公开(公告)号：US06514063B2

公开(公告)日：2003-02-04

申请号：US09792961

申请日：2001-02-26

申请人： Michael A. Acciai ,  Richard R. Hall ,  John T. Legg

发明人： Michael A. Acciai ,  Richard R. Hall ,  John T. Legg

IPC分类号： B29C4500

CPC分类号： A61F2/90

摘要： The present invention relates to a method and tooling for forming a stent and the stent so formed. The stent includes filaments of a first material and joints of a second material. The present invention also discloses the above described stent in combination with an angioplasty balloon. The tooling in accordance with the present invention provides a fixture having grooves that receive the filaments of the stent to hold the filaments in place for joining. The joining of all of the filaments can be performed simultaneously by laser welding or injection molding a joint material. The tooling in accordance with the present invention also provides the capability to mold the stent as one piece. The method in accordance with the present invention includes the steps of providing a fixture with internal grooves, placing filaments into the grooves and joining the filaments together. The method also includes providing a mold having internal grooves, and injecting a molten material into the mold to fill the grooves so as to create a one-piece stent of polymer and/or metallic materials.

摘要翻译： 本发明涉及用于形成支架的方法和工具以及如此形成的支架。 支架包括第一材料的细丝和第二材料的接头。 本发明还公开了与血管成形术气囊组合的上述支架。 根据本发明的工具提供了具有凹槽的固定装置，该槽具有容纳支架的长丝以将细丝保持在合适的位置。 所有长丝的接合可以通过激光焊接或注射成型接合材料同时进行。 根据本发明的模具还提供了将支架模制成一体的能力。 根据本发明的方法包括以下步骤：为灯具提供内部凹槽，将细丝放入凹槽中并将细丝连接在一起。 该方法还包括提供具有内部凹槽的模具，并将熔融材料注入到模具中以填充凹槽，以便形成聚合物和/或金属材料的一体式支架。

公开(公告)号：US06193829B1

公开(公告)日：2001-02-27

申请号：US09226726

申请日：1999-01-07

申请人： Michael A. Acciai ,  Richard R. Hall ,  John T. Legg

发明人： Michael A. Acciai ,  Richard R. Hall ,  John T. Legg

IPC分类号： D04H314

CPC分类号： A61F2/90 ,  A61F2/88 ,  A61F2230/0013 ,  A61F2230/006

摘要： The present invention relates to a method and tooling for forming a stent and the stent so formed. The stent includes filaments of a first material and joints of a second material. The present invention also discloses the above described stent in combination with an angioplasty balloon. The tooling in accordance with the present invention provides a fixture having grooves that receive the filaments of the stent to hold the filaments in place for joining. The joining of all of the filaments can be performed simultaneously by laser welding or injection molding a joint material. The tooling in accordance with the present invention also provides the capability to mold the stent as one piece. The method in accordance with the present invention includes the steps of providing a fixture with internal grooves, placing filaments into the grooves and joining the filaments together. The method also includes providing a mold having internal grooves, and injecting a molten material into the mold to fill the grooves so as to create a one-piece stent of polymer and/or metallic materials.

摘要翻译： 本发明涉及用于形成支架的方法和工具以及如此形成的支架。 支架包括第一材料的细丝和第二材料的接头。 本发明还公开了与血管成形术气囊组合的上述支架。 根据本发明的工具提供了具有凹槽的固定装置，该槽具有容纳支架的长丝以将细丝保持在合适的位置。 所有长丝的接合可以通过激光焊接或注射成型接合材料同时进行。 根据本发明的模具还提供了将支架模制成一体的能力。 根据本发明的方法包括以下步骤：为灯具提供内部凹槽，将细丝放入凹槽中并将细丝连接在一起。 该方法还包括提供具有内部凹槽的模具，并将熔融材料注入到模具中以填充凹槽，以便形成聚合物和/或金属材料的一体式支架。

公开(公告)号：US06814503B2

公开(公告)日：2004-11-09

申请号：US10215175

申请日：2002-08-07

申请人： Richard R. Hall ,  How Tzu Lin ,  Candido C. Tiberia

发明人： Richard R. Hall ,  How Tzu Lin ,  Candido C. Tiberia

IPC分类号： G02B636

CPC分类号： G02B6/4225 ,  G02B6/4226

摘要： A method and apparatus are disclosed for aligning an array of light transmitting elements to an array of photosensitive detectors. The array is adjusted along three axes. Any element (a coupled transmitting and detecting unit of the array) can be selected as the center of rotation. Small angular correction is made about the selected element by differentially moving the array in two axes, using adjustment tools. Alignment is accomplished by performing translational movement in the horizontal X and Y axes until a signal is detected. A rotational correction about the selected element is performed by moving one of a pair of adjustment devices until maximum light intensity is achieved for the end elements. Next, the array is scanned for the weakest performing element in the array. The alignment procedure is repeated until the performance of all of the elements in the array fall within a pre-established specification range.

公开(公告)号：US06454469B1

公开(公告)日：2002-09-24

申请号：US09343071

申请日：1999-06-29

申请人： Richard R. Hall ,  How Tzu Lin

发明人： Richard R. Hall ,  How Tzu Lin

IPC分类号： G02B626

CPC分类号： G02B6/4249 ,  G02B6/421 ,  G02B6/4225 ,  G02B6/4226 ,  G02B6/424 ,  G02B6/4269 ,  G02B6/4286

摘要： An optical coupling assembly is described that optically aligns an opto-electronic device, such as a Vertical Cavity Surface Emitting Laser (VCSEL) chip, with a fiber optic coupler upon a heatsink substrate. The assembly has a number of biasing elements that acts against the coupler to provide contact with mating surfaces. Adjustment devices, such as screws, acting against the coupler and biasing elements, are adjusted until the fiber optic transmitting elements of the coupler align with the opto-electronic device light emitting elements. Photodetectors disposed upon a distal end of the coupler receive the light from the opto-electronic device, and provide a mechanism to detect optimum alignment.

摘要翻译： 描述了一种光耦合组件，其将诸如垂直腔面发射激光（VCSEL）芯片的光电器件与光纤耦合器光学对准在散热衬底上。 该组件具有多个偏置元件，该元件作用于联接器以提供与配合表面的接触。 调整作用于耦合器和偏置元件的诸如螺钉的调节装置，直到耦合器的光纤传输元件与光电器件发光元件对准。 设置在耦合器的远端的光电检测器接收来自光电子器件的光，并提供检测最佳对准的机构。

公开(公告)号：US5163834A

公开(公告)日：1992-11-17

申请号：US734419

申请日：1991-07-23

申请人： Fletcher W. Chapin ,  David W. Dranchak ,  David E. Engle ,  Richard R. Hall ,  Thomas G. Macek

发明人： Fletcher W. Chapin ,  David W. Dranchak ,  David E. Engle ,  Richard R. Hall ,  Thomas G. Macek

IPC分类号： H01R13/24 ,  H05K3/32 ,  H05K3/36

CPC分类号： H01R13/2435 ,  H01R12/52 ,  H01R12/714 ,  H05K3/325 ,  H05K3/368

摘要： An electrical connector for interconnecting a pair of circuit members (e.g., circuit module and printed circuit board) which assures highly reliable yet separable connections for these members. The connector includes an electrically insulative (e.g., plastic) frame which defines an internal opening therein. Bridging this opening are a plurality of individual, resilient contact members which are maintained in a suspended and spaced orientation within the opening by a plurality of pairs of elongated insulative members (e.g., polymer rods). Each of the contacts is thus readily removable from the connector's frame to thus facilitate repair and/or replacement. As described, the connector is capable of providing wiping connections, thus assuring removal of debris or other contaminants from the respective conductive pads for each circuit member. In another embodiment, the connector includes a common carrier (e.g., plastic) having therein a plurality of cylindrical shaped resilient contact members (e.g., silicone) which further include a quantity of conductive (e.g., metallic) particles therein. To assure a wiping form of engagement with the respective conductive pads, each of the terminal ends of each contact member preferably includes a plurality of dendritic, interdigitated members thereon.

摘要翻译： 用于互连一对电路构件（例如，电路模块和印刷电路板）的电连接器，其确保用于这些构件的高度可靠但可分离的连接。 连接器包括在其中限定内部开口的电绝缘（例如，塑料）框架。 桥接该开口是多个单独的弹性接触构件，其通过多对细长的绝缘构件（例如，聚合物棒）在开口内保持悬挂和间隔的取向。 因此，每个触头可以容易地从连接器的框架移除，从而便于维修和/或更换。 如上所述，连接器能够提供擦拭连接，从而确保从每个电路构件的相应导电焊盘去除碎屑或其它污染物。 在另一个实施例中，连接器包括共同的载体（例如，塑料），其中具有多个圆柱形弹性接触构件（例如硅树脂），其还包括一定数量的导电（例如金属）颗粒。 为了确保与各个导电垫的擦拭形式的接合，每个接触构件的每个末端优选地在其上包括多个树枝状的叉指构件。

公开(公告)号：US09263797B1

公开(公告)日：2016-02-16

申请号：US13205261

申请日：2011-08-08

申请人： Richard R. Hall ,  Peter M. Nichols

发明人： Richard R. Hall ,  Peter M. Nichols

IPC分类号： H01Q3/00 ,  H01Q3/08 ,  H01Q3/02

CPC分类号： H01Q3/08 ,  H01Q1/12 ,  H01Q1/125 ,  H01Q3/00 ,  H01Q3/02

摘要： A system comprises a base having a sensor support frame moveably mounted thereto such that the support frame is pivotal about at least two axes with respect to a pivot point. A sensor is coupled to the support frame. At least one actuator is provided for pivoting the support frame about the pivot point.

摘要翻译： 系统包括具有可移动地安装到其上的传感器支撑框架的底座，使得支撑框架围绕关于枢轴点的至少两个轴线枢转。 传感器耦合到支撑框架。 提供至少一个致动器用于绕支点枢转支撑框架。

公开(公告)号：US20080278386A1

公开(公告)日：2008-11-13

申请号：US11800600

申请日：2007-05-07

申请人： Richard R. Hall ,  Stanley M. Granat

发明人： Richard R. Hall ,  Stanley M. Granat

IPC分类号： G01R29/08 ,  H01Q3/02

CPC分类号： G01S7/4026 ,  G01S13/87 ,  G01S2007/403 ,  G01S2007/4034 ,  G01S2013/0245 ,  H01Q1/1235 ,  H01Q3/02 ,  H01Q3/267

摘要： A radar apparatus including: a radar antenna array; and, a sensor for detecting a relative distortion of at least one portion of the radar antenna relative to at least one other portion of the radar antenna array.

摘要翻译： 一种雷达装置，包括：雷达天线阵列; 以及用于检测雷达天线的至少一部分相对于雷达天线阵列的至少另一部分的相对失真的传感器。

公开(公告)号：US06741778B1

公开(公告)日：2004-05-25

申请号：US09578216

申请日：2000-05-23

申请人： Benson Chan ,  Richard R. Hall ,  How Tzu Lin ,  John H. Sherman

发明人： Benson Chan ,  Richard R. Hall ,  How Tzu Lin ,  John H. Sherman

IPC分类号： G02B626

CPC分类号： G02B6/4232 ,  G02B6/421 ,  G02B6/4231 ,  G02B6/4236 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/4244 ,  G02B6/4249 ,  G02B6/426

摘要： Optical packages and a method of fabricating same, wherein an active optical device can be located relative to a substrate and coupler. The structure includes a substrate having electrical contact pads and alignment pads with precision aligned through-holes for at least one optical fiber. The optical fibers are supported by a housing, or coupler, having alignment pins that are precision located relative to the through-holes in the substrate and the optical fiber. A die, or active optical device, with one or more active optical elements on a first die surface and electrical contacts on a second die surface, is aligned with the electrical pads of the substrate and the active optical elements. The method incorporates the steps of grinding alignment pins into metallic pads and grinding optical fibers in one pass and then aligning the active optical device and the optical fibers by using the surface tension of conductive adhesive liquid. The fibers are then bonded.

摘要翻译： 光学封装及其制造方法，其中有源光学器件可相对于衬底和耦合器定位。 该结构包括具有电接触焊盘和具有用于至少一个光纤的精确对准的通孔的对准焊盘的衬底。 光纤由具有相对于衬底和光纤中的通孔精确定位的对准引脚的壳体或耦合器支撑。 与第一裸片表面上的一个或多个有源光学元件和第二裸片表面上的电接触的裸片或有源光学器件与衬底和有源光学元件的电焊盘对准。 该方法包括将对准针磨成金属垫并一次研磨光纤的步骤，然后通过使用导电粘合剂液体的表面张力来对准有源光学器件和光纤。 然后粘合纤维。

公开(公告)号：US06635866B2

公开(公告)日：2003-10-21

申请号：US09838645

申请日：2001-04-19

申请人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

发明人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

IPC分类号： H01J502

CPC分类号： G02B6/4292 ,  G02B6/3885 ,  G02B6/3897 ,  G02B6/4232 ,  G02B6/4249

摘要： An optical coupler that provides for the direct mounting of integrated circuit(s). The coupler includes a two-part housing with grooves for accommodating optical fibers that are held in place when the two parts are put together. Circuitry is formed on the housing and solder balls, when heated to a liquid state and cooled (reflowed), are used to attach integrated circuit(s) onto the housing. At least one of these integrated circuit(s) is an optical die that is positioned in close proximity to the optical fibers to provide for the receipt and/or transmission of optical signals. The reflowing of the solder balls forms an electrical connection between the circuitry on the housing and the integrated circuit(s) and provides for alignment of these components. The housing is attached to a circuitized substrate using reflowed solder balls or wirebonds.

公开(公告)号：US06234687B1

公开(公告)日：2001-05-22

申请号：US09384094

申请日：1999-08-27

申请人： Richard R. Hall ,  How Tzu Lin

发明人： Richard R. Hall ,  How Tzu Lin

IPC分类号： G02B636

CPC分类号： G02B6/4231 ,  G02B6/421 ,  G02B6/423

摘要： An assembly is described that consists of a gallium arsenide die chip and a fiber optic coupler bonded together about their respective mating surfaces. The chip includes laser light emitters. The fiber optic coupler has fiber optic light transmitters that require precise alignment with the laser light emitters of the chip about their mating surfaces. After alignment of the emitting/receiving and transmitting elements, the mating surfaces of the chip and coupler are bonded together.

摘要翻译： 描述了由砷化镓晶片芯片和耦合在其各自配合表面上的光纤耦合器组成的组件。 该芯片包括激光发射器。 光纤耦合器具有光纤光发射器，其需要与芯片的激光发射器精确对准其配合表面。 在发射/接收和发射元件对准之后，芯片和耦合器的配合表面结合在一起。