摘要:
An apparatus and method of audio encoding and decoding based on a Variable Bit Rate (VBR) is provided. The audio encoding and decoding apparatus and method may determine an optimum bit rate per superframe and per frame, determine an optimum encoding mode by applying an open-loop mode/closed-loop mode based on a characteristic of an audio signal, and perform indexing based on the optimum encoding mode.
摘要:
An apparatus and method for encoding and decoding a spatial parameter are provided. A spatial parameter encoding apparatus may encode a spatial parameter using a correlation between spatial parameters indicating a characteristic relationship between channels of a multi-channel audio signal, so that the multi-channel audio signal may be efficiently encoded.
摘要:
Disclosed is an apparatus for encoding and decoding multi-channel signals. The apparatus for encoding the multi-channel signals may shift a phase of the multi-channel signals based on a characteristic of the multi-channel signals. An encoded bitstream with respect to the multi-channel signals may be generated using a downmix signal and a residual signal extracted from the phase-shifted multi-channel signals.
摘要:
An apparatus and method for encoding and decoding a spatial parameter are provided. A spatial parameter encoding apparatus may encode a spatial parameter using a correlation between spatial parameters indicating a characteristic relationship between channels of a multi-channel audio signal, so that the multi-channel audio signal may be efficiently encoded.
摘要:
Disclosed is an apparatus for encoding and decoding multi-channel signals. The apparatus for encoding the multi-channel signals may shift a phase of the multi-channel signals based on a characteristic of the multi-channel signals. An encoded bitstream with respect to the multi-channel signals may be generated using a downmix signal and a residual signal extracted from the phase-shifted multi-channel signals.
摘要:
A resist underlayer composition and a method of manufacturing a semiconductor integrated circuit device, the composition including a solvent and an organosilane polymer, the organosilane polymer being a condensation polymerization product of at least one first compound represented by Chemical Formulae 1 and 2 and at least one second compound represented by Chemical Formulae 3 to 5.
摘要:
Methods are provided for fabricating a semiconductor device that include the steps of: sequentially forming a metal interconnection and a protecting layer on a semiconductor substrate; forming a contact hole on the protecting layer; isolating the contact hole by forming a molding layer and an etching stop layer stacked thereon; forming a sacrificial layer on the etching stop layer so as to fill the contact hole; forming a photoresist layer with an opening so as to expose the sacrificial layer and such that the opening of the photoresist layer aligns with the contact hole; forming a trench in the molding layer to penetrate the sacrificial layer and the etching stop layer; and performing a wet etching on the semiconductor substrate having the trench to remove the photoresist layer and the sacrificial layer, wherein the wet etching step is performed using an organic compound and fluoride ion-based buffered solution.
摘要:
Etching solutions are disclosed for etching low-k dielectric layers on substrates, said solutions including effective proportions of an oxidant for oxidizing a low-k dielectric layer and effective proportions of an oxide etchant for removing oxides. It is possible to easily remove a low-k dielectric layer using such etching solutions by a single-stage treatment process.
摘要:
Methods are provided for fabricating a semiconductor device that include the steps of: sequentially forming a metal interconnection and a protecting layer on a semiconductor substrate; forming a contact hole on the protecting layer; isolating the contact hole by forming a molding layer and an etching stop layer stacked thereon; forming a sacrificial layer on the etching stop layer so as to fill the contact hole; forming a photoresist layer with an opening so as to expose the sacrificial layer and such that the opening of the photoresist layer aligns with the contact hole; forming a trench in the molding layer to penetrate the sacrificial layer and the etching stop layer; and performing a wet etching on the semiconductor substrate having the trench to remove the photoresist layer and the sacrificial layer, wherein the wet etching step is performed using an organic compound and fluoride ion-based buffered solution.
摘要:
A resist underlayer composition and a method of manufacturing a semiconductor integrated circuit device, the composition including a solvent and an organosilane polymer, the organosilane polymer being a condensation polymerization product of at least one first compound represented by Chemical Formulae 1 and 2 and at least one second compound represented by Chemical Formulae 3 to 5.