公开(公告)号：US20180358275A1

公开(公告)日：2018-12-13

申请号：US15621102

申请日：2017-06-13

Applicant: Micron Technology, Inc.

Inventor： Chan Yoo ,  Akshay Singh ,  Yi Xu ,  Liana Foster ,  Steven Eskildsen

IPC: H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L23/48

CPC classification number: H01L23/3114 ,  H01L23/481 ,  H01L24/19 ,  H01L24/20 ,  H01L24/45 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657

Abstract: A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.

公开(公告)号：US20190088565A1

公开(公告)日：2019-03-21

申请号：US16196262

申请日：2018-11-20

Applicant: Micron Technology, Inc.

Inventor： Chan Yoo ,  Akshay Singh ,  Yi Xu ,  Liana Foster ,  Steven Eskildsen

IPC: H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L23/48

CPC classification number: H01L23/3114 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/19 ,  H01L24/20 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45169 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3862 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.

公开(公告)号：US10366934B2

公开(公告)日：2019-07-30

申请号：US16196262

申请日：2018-11-20

Applicant: Micron Technology, Inc.

Inventor： Chan Yoo ,  Akshay Singh ,  Yi Xu ,  Liana Foster ,  Steven Eskildsen

IPC: H01L23/02 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L23/48

Abstract: A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.

公开(公告)号：US10153221B1

公开(公告)日：2018-12-11

申请号：US15621102

申请日：2017-06-13

Applicant: Micron Technology, Inc.

Inventor： Chan Yoo ,  Akshay Singh ,  Yi Xu ,  Liana Foster ,  Steven Eskildsen

IPC: H01L23/02 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L23/48

CPC classification number: H01L23/3114 ,  H01L23/481 ,  H01L24/19 ,  H01L24/20 ,  H01L24/45 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657

Abstract: A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.