Noriyasu Ariga , Katsunori Ishikawa , Masashi Narita
CPC分类号： F04C15/0042 , F04C2/088 , F04C2/102 , F04C2210/14 , F04C2250/10
摘要： An oil pump having an inner rotor with of external teeth; an outer rotor that is eccentrically provided and has internal teeth that mesh with the inner rotor external teeth, and an oil pump body that accommodates the outer and inner rotors. By rotationally driving the inner rotor to increase and decrease a space between the internal and the external teeth, an intake stroke suctions hydraulic oil from the oil pump body and a discharge stroke discharges the suctioned hydraulic oil to a discharge port formed in the oil pump body. Between the intake and discharge strokes, a confinement stroke cuts off the suctioned hydraulic oil and confines the suctioned hydraulic oil in the space, and a compression stroke reduces the space and compresses the confined hydraulic oil. Further, an interval is set between a finish end portion of the intake port of the oil pump body and a start end portion of the discharge port such that a rotation angle of the inner rotor during the compression stroke is 21 to 27 degrees.
摘要翻译： 一种具有外齿的内转子的油泵; 外转子，其偏心地设置并具有与内转子外齿啮合的内齿，以及容纳外转子和内转子的油泵体。 通过旋转地驱动内转子来增加和减少内齿与外齿之间的空间，进气冲程吸入来自油泵体的液压油，排出冲程将抽吸的液压油排出到形成在油泵体内的排出口 。 在进气和排气冲程之间，限制冲程切断吸入的液压油并将吸入的液压油限制在空间中，并且压缩冲程减小了空间并压缩了限制的液压油。 此外，在油泵主体的进气口的最终端部与排出口的起始端部之间设定间隔，使得内侧转子在压缩冲程中的旋转角度为21〜27度。
-
6.发明申请Semiconductor Element Mounting Substrate, Semiconductor Device Using the Same, and Method for Manufacturing Semiconductor Element Mounting Substrate 有权半导体元件安装基板，使用其的半导体器件以及半导体元件安装基板的制造方法公开(公告)号：US20090057705A1
公开(公告)日：2009-03-05
申请号：US12087214
申请日：2006-12-21
IPC分类号： H01L23/488 , H01L33/00 , H01L21/768
CPC分类号： H01L24/27 , H01L23/14 , H01L23/3732 , H01L24/29 , H01L24/31 , H01L24/83 , H01L2224/2908 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/83801 , H01L2224/83805 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01S5/0213 , H01S5/02484 , H01L2924/01014 , H01L2924/00 , H01L2924/3512 , H01L2224/29144 , H01L2924/00012 , H01L2924/00014
摘要： The invention provides a semiconductor element mounting substrate that, by virtue of an improvement in thermal conduction efficiency between the substrate and another member, can reliably prevent, for example, a light emitting element such as a semiconductor laser from causing a defective operation by heat generation of itself, by taking full advantage of high thermal conductivity of a diamond composite material. In the semiconductor element mounting substrate, a connecting surface to be connected with the light emitting element or the like is finished such that the number, per unit area, of at least either recesses or protrusions having a depth or height of 10 μm to 40 μm and a surface-direction diametrical size of 10 μm to 3 mm is 50/cm2 or less, and on the connecting surface, a coating layer, which is formed of a solder or a brazing material, has a thickness of 1 μm to 30 μm, an arithmetic mean roughness Ra of a roughness curve showing a surface roughness of Ra≦2 μm, and a maximum height roughness Rz of Rz≦15 μm, and fills and covers the recesses or protrusions, is formed.
摘要翻译： 本发明提供了一种半导体元件安装基板，其通过提高基板与另一构件之间的热传导效率，可以可靠地防止例如半导体激光器等发光元件通过发热引起不良操作 本身，充分利用金刚石复合材料的高导热性。 在半导体元件安装基板中，与发光元件等连接的连接表面被完成，使得每单位面积的至少一个具有10μm至40μm的深度或高度的凹部或突起的数量 10um〜3mm的表面方向直径尺寸为50 / cm 2以下，在连接面上，由焊料或钎焊材料形成的涂层的厚度为1〜30μm 形成表示粗糙度Ra <=2μm的粗糙度曲线和Rz <=15μm的最大高度粗糙度Rz的算术平均粗糙度Ra，并且填充和覆盖凹部或突起。
-
公开(公告)号：US5418210A
公开(公告)日：1995-05-23
申请号：US085915
申请日：1993-07-06
CPC分类号： B41M5/395 , Y10S428/913 , Y10S428/914 , Y10T428/31551 , Y10T428/31768 , Y10T428/31935 , Y10T428/31971
摘要： A heat transfer sheet including a substrate film and a dye layer including a dye and a binder formed thereon, wherein the binder includes organic-solvent-soluble polymers having ester moieties and/or urethane moieties, prepared by modifying water-soluble natural and/or semisynthetic polymers by esterifying and/or urethanating an inner hydroxyl group thereof, and the dye includes a sublimable dye homogeneously dissolved in the binder. A heat transfer sheet is also disclosed which includes a substrate film, and a dye layer formed thereon, wherein the dye layer includes (i) a binder which is cellulose acetate having an acetylation rate of 2.4 or more and a total substitution rate of 2.7 or more, and (ii) a sublimable dye dissolved in the binder. The sublimable dye contained in the dye layer is not separated from the binder even when the heat transfer sheet is preserved for a long period of time. Furthermore, the heat transfer sheet can produce a high-density image even when only a small amount of thermal energy is applied thereto.
摘要翻译： 一种传热片，其包括基材膜和包含染料和在其上形成的粘合剂的染料层，其中所述粘合剂包括具有酯部分和/或氨基甲酸酯部分的有机溶剂可溶性聚合物，其通过将水溶性天然和/或 半合成聚合物通过酯化和/或氨基甲酸酯化其内部羟基，并且染料包括均匀溶解在粘合剂中的可升华染料。 还公开了一种传热片，其包括基底膜和在其上形成的染料层，其中所述染料层包括（i）乙酰化速率为2.4或更高，总替代率为2.7的乙酸纤维素的粘合剂，或 和（ii）溶解在粘合剂中的升华性染料。 包含在染料层中的升华性染料即使在长时间保存传热片时也不会与粘合剂分离。 此外，即使仅向其施加少量的热能，传热片也可以产生高密度图像。
-
公开(公告)号：US5111285A
公开(公告)日：1992-05-05
申请号：US522827
申请日：1990-05-14
申请人： Shuji Fujita , Masashi Narita , Masanori Akada , Yoshihiko Azuma
发明人： Shuji Fujita , Masashi Narita , Masanori Akada , Yoshihiko Azuma
CPC分类号： H04N1/409 , H04N1/4072
摘要： A video printer device is disclosed which is capable of printing out a high quality still image by subjecting image data obtained from a continuous video signal such as a television signal or the like, to noise processing and tone processing to improve the quality of the same. Upon subjecting said video signal to the noise and tone processings, a processed image can be displayed on a screen of a monitor, and checked and corrected on the same screen on real time.
-
公开(公告)号：US06337531B1
公开(公告)日：2002-01-08
申请号：US09504911
申请日：2000-02-16
IPC分类号： H01L4104
CPC分类号： H03H9/02582 , H03H9/02543
摘要： A surface-acoustic-wave (SAW) device that has not only an increased propagation velocity of SAWs but also an increased electromechanical coupling coefficient of 20% or more. The SAW device comprises a diamond substrate 10, a KNbO3 layer 30, and IDTs 40. The KNbO3 layer 30 is composed of a single crystal having the layer thickness and the crystal orientation that are controlled so as to obtain a propagation velocity of 5,000 m/s or more and an electromechanical coupling coefficient of 20% or more for the SAW in a specified mode.
摘要翻译： 一种表面声波（SAW）器件，其不仅具有增加的SAW的传播速度，而且增加了机电耦合系数的20％以上。 SAW器件包括金刚石衬底10，KNbO 3层30和IDT 40.KNbO 3层30由具有层厚度和晶体取向的单晶组成，以获得传播速度为5000m / s以上，在特定模式下，SAW的机电耦合系数为20％以上。
-
公开(公告)号：US5662989A
公开(公告)日：1997-09-02
申请号：US608214
申请日：1996-02-28
申请人： Hitoshi Obata , Masashi Narita
发明人： Hitoshi Obata , Masashi Narita
CPC分类号： B41M5/38228 , Y10S428/913 , Y10S428/914
摘要： A thermal transfer sheet including a substrate film and a hot-melt ink layer including a first ink layer and a second ink layer laminated in that order on one surface of the substrate film. The first ink layer includes a wax and a colorant, and the second ink layer comprising a supercooling resin incompatible with the wax, and a colorant.
摘要翻译： 一种热转印片，其包括基材膜和包含第一油墨层和第二油墨层的热熔油墨层，所述第一油墨层和第二油墨层依次层压在所述基材膜的一个表面上。 第一油墨层包括蜡和着色剂，第二油墨层包含与蜡不相容的过冷树脂和着色剂。
-
-
-
-
-
-
-
-
-
搜索结果
12 条记录 (耗时 0.023 秒)
