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1.发明授权Electronic devices having metallurgies containing copper-semiconductor compounds 失效具有包含铜半导体化合物的冶金的电子器件
公开(公告)号：US5633047A
公开(公告)日：1997-05-27
申请号：US449196
申请日：1995-05-24
申请人： Michael J. Brady , Curtis E. Farrell , Sung K. Kang , Jeffrey R. Marino , Donald J. Mikalsen , Paul A. Moskowitz , Eugene J. O'Sullivan , Terrence R. O'Toole , Sampath Purushothaman , Sheldon C. Rieley , George F. Walker
发明人： Michael J. Brady , Curtis E. Farrell , Sung K. Kang , Jeffrey R. Marino , Donald J. Mikalsen , Paul A. Moskowitz , Eugene J. O'Sullivan , Terrence R. O'Toole , Sampath Purushothaman , Sheldon C. Rieley , George F. Walker
IPC分类号： C23C18/50 , C25D3/54 , H01L23/495 , H01L23/532 , B05D1/18
CPC分类号： H01L24/12 , C23C18/50 , C25D3/54 , H01L23/4951 , H01L23/53271 , H01L24/05 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05644 , H01L2224/05647 , H01L2224/13099 , H01L2224/32014 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/4847 , H01L2224/48644 , H01L2224/48647 , H01L2224/48747 , H01L2224/48844 , H01L2224/48847 , H01L2224/73215 , H01L2224/85201 , H01L2224/85205 , H01L2224/85214 , H01L24/45 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12042 , H01L2924/14 , H01L2924/15747 , H01L2924/15787 , H01L2924/181
摘要： Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.
摘要翻译： 在电子设备中的导体的表面使用含锗和锗的材料。 焊料可无焊接，电线可以与这些表面引线接合。 这些材料用作用于封装集成电路芯片的引线框架的表面涂层。 这些材料可以贴花地转移到导体表面上，或者无电解或电解地放置在其上。
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公开(公告)号：US5608260A
公开(公告)日：1997-03-04
申请号：US366633
申请日：1994-12-30
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L2224/05554 , H01L2224/32245 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/85439 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/12042 , H01L2924/14
摘要： A leadframe has conductive fingers with an insulating film located on a first portion of the fingers. The insulating film has openings into which contact pads formed of a noble metal are provided. Pads on a chip are wire bonded to these contact pads on the leadframe. The first portion is encapsulated in a molded package. The structure inhibits silver migration, provides insulation between wires and leadframe, and provides improved adhesion between plastic package and leadframe. A single insulating film with openings for providing the contact pads provides all these features.
摘要翻译： 引线框架具有导电指状物，其中绝缘膜位于手指的第一部分上。 绝缘膜具有开口，由贵金属形成的接触垫设置在该开口中。 芯片上的焊盘被引线接合到引线框上的这些接触焊盘。 第一部分被封装在模制包装中。 该结构抑制银迁移，提供电线和引线框架之间的绝缘，并提供塑料封装和引线框架之间的改进的粘合性。 具有用于提供接触垫的开口的单个绝缘膜提供了所有这些特征。
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公开(公告)号：US5776801A
公开(公告)日：1998-07-07
申请号：US606513
申请日：1996-02-23
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/4951 , H01L2224/05554 , H01L2224/32245 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/85439 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/12042 , H01L2924/14
摘要： A leadframe has conductive fingers with an insulating film located on a first portion of the fingers. The insulating film has openings into which contact pads formed of a noble metal are provided. Pads on a chip are wire bonded to these contact pads on the leadframe. The first portion is encapsulated in a molded package. The structure inhibits silver migration, provides insulation between wires and leadframe, and provides improved adhesion between plastic package and leadframe. A single insulating film with openings for providing the contact pads provides all these features.
摘要翻译： 引线框架具有导电指状物，其中绝缘膜位于手指的第一部分上。 绝缘膜具有开口，由贵金属形成的接触垫设置在该开口中。 芯片上的焊盘被引线接合到引线框上的这些接触焊盘。 第一部分被封装在模制包装中。 该结构抑制银迁移，提供电线和引线框架之间的绝缘，并提供塑料封装和引线框架之间的改进的粘合性。 具有用于提供接触垫的开口的单个绝缘膜提供了所有这些特征。
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4.发明授权Personalized area leadframe coining or half etching for reduced mechanical stress at device edge 失效个性化区域引线框压印或半刻蚀，以减少器件边缘的机械应力
公开(公告)号：US5576246A
公开(公告)日：1996-11-19
申请号：US458848
申请日：1995-06-02
申请人： Harold W. Conru , Francis E. Froebel , Albert J. Gregoritsch, Jr. , Sheldon C. Rieley , Stephen G. Starr , Ronald R. Uttecht , Eric J. White , Jens G. Pohl
发明人： Harold W. Conru , Francis E. Froebel , Albert J. Gregoritsch, Jr. , Sheldon C. Rieley , Stephen G. Starr , Ronald R. Uttecht , Eric J. White , Jens G. Pohl
IPC分类号： H01L23/50 , H01L23/00 , H01L23/495 , H01L21/60
CPC分类号： H01L23/564 , H01L23/4951 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L24/48 , H01L2924/00014 , H01L2924/07802 , H01L2924/14 , H01L2924/3011 , Y10T29/49121
摘要： A lead on chip (LOC) semiconductor leadframe package provides notched lead-fingers to eliminate mechanical shear-stress at the peripheral edge of a semiconductor chip. Opposite rows of substantially flat cantilevered lead-fingers are attached by double-sided adhesive tape in thermal contact with the active face of a chip. The lead-fingers are routed in personalized paths over the face of the chip to cover a large surface area to aid heat dissipation. All wirebond connections between the lead-fingers and the chip are made at a centerline connection strip running down the center of the chip. Each of the cantilevered lead-fingers has a notched portion positioned directly over the vulnerable peripheral chip edge to reduce thermal, mechanical shear-stress. Additionally, since corrosion typically follows a lead path, the notch provides increasing path length to prevent corrosive ingress over the chip face.
摘要翻译： 片上芯片（LOC）半导体引线框封装提供缺口引线以消除半导体芯片外围边缘的机械剪切应力。 基本上平坦的悬臂式引指的相对排通过双面胶带与芯片的主动面热接触。 引线指状物以个性化的路径布置在芯片的表面上以覆盖大的表面积以有助于散热。 引线指和芯片之间的所有引线键合都是在沿芯片中心延伸的中心线连接条上制成的。 每个悬臂的引指具有直接位于脆弱的外围芯片边缘上方的切口部分，以减少热，机械剪切应力。 此外，由于腐蚀通常遵循引导路径，所以凹口提供增加的路径长度以防止在芯片表面上的腐蚀性侵入。
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5.发明授权Personalized area leadframe coining or half etching for reduced mechanical stress at device edge 失效个性化区域引线框压印或半刻蚀，以减少器件边缘的机械应力
公开(公告)号：US5545921A
公开(公告)日：1996-08-13
申请号：US334478
申请日：1994-11-04
申请人： Harold W. Conru , Francis E. Froebel , Albert J. Gregoritsch, Jr. , Sheldon C. Rieley , Stephen G. Starr , Ronald R. Uttecht , Eric J. White , Jens G. Pohl
发明人： Harold W. Conru , Francis E. Froebel , Albert J. Gregoritsch, Jr. , Sheldon C. Rieley , Stephen G. Starr , Ronald R. Uttecht , Eric J. White , Jens G. Pohl
IPC分类号： H01L23/50 , H01L23/00 , H01L23/495 , H01L23/48
CPC分类号： H01L23/564 , H01L23/4951 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L24/48 , H01L2924/00014 , H01L2924/07802 , H01L2924/14 , H01L2924/3011 , Y10T29/49121
摘要： A lead on chip (LOC) semiconductor leadframe package provides notched lead-fingers to eliminate mechanical shear-stress at the peripheral edge of a semiconductor chip. Opposite rows of substantially flat cantilevered lead-fingers are attached by double-sided adhesive tape in thermal contact with the active face of a chip. The lead-fingers are routed in personalized paths over the face of the chip to cover a large surface area to aid heat dissipation. All wirebond connections between the lead-fingers and the chip are made at a centerline connection strip running down the center of the chip. Each of the cantilevered lead-fingers has a notched portion positioned directly over the vulnerable peripheral chip edge to reduce thermal, mechanical shear-stress. Additionally, since corrosion typically follows a lead path, the notch provides an increasing path length to prevent corrosive ingress over the chip face.
摘要翻译： 片上芯片（LOC）半导体引线框封装提供缺口引线以消除半导体芯片外围边缘的机械剪切应力。 基本上平坦的悬臂式引指的相对排通过双面胶带与芯片的主动面热接触。 引线指状物以个性化的路径布置在芯片的表面上以覆盖大的表面积以有助于散热。 引线指和芯片之间的所有引线键合都是在沿芯片中心延伸的中心线连接条上制成的。 每个悬臂的引指具有直接位于脆弱的外围芯片边缘上方的切口部分，以减少热，机械剪切应力。 此外，由于腐蚀通常遵循引导路径，所以凹口提供增加的路径长度以防止在芯片表面上的腐蚀性侵入。
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