公开(公告)号：US07479818B2

公开(公告)日：2009-01-20

申请号：US11552102

申请日：2006-10-23

申请人： Min-Ho Park ,  Young-Soo Sohn

发明人： Min-Ho Park ,  Young-Soo Sohn

IPC分类号： H03K3/00

CPC分类号： G11C7/065 ,  G11C7/08 ,  G11C2207/065

摘要： A sense amplifier flip flop including a differential input portion, a differential amplifying portion including a first inverter and a second inverter, and a bias voltage generating portion. The bias voltage generating portion is configured to generate body voltages for transistors of the first inverter and the second inverter so that an offset between electric currents flowing through the differential input portion can be adjusted.

摘要翻译： 一种感测放大器触发器，包括差分输入部分，包括第一反相器和第二反相器的差分放大部分和偏置电压产生部分。 偏置电压产生部分被配置为产生第一反相器和第二反相器的晶体管的体电压，使得可以调节流过差分输入部分的电流之间的偏移。

公开(公告)号：US20050012225A1

公开(公告)日：2005-01-20

申请号：US10852732

申请日：2004-05-24

申请人： Seung-Yong Choi ,  Min-Ho Park ,  Ji-Hwan Kim ,  Rajeev Joshi

发明人： Seung-Yong Choi ,  Min-Ho Park ,  Ji-Hwan Kim ,  Rajeev Joshi

IPC分类号： H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L23/485 ,  H01L23/525 ,  H01L21/48 ,  H01L23/52

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/525 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/838 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/3512

摘要： A packaged semiconductor device (a wafer-level chip scale package) containing a conductive adhesive material as an electrical interconnect route between the semiconductor die and a patterned conductive substrate is described. The patterned conductive substrate acts not only as a substrate, but also as a redistribution layer that converts the dense pad layout of the die to a larger array configuration of the solder balls in the circuit board. Using the invention allows the formation of a lower priced chip scale package that also overcomes the restriction of the die size used in die-sized chip packages and the input-output pattern that can be required by the printed circuit board. Thus, the invention can provide a familiar pitch (i.e.,interface) to the printed circuit board for any small die.

摘要翻译： 描述了包含导电粘合剂材料作为半导体管芯和图案化导电基板之间的电互连路线的封装半导体器件（晶片级芯片级封装）。 图案化导电衬底不仅用作衬底，而且还用作将芯片的致密衬垫布局转换成电路板中的焊球的更大阵列配置的再分配层。 使用本发明允许形成较低价格的芯片级封装，其还克服了芯片尺寸芯片封装中使用的裸片尺寸的限制以及印刷电路板可能需要的输入 - 输出图案。 因此，本发明可以为任何小型芯片提供与印刷电路板的熟悉的间距（即接口）。

公开(公告)号：US20110035077A1

公开(公告)日：2011-02-10

申请号：US12656290

申请日：2010-01-25

申请人： Sung-Woo Lee ,  Bok-Nam Ha ,  Chang-Hoon Shin ,  Min-Ho Park ,  So-Young Park

发明人： Sung-Woo Lee ,  Bok-Nam Ha ,  Chang-Hoon Shin ,  Min-Ho Park ,  So-Young Park

IPC分类号： G06F19/00 ,  G05F1/70

CPC分类号： H02J3/1828 ,  H02J3/1878 ,  Y02E40/30

摘要： Provided are a novel distribution automation system and its voltage control method, which can supply a stable voltage to a user by properly adjusting the settings of a control device so as to compensate for reactive power at each load terminal. The voltage control method includes: a first step of modeling a distribution system in the form of a distribution load based on constants of four terminals according to the connection type of each node and a distribution line, which constitute the distribution system; a second step of determining a formula for estimating the magnitude of a voltage at a node from a current value of an adjacent node; a third step of determining an objective function including the magnitude of the voltage, calculated through the formula determined in the second step, and a control variable for controlling the magnitude of the voltage; and a fourth step of calculating a value of the control variable to allow the determined objective function to have a minimum value and applying the calculated value to each voltage control device provided in the distribution system.

摘要翻译： 提供了一种新颖的配电自动化系统及其电压控制方法，其可以通过适当地调整控制装置的设置来向用户提供稳定的电压，以补偿每个负载端子处的无功功率。 电压控制方法包括：第一步骤，根据构成分配系统的每个节点的连接类型和分配线，基于四个终端的常数以分布负载的形式建模分配系统; 确定用于从相邻节点的当前值估计节点处的电压的大小的公式的第二步骤; 确定包括通过在第二步骤中确定的公式计算出的电压大小的目标函数的第三步骤和用于控制电压大小的控制变量; 以及第四步骤，计算控制变量的值以允许所确定的目标函数具有最小值，并将所计算的值应用于分配系统中所提供的每个电压控制装置。

公开(公告)号：US07492602B2

公开(公告)日：2009-02-17

申请号：US11777131

申请日：2007-07-12

申请人： Jong-Hun Kim ,  Min-Ho Park

发明人： Jong-Hun Kim ,  Min-Ho Park

IPC分类号： H05K5/00

CPC分类号： H04M1/0264 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1671 ,  G06F1/1686 ,  H04M1/0266 ,  H04M1/236 ,  H04M2250/22

摘要： A mobile terminal includes a frame having a front side and a rear side, the rear side having a first receiving space and a second receiving space located beside one another, a front cover disposed to at least partially cover the front side of the frame, the front cover having a transparent portion, a touch screen located between the front cover and the frame, the touch screen permitting transmission of a signal when the transparent portion is contacted, a camera located in one of the first and second receiving spaces, and a rear cover disposed to at least partially cover each of the first and second receiving spaces.

摘要翻译： 移动终端包括具有前侧和后侧的框架，后侧具有彼此相邻的第一容纳空间和第二容纳空间，设置成至少部分地覆盖框架的前侧的前盖， 前盖具有透明部分，位于前盖和框架之间的触摸屏，触摸屏允许当透明部分接触时传输信号，位于第一和第二接收空间中的一个中的相机，以及后部 盖布置成至少部分地覆盖第一和第二接收空间中的每一个。

公开(公告)号：US20150244366A1

公开(公告)日：2015-08-27

申请号：US14624646

申请日：2015-02-18

申请人： DAL-HEE LEE ,  Jae-Woo Seo ,  Min-Ho Park

发明人： DAL-HEE LEE ,  Jae-Woo Seo ,  Min-Ho Park

IPC分类号： H03K19/00 ,  H03K19/0185 ,  H03K19/0944 ,  G06F17/50

CPC分类号： H03K19/0013 ,  G06F17/5072 ,  H03K19/018507 ,  H03K19/018521 ,  H03K19/0944

摘要： An integrated circuit (IC) includes at least one unit cell. The at least one unit cell includes a first bit circuit configured to process a first bit signal, a second bit circuit configured to process a second bit signal, a first well spaced apart from boundaries of the at least one unit cell and biased to a first voltage, and a second well biased to a second voltage that is different from the first voltage. Each of the first and second bit circuits includes at least one transistor from among a plurality of transistors disposed in the first well.

摘要翻译： 集成电路（IC）包括至少一个单元电池。 所述至少一个单元单元包括被配置为处理第一位信号的第一位电路，被配置为处理第二位信号的第二位电路，与所述至少一个单位单元的边界间隔开的第一阱，并被偏置到第一位 电压，第二阱偏压到不同于第一电压的第二电压。 第一和第二位电路中的每一个包括设置在第一阱中的多个晶体管中的至少一个晶体管。

公开(公告)号：US07656675B2

公开(公告)日：2010-02-02

申请号：US12350891

申请日：2009-01-08

申请人： Jong-Hun Kim ,  Min-Ho Park

发明人： Jong-Hun Kim ,  Min-Ho Park

IPC分类号： H05K5/00

CPC分类号： H04M1/0264 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1671 ,  G06F1/1686 ,  H04M1/0266 ,  H04M1/236 ,  H04M2250/22

摘要： A mobile terminal includes a frame having a front side and a rear side, the rear side having a first receiving space and a second receiving space located beside one another, a front cover disposed to at least partially cover the front side of the frame, the front cover having a transparent portion, a touch screen located between the front cover and the frame, the touch screen permitting transmission of a signal when the transparent portion is contacted, a camera located in one of the first and second receiving spaces, and a rear cover disposed to at least partially cover each of the first and second receiving spaces.

摘要翻译： 移动终端包括具有前侧和后侧的框架，后侧具有彼此相邻的第一容纳空间和第二容纳空间，设置成至少部分地覆盖框架的前侧的前盖， 前盖具有透明部分，位于前盖和框架之间的触摸屏，触摸屏允许当透明部分接触时传输信号，位于第一和第二接收空间中的一个中的相机，以及后部 盖布置成至少部分地覆盖第一和第二接收空间中的每一个。

公开(公告)号：US20090116202A1

公开(公告)日：2009-05-07

申请号：US12350891

申请日：2009-01-08

申请人： Jong-Hun Kim ,  Min-Ho Park

发明人： Jong-Hun Kim ,  Min-Ho Park

IPC分类号： H05K5/00

CPC分类号： H04M1/0264 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1671 ,  G06F1/1686 ,  H04M1/0266 ,  H04M1/236 ,  H04M2250/22

摘要： A mobile terminal includes a frame having a front side and a rear side, the rear side having a first receiving space and a second receiving space located beside one another, a front cover disposed to at least partially cover the front side of the frame, the front cover having a transparent portion, a touch screen located between the front cover and the frame, the touch screen permitting transmission of a signal when the transparent portion is contacted, a camera located in one of the first and second receiving spaces, and a rear cover disposed to at least partially cover each of the first and second receiving spaces.

摘要翻译： 移动终端包括具有前侧和后侧的框架，后侧具有彼此相邻的第一容纳空间和第二容纳空间，设置成至少部分地覆盖框架的前侧的前盖， 前盖具有透明部分，位于前盖和框架之间的触摸屏，触摸屏允许当透明部分接触时传输信号，位于第一和第二接收空间中的一个中的相机，以及后部 盖布置成至少部分地覆盖第一和第二接收空间中的每一个。

公开(公告)号：US07383066B2

公开(公告)日：2008-06-03

申请号：US10341356

申请日：2003-01-14

申请人： Min-Ho Park

发明人： Min-Ho Park

IPC分类号： H04M1/00 ,  H04B1/38 ,  H04B1/08 ,  H04K11/02

CPC分类号： H01H13/807 ,  H01H3/60 ,  H01H13/70 ,  H01H13/703 ,  H01H2209/052 ,  H01H2211/024 ,  H01H2225/028

摘要： A mobile communication terminal includes at least one function key which demonstrates improved resistance to vibration. This is achieved by positioning a spacer between the function key and an associated switch, which in the case of a mobile terminal may be a tact switch. The spacer may be made from an elastic material which compresses when inserted between the switch and function key. Alternatively, the spacer may be made from a rigid material. Also, the spacer may extend from one or more layers of a keypad and may be made to bend into proper orientation adjacent a side button on the terminal. By eliminating the clearance gap between the function key and switch, undesirable noise is prevented and improved stability to vibration is demonstrated. Also, a better feel to as user is achieved as a result of the reduction or elimination of this clearance gap.

摘要翻译： 移动通信终端包括表现出改善的抵抗振动的至少一个功能键。 这通过在功能键和相关联的开关之间定位间隔件来实现，在移动终端的情况下可以是触觉开关。 间隔件可以由插入在开关和功能键之间的弹性材料制成。 或者，间隔件可以由刚性材料制成。 此外，间隔件可以从键盘的一个或多个层延伸，并且可以使其相对于端子上的侧按钮弯曲成适当的取向。 通过消除功能键和开关之间的间隙，防止了不期望的噪音，提高了振动的稳定性。 另外，由于减少或消除了这个间隙，所以能够实现用户的更好的感觉。

公开(公告)号：US08271148B2

公开(公告)日：2012-09-18

申请号：US12656290

申请日：2010-01-25

申请人： Sung-Woo Lee ,  Bok-Nam Ha ,  Chang-Hoon Shin ,  Min-Ho Park ,  So-Young Park

发明人： Sung-Woo Lee ,  Bok-Nam Ha ,  Chang-Hoon Shin ,  Min-Ho Park ,  So-Young Park

IPC分类号： G06F19/00

CPC分类号： H02J3/1828 ,  H02J3/1878 ,  Y02E40/30

摘要： Provided are a novel distribution automation system and its voltage control method, which can supply a stable voltage to a user by properly adjusting the settings of a control device so as to compensate for reactive power at each load terminal. The voltage control method includes: a first step of modeling a distribution system in the form of a distribution load based on constants of four terminals according to the connection type of each node and a distribution line, which constitute the distribution system; a second step of determining a formula for estimating the magnitude of a voltage at a node from a current value of an adjacent node; a third step of determining an objective function including the magnitude of the voltage, calculated through the formula determined in the second step, and a control variable for controlling the magnitude of the voltage; and a fourth step of calculating a value of the control variable to allow the determined objective function to have a minimum value and applying the calculated value to each voltage control device provided in the distribution system.

摘要翻译： 提供了一种新颖的配电自动化系统及其电压控制方法，其可以通过适当地调整控制装置的设置来向用户提供稳定的电压，以补偿每个负载端子处的无功功率。 电压控制方法包括：第一步骤，根据构成分配系统的每个节点的连接类型和分配线，基于四个终端的常数以分布负载的形式建模分配系统; 确定用于从相邻节点的当前值估计节点处的电压的大小的公式的第二步骤; 确定包括通过在第二步骤中确定的公式计算出的电压大小的目标函数的第三步骤和用于控制电压大小的控制变量; 以及第四步骤，计算控制变量的值以允许所确定的目标函数具有最小值，并将所计算的值应用于分配系统中所提供的每个电压控制装置。

公开(公告)号：US20090111219A1

公开(公告)日：2009-04-30

申请号：US12350065

申请日：2009-01-07

申请人： Seung-Yong Choi ,  Min-Ho Park ,  Ji-Hwan Kim ,  Rajeev Joshi

发明人： Seung-Yong Choi ,  Min-Ho Park ,  Ji-Hwan Kim ,  Rajeev Joshi

IPC分类号： H01L21/50

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/525 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/838 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/3512

摘要： A packaged semiconductor device (a wafer-level chip scale package) containing a conductive adhesive material as an electrical interconnect route between the semiconductor die and a patterned conductive substrate is described. The patterned conductive substrate acts not only as a substrate, but also as a redistribution layer that converts the dense pad layout of the die to a larger array configuration of the solder balls in the circuit board. Using the invention allows the formation of a lower priced chip scale package that also overcomes the restriction of the die size used in die-sized chip packages and the input-output pattern that can be required by the printed circuit board. Thus, the invention can provide a familiar pitch (i.e., interface) to the printed circuit board for any small die.

摘要翻译： 描述了包含导电粘合剂材料作为半导体管芯和图案化导电基板之间的电互连路线的封装半导体器件（晶片级芯片级封装）。 图案化导电衬底不仅用作衬底，而且还用作将芯片的致密衬垫布局转换成电路板中的焊球的更大阵列配置的再分配层。 使用本发明允许形成较低价格的芯片级封装，其还克服了芯片尺寸芯片封装中使用的裸片尺寸的限制以及印刷电路板可能需要的输入 - 输出图案。 因此，本发明可以为任何小型芯片提供与印刷电路板的熟悉的间距（即接口）。