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公开(公告)号：US4939624A
公开(公告)日：1990-07-03
申请号：US284912
申请日：1988-12-14
CPC分类号： H01R12/523
摘要： An improved multiple circuit module for use in an electronic device includes a number of cold plates sandwiched between pairs of circuit boards for taking away excess heat from the circuit boards. Each plate is provided with open spaces which permit communication between the circuit boards, and with circuit boards on other cold plates. Electrical communication between the circuit boards is effected by an array of metallic pins. The pins are received in a perforate pin header which extends along the depth of the cold plate, and pins communicating with other circuit boards extend into a connector block which is placed between a pair of pin headers. Shielding is provided in both the connector blocks and pin headers to prevent electronic cross-talk between pins disposed therein. In one embodiment, a novel type of pin which reduces installation and disconnection friction is utilized.
摘要翻译： 用于电子设备的改进的多电路模块包括夹在电路板对之间的多个冷板，用于从电路板上取走多余的热量。 每个板都设有开放空间，允许电路板与其他冷板之间的电路板通信。 电路板之间的电气连接是通过一排金属针来实现的。 销被容纳在沿着冷板的深度延伸的穿孔针头中，并且与其他电路板连通的销延伸到连接器块中，该连接器块被放置在一对针头之间。 在两个连接器块和针头中设置屏蔽，以防止在其中设置的引脚之间的电子串扰。 在一个实施例中，利用了减少安装和断开摩擦的新型销。
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2.发明授权
公开(公告)号：US4884168A
公开(公告)日：1989-11-28
申请号：US284992
申请日：1988-12-14
IPC分类号： H05K7/20
CPC分类号： H05K7/20254
摘要： A cooling plate for heat dissipation is particularly adapted for use within printed circuit board stacks. The cooling plate includes a fluid inlet manifold, fluid pass containing a plurality of heat dissipation fins, and a fluid outlet manifold. Externally, the cooling plate has a pattern of heat conductive pads that is substantially identical to the pattern of devices on a printed circuit board attached to the cooling plate. The cooling plate includes apertures and mounting elements for z-axis connector assemblies so that printed circuit boards attached to either side of the cooling plate may electrically interconnect.
摘要翻译： 用于散热的冷却板特别适用于印刷电路板堆叠内。 冷却板包括流体入口歧管，含有多个散热翅片的流体通道和流体出口歧管。 在外部，冷却板具有与附接到冷却板的印刷电路板上的装置的图案基本相同的导热焊盘的图案。 冷却板包括用于z轴连接器组件的孔和安装元件，使得附接到冷却板的任一侧的印刷电路板可以电互连。
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公开(公告)号：US4984993A
公开(公告)日：1991-01-15
申请号：US351871
申请日：1989-05-12
IPC分类号： H01R12/89 , H01R13/193
CPC分类号： H01R12/89 , H01R13/193
摘要： An electrical end connector (10) of the zero insertion force type includes a pair of opposing blocks (21, 40), one of which blocks is slideably mounted in a housing (22). Opposite corresponding pairs of female receptacles (34) and male pins (31) are cooperatively mounted on the opposing blocks (21, 40). The housig (22) has two sets of oppositely disposed windows formed through the longitudinal ends. One block (40) has a channel formed therethrough, such that the block (40) is urged transversely upon insertion of a cam-like slider device (70), thereby selectively engaging or disengaging the male pins (31) and female receptacles (43).
摘要翻译： 零插入力型的电端连接器（10）包括一对相对的块（21,40），其中一个块可滑动地安装在壳体（22）中。 相对的相对的阴插座（34）和阳销（31）相对地配合安装在相对的块（21,40）上。 椅子（22）具有通过纵向端部形成的两组相对设置的窗口。 一个块（40）具有穿过其形成的通道，使得块（40）在插入凸轮状滑块装置（70）时被横向推动，从而选择性地接合或分离阳销（31）和阴插座（43） ）。
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公开(公告)号：US5211567A
公开(公告)日：1993-05-18
申请号：US725007
申请日：1991-07-02
IPC分类号： H01R43/16
CPC分类号： H01R12/523 , Y10S439/908 , Y10T29/49165 , Y10T29/4922
摘要： A completely shielded metallized connector block for use in multiple circuit modules of an electronic device. Electrical communication between the circuit boards is effected by an array of metallic pins which run through the blocks. The metallization on the nonconductive blocks can be held at ground or at a constant potential to increase the shielding between pins as well as maintaining voltage and ground planes at constant levels throughout the modules. The metallization is insulated from the pins and circuit boards by nonconductive bushings inserted in holes in the blocks. In one embodiment, the metallization consists of copper and solder plating and the blocks are constructed of liquid crystal polymer.
摘要翻译： 一种完全屏蔽的金属化连接器块，用于电子设备的多个电路模块。 电路板之间的电气连接通过穿过块的金属引脚阵列来实现。 非导电块上的金属化可以保持在接地或恒定电位，以增加引脚之间的屏蔽，以及将电压和接地层保持在整个模块中的恒定水平。 金属化通过插入块中的孔中的非导电衬套与销和电路板绝缘。 在一个实施例中，金属化由铜和焊料镀层组成，并且块由液晶聚合物构成。
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公开(公告)号：USD315147S
公开(公告)日：1991-03-05
申请号：US307581
申请日：1989-02-06
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公开(公告)号：US4700996A
公开(公告)日：1987-10-20
申请号：US916509
申请日：1986-10-08
IPC分类号： H01R24/00 , H01R12/18 , H01R13/193 , H01R13/62
CPC分类号： H01R13/193
摘要： An electrical edge connector (14) of the zero insertion force type includes a pair of opposing blocks (30, 32) defining a longitudinal guideway (34) therebetween. Opposite corresonding pairs of female contacts (52, 54) are disposed in transverse holes in the blocks (30, 32), and male contacts (60) are slidably supported in the female contacts in one block for selective actuation into or out of sliding engagement with the female contacts in the other block responsive to insertion of a slider (36).
摘要翻译： 零插入力类型的电边缘连接器（14）包括在其间限定纵向导轨（34）的一对相对的块（30,32）。 相对的相对对的阴触头对（52,54）设置在块（30,32）中的横向孔中，并且阳触头（60）可滑动地支撑在一个块中的阴触头中，用于选择性地致动进入或流出滑动接合 其中响应于插入滑块（36）的另一块中的阴接触件。
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公开(公告)号：US4949453A
公开(公告)日：1990-08-21
申请号：US366604
申请日：1989-06-15
申请人： Eugene F. Neumann , Melvin C. August , James N. Kruchowski , Stephen Nelson , Richard R. Steitz
发明人： Eugene F. Neumann , Melvin C. August , James N. Kruchowski , Stephen Nelson , Richard R. Steitz
IPC分类号： H01L23/498 , H01L23/538 , H01L23/64
CPC分类号： H01L23/5382 , H01L23/49838 , H01L23/647 , H01L24/50 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/16152 , H01L2924/3011 , Y10T29/49099 , Y10T29/49155 , Y10T29/49156
摘要： A generic chip carrier is described which includes, as integral parts, a voltage bus and a plurality of terminating resistors connected between the voltage bus and signal traces on the carrier. The voltage bus wraps around the chip carrier, thus providing a large area of metal. Through the selective use of the terminating resistors, the generic carrier can be customized for a particular type of integrated circuit, i.e., source or destination termination of signals. A signal trace may be customized by "opening" the terminating resistor with a current spike applied by a standard electrical probe. Spare bonding pads and terminating resistors are placed at intervals about the periphery of the carrier as insurance against defective or mistakenly removed terminating resistors.
摘要翻译： 描述了通用芯片载体，其包括连接在载波上的电压总线和信号迹线之间的电压总线和多个终端电阻的组成部分。 电压总线缠绕在芯片载体上，从而提供大面积的金属。 通过选择性地使用终端电阻器，可以为特定类型的集成电路定制通用载波，即信号的源或目的地终止。 可以通过用标准电探针施加的电流尖峰“终止”端接电阻来定制信号迹线。 备用接合焊盘和终端电阻器以围绕载体周边的间隔放置，作为对有缺陷或错误去除的终端电阻器的保险。
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公开(公告)号：USH1153H
公开(公告)日：1993-03-02
申请号：US646834
申请日：1991-01-28
申请人： Melvin C. August , Diane M. Christie , Arthur J. Hebert , Eugene F. Neumann , Richard R. Steitz
发明人： Melvin C. August , Diane M. Christie , Arthur J. Hebert , Eugene F. Neumann , Richard R. Steitz
IPC分类号： H01L23/057 , H01L23/10 , H01L23/498
CPC分类号： H01L23/10 , H01L23/057 , H01L23/4985 , H01L2924/09701 , H01L2924/15153 , H01L2924/15165 , H01L2924/15173 , H01L2924/16152
摘要： A hermetically sealed carrier for integrated circuits has an IC placed on a carrier substrate, and an electrical lead apparatus, comprised of a highly heat resistant substrate with a metallized interconnect pattern deposited thereon, connected to the IC and brought out across and over the edges of the carrier substrate to facilitate electrical connection to a circuit board. A lid is provided which is placed over the IC. A low-melting temperature adhesive means is then placed on the lid-to-carrier interface and is exposed to heat hermetically sealing the IC. A hermetically sealed carrier including a single silicon die which includes both an active region where an integrated circuit may be fabricated and an inactive region is also provided. Electrical leads are electrically interconnected to the IC of the active region and extend to the periphery of the inactive region of the silicon die. A lid and adhesive means is provided for hermetically sealing the IC of the active region.
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公开(公告)号：US4911645A
公开(公告)日：1990-03-27
申请号：US284905
申请日：1988-12-14
IPC分类号： H01R12/82
CPC分类号： H01R12/82
摘要： The present invention provides a parallel board connector having zero insertion force between a PC board and a backplane which presents effectively zero impedance change through the connector interface. The PC board and the backplane to which it is to be connected have through-plated holes. The boards are positioned to overlap such that the through-plated holes are axially aligned. A shuttle block is provided with a number of parallel dual flex pins attached to one surface. To effect connection, the flex pins of the shuttle block are inserted through the holes of one board and into the holes of a second board to provide an electrical connection having very low or no impedance interface.
摘要翻译： 本发明提供了一种在PC板和背板之间具有零插入力的平行板连接器，其通过连接器接口有效地呈现零阻抗变化。 要连接的PC板和背板具有通孔。 这些板被定位成重叠，使得穿通孔轴向对准。 穿梭块设置有连接到一个表面的多个平行的双挠性销。 为了实现连接，梭子块的柔性销插入穿过一个板的孔并进入第二板的孔中以提供具有非常低或没有阻抗接口的电连接。
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10.发明授权
公开(公告)号：US5358826A
公开(公告)日：1994-10-25
申请号：US884285
申请日：1992-05-08
IPC分类号： H01L21/48 , H01L23/13 , H01L23/498 , H01L23/538 , G03F7/00
CPC分类号： H01L23/13 , H01L21/4846 , H01L23/49866 , H01L23/5386 , H01L2924/0002 , Y10S257/915
摘要： A method for simultaneously manufacturing metallized carriers from wafer-shaped substrates is described, wherein such wafer-shaped substrates permit the use of standard IC fabrication apparatus and methods. As a result, very thin and finely dimensioned traces can be deposited. Thin-film manufacturing techniques are used to create the high-density traces on the surface of the chip carriers, thereby permitting direct connections from the IC to the periphery of the carrier without the need for vias. A lid hermetically seals and protects the package. The traces are comprised of a plurality of metals to facilitate bonding, each of the metals homogeneous for a portion of the trace. One metal portion of the trace is of a type compatible with an IC chip placed in the carrier. Another metal portion of the trace is of a type compatible with a trace on a printed circuit board. A metal barrier is interposed between the metals to prevent metal diffusion from one metal to an adjoining portion of another metal.
摘要翻译： 描述了从晶片状基板同时制造金属化载体的方法，其中这种晶片状基板允许使用标准IC制造装置和方法。 因此，可以沉积非常薄且精细尺寸的迹线。 使用薄膜制造技术来在芯片载体的表面上产生高密度迹线，从而允许从IC直接连接到载体的外围，而不需要通孔。 盖子密封并保护包装。 痕迹由多个金属组成以便于粘合，每个金属对于痕迹的一部分是均匀的。 迹线的一个金属部分是与放置在载体中的IC芯片兼容的类型。 迹线的另一金属部分是与印刷电路板上的迹线相兼容的类型。 在金属之间插入金属阻挡层，以防止金属从一种金属扩散到另一种金属的邻接部分。
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