Method and apparatus for measuring line end shortening, substrate and patterning device
    1.
    发明授权
    Method and apparatus for measuring line end shortening, substrate and patterning device 有权
    用于测量线端缩短的方法和装置,基板和图案形成装置

    公开(公告)号:US08982329B2

    公开(公告)日:2015-03-17

    申请号:US12933806

    申请日:2009-04-22

    摘要: End of line effect can occur during manufacture of components using a lithographic apparatus. These end of line effects can result in line end shortening of the features being manufactured. Such line end shortening may have an adverse impact on the component being manufactured. It is therefore desirable to predict and/or monitor the line end shortening. A test pattern is provided that has two separate areas such that, as designed, when the two areas are illuminated with radiation (for example from an angle-resolved scatterometer) they result in diffused radiation with asymmetry that is equal in sign to each other, but opposite in magnitude. When the test pattern is actually manufactured, line end shortening occurs, and so the asymmetry of the two areas are not equal and opposite. From the measured asymmetry of the manufactured test pattern, the amount of line end shortening that has occurred can be estimated.

    摘要翻译: 在使用光刻设备的部件的制造期间可能发生线路效应的结束。 这些线路效应的结束可能导致正在制造的功能的线端缩短。 这种线端缩短可能对正在制造的部件产生不利影响。 因此,希望预测和/或监视线端缩短。 提供了具有两个独立区域的测试图案,使得如设计的那样,当两个区域被辐射照射时(例如,从角度分辨的散射仪)照射,它们导致具有彼此相等的不对称性的漫射辐射, 但在数量上相反。 当实际制造测试图形时,发生线端缩短,因此两个区域的不对称性不相等。 根据制造的测试图案的测量不对称性,可以估计发生的线端缩短量。

    Method and Apparatus for Measuring Line End Shortening, Substrate and Patterning Device
    2.
    发明申请
    Method and Apparatus for Measuring Line End Shortening, Substrate and Patterning Device 有权
    测量线端缩短,基板和图案化装置的方法和装置

    公开(公告)号:US20110109888A1

    公开(公告)日:2011-05-12

    申请号:US12933806

    申请日:2009-04-22

    IPC分类号: G03B27/42 G01N21/47

    摘要: End of line effect can occur during manufacture of components using a lithographic apparatus. These end of line effects can result in line end shortening of the features being manufactured. Such line end shortening may have an adverse impact on the component being manufactured. It is therefore desirable to predict and/or monitor the line end shortening. A test pattern is provided that has two separate areas such that, as designed, when the two areas are illuminated with radiation (for example from an angle-resolved scatterometer) they result in diffused radiation with asymmetry that is equal in sign to each other, but opposite in magnitude. When the test pattern is actually manufactured, line end shortening occurs, and so the asymmetry of the two areas are not equal and opposite. From the measured asymmetry of the manufactured test pattern, the amount of line end shortening that has occurred can be estimated.

    摘要翻译: 在使用光刻设备的部件的制造期间可能发生线路效应的结束。 这些线路效应的结束可能导致正在制造的功能的线端缩短。 这种线端缩短可能对正在制造的部件产生不利影响。 因此,希望预测和/或监视线端缩短。 提供了具有两个独立区域的测试图案,使得如设计的那样,当两个区域被辐射照射时(例如,从角度分辨的散射仪)照射,它们导致具有彼此相等的不对称性的漫射辐射, 但在数量上相反。 当实际制造测试图形时,发生线端缩短,因此两个区域的不对称性不相等。 根据制造的测试图案的测量不对称性,可以估计发生的线端缩短量。

    Inspection method for lithography
    3.
    发明授权
    Inspection method for lithography 有权
    光刻检验方法

    公开(公告)号:US09494872B2

    公开(公告)日:2016-11-15

    申请号:US13060390

    申请日:2009-09-08

    IPC分类号: G03F7/20

    CPC分类号: G03F7/70633 G03F7/70625

    摘要: The present invention relates to an inspection apparatus and method which include projecting a measurement radiation beam onto a target on a substrate in order to measure the radiation reflected from the target and obtain information related to properties of the substrate. In the present embodiments, the measurement spot, which is the focused beam on the substrate, is larger than the target. Information regarding the radiation reflected from the target is kept and information regarding the radiation reflected from the surface around the target is eliminated. This is done either by having no reflecting (or no specularly reflecting) surfaces around the target or by having known structures around the target, the information from which may be recognized and removed from the total reflected beam. The reflected beam is measured in the pupil plane of the projector such that the information obtained is related to diffraction orders of the reflected beam and profile, critical dimension or overlay of structures on the substrate may be determined.

    摘要翻译: 本发明涉及一种检查装置和方法,其包括将测量辐射束投射到基板上的目标上,以便测量从目标反射的辐射,并获得与基板的特性有关的信息。 在本实施例中,作为基板上的聚焦光束的测量点大于目标。 关于从目标反射的辐射的信息被保留,并且关于从目标周围的表面反射的辐射的信息被消除。 这可以通过在靶周围没有反射(或没有镜面反射)表面或通过在靶周围具有已知结构来完成,可以从总反射光束识别和去除信息。 在投影仪的瞳平面中测量反射光束,使得所获得的信息与反射光束的衍射级和轮廓,基底上的结构的临界尺寸或重叠相关。

    Inspection Method For Lithography
    4.
    发明申请
    Inspection Method For Lithography 有权
    光刻检验方法

    公开(公告)号:US20110229830A1

    公开(公告)日:2011-09-22

    申请号:US13060390

    申请日:2009-09-08

    CPC分类号: G03F7/70633 G03F7/70625

    摘要: The present invention relates to an inspection apparatus and method which include projecting a measurement radiation beam onto a target on a substrate in order to measure the radiation reflected from the target and obtain information related to properties of the substrate. In the present embodiments, the measurement spot, which is the focused beam on the substrate, is larger than the target. Information regarding the radiation reflected from the target is kept and information regarding the radiation reflected from the surface around the target is eliminated. This is done either by having no reflecting (or no specularly reflecting) surfaces around the target or by having known structures around the target, the information from which may be recognized and removed from the total reflected beam. The reflected beam is measured in the pupil plane of the projector such that the information obtained is related to diffraction orders of the reflected beam and profile, critical dimension or overlay of structures on the substrate may be determined.

    摘要翻译: 本发明涉及一种检查装置和方法,其包括将测量辐射束投射到基板上的目标上,以便测量从目标反射的辐射,并获得与基板的特性有关的信息。 在本实施例中,作为基板上的聚焦光束的测量点大于目标。 关于从目标反射的辐射的信息被保留,并且关于从目标周围的表面反射的辐射的信息被消除。 这可以通过在靶周围没有反射(或没有镜面反射)表面或通过在靶周围具有已知结构来完成,可以从总反射光束识别和去除信息。 在投影仪的瞳平面中测量反射光束,使得所获得的信息与反射光束的衍射级和轮廓,基底上的结构的临界尺寸或重叠相关。