公开(公告)号：US20180358275A1

公开(公告)日：2018-12-13

申请号：US15621102

申请日：2017-06-13

申请人： Micron Technology, Inc.

发明人： Chan Yoo ,  Akshay Singh ,  Yi Xu ,  Liana Foster ,  Steven Eskildsen

IPC分类号： H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L23/48

CPC分类号： H01L23/3114 ,  H01L23/481 ,  H01L24/19 ,  H01L24/20 ,  H01L24/45 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657

摘要： A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.

公开(公告)号：US20190088565A1

公开(公告)日：2019-03-21

申请号：US16196262

申请日：2018-11-20

申请人： Micron Technology, Inc.

发明人： Chan Yoo ,  Akshay Singh ,  Yi Xu ,  Liana Foster ,  Steven Eskildsen

IPC分类号： H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L23/48

CPC分类号： H01L23/3114 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/19 ,  H01L24/20 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45169 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3862 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.

公开(公告)号：US10366934B2

公开(公告)日：2019-07-30

申请号：US16196262

申请日：2018-11-20

申请人： Micron Technology, Inc.

发明人： Chan Yoo ,  Akshay Singh ,  Yi Xu ,  Liana Foster ,  Steven Eskildsen

IPC分类号： H01L23/02 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L23/48

摘要： A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.

公开(公告)号：US10153221B1

公开(公告)日：2018-12-11

申请号：US15621102

申请日：2017-06-13

申请人： Micron Technology, Inc.

发明人： Chan Yoo ,  Akshay Singh ,  Yi Xu ,  Liana Foster ,  Steven Eskildsen

IPC分类号： H01L23/02 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L23/48

CPC分类号： H01L23/3114 ,  H01L23/481 ,  H01L24/19 ,  H01L24/20 ,  H01L24/45 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657

摘要： A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.

公开(公告)号：US09601374B2

公开(公告)日：2017-03-21

申请号：US14669780

申请日：2015-03-26

申请人： Micron Technology, Inc.

发明人： Owen R. Fay ,  Liana Foster

IPC分类号： H01L25/065 ,  H01L21/78 ,  H01L25/00 ,  H01L25/18

CPC分类号： H01L21/78 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/29294 ,  H01L2224/2939 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81211 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2224/8385 ,  H01L2224/85051 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/8581 ,  H01L2224/85815 ,  H01L2224/85951 ,  H01L2224/92147 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06558 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/18161 ,  H01L2224/32145 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/81 ,  H01L2924/00

摘要： A semiconductor die assembly having a solderball wirebonded to a substrate. As an example, the semiconductor die assembly may include the solderball attached to a bond pad on a face surface of a memory die. A non-face surface of the memory die can be attached to the substrate. A wire can be wirebonded to the solderball at a first end of the wire and connected to the substrate at a second end of the wire.

公开(公告)号：US20160284675A1

公开(公告)日：2016-09-29

申请号：US14669780

申请日：2015-03-26

申请人： Micron Technology, Inc.

发明人： Owen R. Fay ,  Liana Foster

IPC分类号： H01L25/10 ,  H01L21/78 ,  H01L25/00

CPC分类号： H01L21/78 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/29294 ,  H01L2224/2939 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81211 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2224/8385 ,  H01L2224/85051 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/8581 ,  H01L2224/85815 ,  H01L2224/85951 ,  H01L2224/92147 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06558 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/18161 ,  H01L2224/32145 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/81 ,  H01L2924/00

摘要： A semiconductor die assembly having a solderball wirebonded to a substrate. As an example, the semiconductor die assembly may include the solderball attached to a bond pad on a face surface of a memory die. A non-face surface of the memory die can be attached to the substrate. A wire can be wirebonded to the solderball at a first end of the wire and connected to the substrate at a second end of the wire.

摘要翻译： 具有焊接到基板上的焊球的半导体管芯组件。 作为示例，半导体管芯组件可以包括附接到存储器管芯的表面上的接合焊盘的焊球。 存储芯片的非表面表面可以附着在基板上。 导线可以在导线的第一端处与焊球引线接合，并且在导线的第二端处连接到基板。