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公开(公告)号：US08926806B2
公开(公告)日：2015-01-06
申请号：US13355770
申请日：2012-01-23
申请人： Ming-Chin Tsai , Bo-Hung Lin , You-Hua Chou , Chung-En Kao
发明人： Ming-Chin Tsai , Bo-Hung Lin , You-Hua Chou , Chung-En Kao
CPC分类号： H01L21/324 , C23C14/50 , C23C14/541 , C23C14/5806 , H01L21/67115 , H01L21/76838
摘要： The present disclosure is directed to a physical vapor deposition system configured to heat a semiconductor substrate or wafer. In some embodiments the disclosed physical vapor deposition system comprises at least one heat source having one or more lamp modules for heating of the substrate. The lamp modules may be separated from the substrate by a shielding device. In some embodiments, the shielding device comprises a one-piece device or a two piece device. The disclosed physical vapor deposition system can heat the semiconductor substrate, reflowing a metal film deposited thereon without the necessity for separate chambers, thereby decreasing process time, requiring less thermal budget, and decreasing substrate damage.
摘要翻译： 本公开涉及被配置为加热半导体衬底或晶片的物理气相沉积系统。 在一些实施例中，所公开的物理气相沉积系统包括至少一个热源，其具有用于加热基底的一个或多个灯模块。 灯模块可以通过屏蔽装置与衬底分离。 在一些实施例中，屏蔽装置包括一件式装置或两件式装置。 所公开的物理气相沉积系统可以加热半导体衬底，回流沉积在其上的金属膜，而不需要单独的室，从而减少处理时间，需要较少的热量预算和减少衬底损伤。
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公开(公告)号：US20130186338A1
公开(公告)日：2013-07-25
申请号：US13355770
申请日：2012-01-23
申请人： Ming-Chin Tsai , Bo-Hung Lin , You-Hua Chou , Chung-En Kao
发明人： Ming-Chin Tsai , Bo-Hung Lin , You-Hua Chou , Chung-En Kao
CPC分类号： H01L21/324 , C23C14/50 , C23C14/541 , C23C14/5806 , H01L21/67115 , H01L21/76838
摘要： The present disclosure is directed to a physical vapor deposition system configured to heat a semiconductor substrate or wafer. In some embodiments the disclosed physical vapor deposition system comprises at least one heat source having one or more lamp modules for heating of the substrate. The lamp modules may be separated from the substrate by a shielding device. In some embodiments, the shielding device comprises a one-piece device or a two piece device. The disclosed physical vapor deposition system can heat the semiconductor substrate, reflowing a metal film deposited thereon without the necessity for separate chambers, thereby decreasing process time, requiring less thermal budget, and decreasing substrate damage.
摘要翻译： 本公开涉及被配置为加热半导体衬底或晶片的物理气相沉积系统。 在一些实施例中，所公开的物理气相沉积系统包括至少一个热源，其具有用于加热基底的一个或多个灯模块。 灯模块可以通过屏蔽装置与衬底分离。 在一些实施例中，屏蔽装置包括一件式装置或两件式装置。 所公开的物理气相沉积系统可以加热半导体衬底，回流沉积在其上的金属膜，而不需要单独的室，从而减少处理时间，需要较少的热量预算和减少衬底损伤。
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公开(公告)号：US09708706B2
公开(公告)日：2017-07-18
申请号：US13307242
申请日：2011-11-30
申请人： Chung-En Kao , Ming-Chin Tsai , You-Hua Chou , Chen-Chia Chiang , Chih-Tsung Lee , Ming-Shiou Kuo
发明人： Chung-En Kao , Ming-Chin Tsai , You-Hua Chou , Chen-Chia Chiang , Chih-Tsung Lee , Ming-Shiou Kuo
CPC分类号： C23C14/352 , H01J37/3405 , H01J37/3417
摘要： A thin film deposition system and method provide for multiple target assemblies that may be separately powered. Each target assembly includes a target and associated magnet or set of magnets. The disclosure provides a tunable film profile produced by multiple power sources that separately power the target arrangements. The relative amounts of power supplied to the target arrangements may be customized to provide a desired film and may be varied in time to produce a film with varied characteristics.
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公开(公告)号：US09982340B2
公开(公告)日：2018-05-29
申请号：US13439127
申请日：2012-04-04
申请人： Chih-Tsung Lee , Hung Jui Chang , You-Hua Chou , Shiu-Ko Jangjian , Chung-En Kao , Ming-Chin Tsai , Huan-Wen Lai
发明人： Chih-Tsung Lee , Hung Jui Chang , You-Hua Chou , Shiu-Ko Jangjian , Chung-En Kao , Ming-Chin Tsai , Huan-Wen Lai
IPC分类号： C23C16/44 , C23C16/30 , C23C16/509 , H01J37/32
CPC分类号： C23C16/4412 , C23C16/308 , C23C16/5096 , H01J37/32091 , H01J37/3244
摘要： An apparatus comprises: a shower head having a supply plenum for supplying the gas to the chamber and a vacuum manifold fluidly coupled to the supply plenum; and at least one vacuum system fluidly coupled to the vacuum manifold of the shower head.
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公开(公告)号：US09026241B2
公开(公告)日：2015-05-05
申请号：US13404676
申请日：2012-02-24
申请人： Wen-Cheng Yang , Chung-En Kao , You-Hua Chou , Ming-Chih Tsai , Chen-Chia Chiang , Bo-Hung Lin , Chin-Hsiang Lin
发明人： Wen-Cheng Yang , Chung-En Kao , You-Hua Chou , Ming-Chih Tsai , Chen-Chia Chiang , Bo-Hung Lin , Chin-Hsiang Lin
CPC分类号： G05B9/03 , G05B23/0237 , G05B2219/37533 , G05B2219/45031
摘要： The present disclosure relates to semiconductor tool monitoring system having multiple sensors configured to concurrently and independently monitor processing conditions of a semiconductor manufacturing tool. In some embodiments, the disclosed tool monitoring system comprises a first sensor system configured to monitor one or more processing conditions of a semiconductor manufacturing tool and to generate a first monitoring response based thereupon. A redundant, second sensor system is configured to concurrently monitor the one or more processing conditions of the manufacturing tool and to generate a second monitoring response based thereupon. A comparison element is configured to compare the first and second monitoring responses, and if the responses deviate from one another (e.g., have a deviation greater than a threshold value) to generate a warning signal. By comparing the first and second monitoring responses, errors in the sensor systems can be detected in real time, thereby preventing yield loss.
摘要翻译： 本公开涉及具有多个传感器的半导体工具监视系统，其被配置为同时且独立地监视半导体制造工具的处理条件。 在一些实施例中，所公开的工具监控系统包括被配置为监视半导体制造工具的一个或多个处理条件并基于此产生第一监视响应的第一传感器系统。 冗余的第二传感器系统被配置为同时监视制造工具的一个或多个处理条件并且基于此产生第二监视响应。 比较元件被配置为比较第一和第二监测响应，以及如果响应彼此偏离（例如，具有大于阈值的偏差）以产生警告信号。 通过比较第一和第二监测响应，可以实时检测传感器系统中的误差，从而防止产量损失。
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公开(公告)号：US20130226327A1
公开(公告)日：2013-08-29
申请号：US13404676
申请日：2012-02-24
申请人： Wen-Cheng Yang , Chung-En Kao , You-Hua Chou , Ming-Chih Tsai , Chen-Chia Chiang , Bo-Hung Lin , Chin-Hsiang Lin
发明人： Wen-Cheng Yang , Chung-En Kao , You-Hua Chou , Ming-Chih Tsai , Chen-Chia Chiang , Bo-Hung Lin , Chin-Hsiang Lin
CPC分类号： G05B9/03 , G05B23/0237 , G05B2219/37533 , G05B2219/45031
摘要： The present disclosure relates to semiconductor tool monitoring system having multiple sensors configured to concurrently and independently monitor processing conditions of a semiconductor manufacturing tool. In some embodiments, the disclosed tool monitoring system comprises a first sensor system configured to monitor one or more processing conditions of a semiconductor manufacturing tool and to generate a first monitoring response based thereupon. A redundant, second sensor system is configured to concurrently monitor the one or more processing conditions of the manufacturing tool and to generate a second monitoring response based thereupon. A comparison element is configured to compare the first and second monitoring responses, and if the responses deviate from one another (e.g., have a deviation greater than a threshold value) to generate a warning signal. By comparing the first and second monitoring responses, errors in the sensor systems can be detected in real time, thereby preventing yield loss.
摘要翻译： 本公开涉及具有多个传感器的半导体工具监视系统，其被配置为同时且独立地监视半导体制造工具的处理条件。 在一些实施例中，所公开的工具监控系统包括被配置为监视半导体制造工具的一个或多个处理条件并基于此产生第一监视响应的第一传感器系统。 冗余的第二传感器系统被配置为同时监视制造工具的一个或多个处理条件并且基于此产生第二监视响应。 比较元件被配置为比较第一和第二监测响应，以及如果响应彼此偏离（例如，具有大于阈值的偏差）以产生警告信号。 通过比较第一和第二监测响应，可以实时检测传感器系统中的误差，从而防止产量损失。
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公开(公告)号：US09093252B2
公开(公告)日：2015-07-28
申请号：US13397957
申请日：2012-02-16
申请人： Bo-Hung Lin , Ming-Chih Tsai , You-Hua Chou , Chung-En Kao
发明人： Bo-Hung Lin , Ming-Chih Tsai , You-Hua Chou , Chung-En Kao
CPC分类号： C23C14/351 , C23C14/35 , H01J37/32669 , H01J37/3408 , H01J37/3452 , H01J37/3455 , H01J37/3461
摘要： In some embodiments, the present disclosure relates to a plasma processing system comprising a magnetron configured to provide a symmetric magnetic track through a combination of vibrational and rotational motion. The disclosed magnetron comprises a magnetic element configured to generate a magnetic field. The magnetic element is attached to an elastic element connected between the magnetic element and a rotational shaft configured to rotate magnetic element about a center of the sputtering target. The elastic element is configured to vary its length during rotation of the magnetic element to change the radial distance between the rotational shaft and the magnetic element. The resulting magnetic track enables concurrent motion of the magnetic element in both an angular direction and a radial direction. Such motion enables a symmetric magnetic track that provides good wafer uniformity and a short deposition time.
摘要翻译： 在一些实施例中，本公开涉及等离子体处理系统，其包括被配置为通过振动和旋转运动的组合提供对称磁轨的磁控管。 所公开的磁控管包括被配置为产生磁场的磁性元件。 磁性元件附接到连接在磁性元件和旋转轴之间的弹性元件，该旋转轴构造成围绕溅射靶的中心旋转磁性元件。 弹性元件构造成在磁性元件的旋转期间改变其长度以改变旋转轴和磁性元件之间的径向距离。 由此产生的磁道能够使磁性元件在角度方向和径向方向上同时运动。 这样的运动能够提供良好的晶片均匀性和较短的沉积时间的对称磁迹。
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公开(公告)号：US20130213797A1
公开(公告)日：2013-08-22
申请号：US13397957
申请日：2012-02-16
申请人： Bo-Hung Lin , Ming-Chih Tsai , You-Hua Chou , Chung-En Kao
发明人： Bo-Hung Lin , Ming-Chih Tsai , You-Hua Chou , Chung-En Kao
IPC分类号： C23C14/35
CPC分类号： C23C14/351 , C23C14/35 , H01J37/32669 , H01J37/3408 , H01J37/3452 , H01J37/3455 , H01J37/3461
摘要： In some embodiments, the present disclosure relates to a plasma processing system comprising a magnetron configured to provide a symmetric magnetic track through a combination of vibrational and rotational motion. The disclosed magnetron comprises a magnetic element configured to generate a magnetic field. The magnetic element is attached to an elastic element connected between the magnetic element and a rotational shaft configured to rotate magnetic element about a center of the sputtering target. The elastic element is configured to vary its length during rotation of the magnetic element to change the radial distance between the rotational shaft and the magnetic element. The resulting magnetic track enables concurrent motion of the magnetic element in both an angular direction and a radial direction. Such motion enables a symmetric magnetic track that provides good wafer uniformity and a short deposition time.
摘要翻译： 在一些实施例中，本公开涉及等离子体处理系统，其包括被配置为通过振动和旋转运动的组合提供对称磁轨的磁控管。 所公开的磁控管包括被配置为产生磁场的磁性元件。 磁性元件附接到连接在磁性元件和旋转轴之间的弹性元件，该旋转轴构造成围绕溅射靶的中心旋转磁性元件。 弹性元件构造成在磁性元件的旋转期间改变其长度以改变旋转轴和磁性元件之间的径向距离。 由此产生的磁道能够使磁性元件在角度方向和径向方向上同时运动。 这样的运动能够提供良好的晶片均匀性和较短的沉积时间的对称磁迹。
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公开(公告)号：US08953298B2
公开(公告)日：2015-02-10
申请号：US13307089
申请日：2011-11-30
申请人： Chung-En Kao , You-Hua Chou , Chih-Tsung Lee , Ming-Shiou Kuo
发明人： Chung-En Kao , You-Hua Chou , Chih-Tsung Lee , Ming-Shiou Kuo
IPC分类号： H01L21/683 , H01T23/00
CPC分类号： H01L21/6831 , H01L21/67742
摘要： A workpiece transfer system has a plurality of joints having a bearing and a primary and secondary transformer coil, wherein power provided to the primary transformer coil and secondary transformer coil of each joint produces mutual inductance between the primary and secondary transformer coil of the respective joint. A first pair of arms are rotatably coupled to a blade by a first pair of the joints, wherein the primary transformer coil of each of the first pair of joints is operably coupled to the first pair of arms, and the secondary transformer coil of each of the first pair of joints is operably coupled to the blade and an electrode beneath a dielectric workpiece retaining surface of the blade. The electrode is contactlessly energized through the transformer coils of the joint and the blade can chuck and de-chuck a workpiece by reversing current directions and by voltage adjustment.
摘要翻译： 工件传送系统具有多个具有轴承和初级和次级变压器线圈的接头，其中提供给每个接头的初级变压器线圈和次级变压器线圈的功率在相应接头的主变压器线圈和次级变压器线圈之间产生互感。 第一对臂通过第一对接头可旋转地联接到叶片，其中第一对接头中的每一个的主变压器线圈可操作地耦合到第一对臂，并且每个臂的次级变压器线圈 第一对接头可操作地联接到叶片和位于叶片的介电工件保持表面下方的电极。 电极通过接头的变压器线圈非接触地通电，并且刀片可以通过反向电流方向和电压调节来夹紧和去夹紧工件。
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公开(公告)号：US20130135784A1
公开(公告)日：2013-05-30
申请号：US13307089
申请日：2011-11-30
申请人： Chung-En Kao , You-Hua Chou , Chih-Tsung Lee , Ming-Shiou Kuo
发明人： Chung-En Kao , You-Hua Chou , Chih-Tsung Lee , Ming-Shiou Kuo
IPC分类号： B25J11/00 , H01L21/687 , B25J15/00 , B25J17/00 , B25J18/00
CPC分类号： H01L21/6831 , H01L21/67742
摘要： A workpiece transfer system has a plurality of joints having a bearing and a primary and secondary transformer coil, wherein power provided to the primary transformer coil and secondary transformer coil of each joint produces mutual inductance between the primary and secondary transformer coil of the respective joint. A first pair of arms are rotatably coupled to a blade by a first pair of the joints, wherein the primary transformer coil of each of the first pair of joints is operably coupled to the first pair of arms, and the secondary transformer coil of each of the first pair of joints is operably coupled to the blade and an electrode beneath a dielectric workpiece retaining surface of the blade. The electrode is contactlessly energized through the transformer coils of the joint and the blade can chuck and de-chuck a workpiece by reversing current directions and by voltage adjustment.
摘要翻译： 工件传送系统具有多个具有轴承和初级和次级变压器线圈的接头，其中提供给每个接头的初级变压器线圈和次级变压器线圈的功率在相应接头的主变压器线圈和次级变压器线圈之间产生互感。 第一对臂通过第一对接头可旋转地联接到叶片，其中第一对接头中的每一个的主变压器线圈可操作地耦合到第一对臂，并且每个臂的次级变压器线圈 第一对接头可操作地联接到叶片和位于叶片的介电工件保持表面下方的电极。 电极通过接头的变压器线圈非接触地通电，并且刀片可以通过反向电流方向和电压调节来夹紧和去夹紧工件。
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