公开(公告)号：US20140339689A1

公开(公告)日：2014-11-20

申请号：US14449242

申请日：2014-08-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hisanori MURASE ,  Takanori UEJIMA ,  Muneyoshi YAMAMOTO

IPC: H01L23/66 ,  H01L23/522 ,  H01L23/528 ,  H01L27/02

CPC classification number: H01L23/66 ,  H01L23/5226 ,  H01L23/5286 ,  H01L27/0207 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15313 ,  H04B1/48 ,  H01L2224/0401

Abstract: A high frequency switch module includes a multilayer substrate and a switch IC. The switch IC is mounted on a top plane of the multilayer substrate. A drive power signal input port and control signal input ports are connected to direct current external input ports through direct current voltage conductors, respectively. In-layer conductors of the direct current voltage conductors are arranged so that the in-layer conductors overlap each other at least partially in a state in which the multilayer substrate is viewed along a stacking direction.

Abstract translation: 高频开关模块包括多层基板和开关IC。 开关IC安装在多层基板的顶面上。 驱动电源信号输入端口和控制信号输入端口分别通过直流电压导体连接到直流外部输入端口。 直流电压导体的层内导体被布置成使得层内导体至少部分地沿着层叠方向观察多层基板的状态彼此重叠。

公开(公告)号：US20140097999A1

公开(公告)日：2014-04-10

申请号：US14102626

申请日：2013-12-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hisanori MURASE ,  Muneyoshi YAMAMOTO

IPC: H01P1/10 ,  H01Q21/00 ,  H01Q1/50

CPC classification number: H01P1/10 ,  H01P1/15 ,  H01Q1/50 ,  H01Q21/0006 ,  H04B1/0057

Abstract: A high-frequency module includes port electrodes defining external connection terminals provided on a multilayer body including dielectric layers. A first port electrode is connected to an antenna. A plurality of port electrodes other than the first port electrode are respectively connected to communication systems supporting respective frequency bands. The first port electrode is connected to the plurality of other port electrodes through a plurality of switch elements. A first group of the plurality of switch elements and a second group of the plurality of switch elements are not connected to each other within a switch circuit and are connectable to each other through a common terminal outside of the switch circuit. As a result, a high-frequency module that allows a design change to be made using the same switch circuit without changing the switch circuit is provided.

Abstract translation: 高频模块包括限定设置在包括电介质层的多层体上的外部连接端子的端口电极。 第一端口电极连接到天线。 除了第一端口电极之外的多个端口电极分别连接到支持各个频带的通信系统。 第一端口电极通过多个开关元件连接到多个其它端口电极。 多个开关元件中的第一组和多个开关元件中的第二组在开关电路内未彼此连接，并且可通过开关电路外部的公共端子彼此连接。 因此，提供了一种高频模块，其允许使用相同的开关电路进行设计改变而不改变开关电路。

公开(公告)号：US20220285808A1

公开(公告)日：2022-09-08

申请号：US17824940

申请日：2022-05-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshinori TAGUCHI ,  Kengo ONAKA ,  Hitoshi TADA ,  Yasuo YAMADA ,  Muneyoshi YAMAMOTO ,  Tomohiro NAGAI ,  Keiichi HIROSE

IPC: H01P1/203 ,  H01P7/08

Abstract: A distributed constant filter includes a resonator that is not grounded and a first ground electrode. The first ground electrode faces the resonator in a first direction (Z). The resonator is a distributed constant line resonator. The resonator includes a plurality of distributed constant lines and a via conductor. The plurality of distributed constant lines are arranged in layers in the first direction (Z). The via conductor extends in the first direction (Z). Each of the plurality of distributed constant lines is connected to the via conductor only at one end portion of both end portions of the distributed constant line.

公开(公告)号：US20220231395A1

公开(公告)日：2022-07-21

申请号：US17715097

申请日：2022-04-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hitoshi TADA ,  Yasuo YAMADA ,  Muneyoshi YAMAMOTO

IPC: H01P7/10 ,  H01P7/04

Abstract: A dielectric resonator includes a dielectric substrate, a distributed element, and a shield conductor portion. The distributed element extends in the X-axis direction inside the dielectric substrate. The shield conductor portion is on a surface of the dielectric substrate and winds around the distributed element when the distributed element is viewed from the X-axis direction in plan view. One end of the distributed element is not connected to the shield conductor portion. The distributed element includes a plurality of conductors.

公开(公告)号：US20170323838A1

公开(公告)日：2017-11-09

申请号：US15655070

申请日：2017-07-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Muneyoshi YAMAMOTO ,  Norio SAKAI

IPC: H01L23/14 ,  H01L23/48 ,  H05K1/18 ,  H01L23/495 ,  H01L23/28 ,  H01L29/41 ,  H01L23/52 ,  H01L23/498

CPC classification number: H01L23/14 ,  H01L21/561 ,  H01L23/13 ,  H01L23/28 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/49572 ,  H01L23/49827 ,  H01L23/52 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/97 ,  H01L29/41 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/188 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2203/1316 ,  H01L2224/81 ,  H01L2924/00012

Abstract: An electronic circuit module includes a circuit board, electronic components, an embedding layer, and a conductive film. The circuit board has a first principal surface, a second principal surface and a side surface, and includes a pattern conductor and a via conductor. The conductive film is connected to a conduction path to a ground electrode. The side surface includes a first region, a second region having a longer circumferential length than the first region, and a connection region connecting the first region and the second regions. The conductive film is formed on a region including at least part of each of an outer surface of the embedding layer, the first region, and the connection region. The conductive film formed on at least part of the connection region is connected to an exposed portion in the connection region of the via conductor included in the conduction path to the ground electrode.

公开(公告)号：US20240333220A1

公开(公告)日：2024-10-03

申请号：US18742402

申请日：2024-06-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： John HOVERSTEN ,  Yevgeniy TKACHENKO ,  David PERREAULT ,  Muneyoshi YAMAMOTO ,  Takeshi KOGURE

IPC: H03F1/02 ,  H03F3/00 ,  H03F3/24

CPC classification number: H03F1/0222 ,  H03F3/005 ,  H03F3/245 ,  H03F2200/102 ,  H03F2200/451

Abstract: A tracker module includes a module laminate configured to provide interconnections to circuit components arranged on the module laminate, at least one integrated circuit arranged on the module laminate, and a first output terminal and a plurality of second output terminals that are configured to output signals externally of the tracker module. The at least one integrated circuit includes a first supply modulator and at least one switch in a switched-capacitor circuit. The switched-capacitor circuit is configured to generate a plurality of discrete voltages, the plurality of discrete voltages being supplied to the plurality of second output terminals to output. The first supply modulator is configured to generate a first power supply by selecting at least one of the plurality of discrete voltages, the first power supply is provided to the first output terminal to output.

公开(公告)号：US20140349720A1

公开(公告)日：2014-11-27

申请号：US14453848

申请日：2014-08-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takanori UEJIMA ,  Muneyoshi YAMAMOTO

IPC: H04M1/02

CPC classification number: H04M1/0277 ,  H04B1/006 ,  H04B1/0458 ,  H04B1/18 ,  H04B1/48

Abstract: A high frequency module is configured to be compatible with a cellular phone with a plurality of specifications without increasing the number of ports in a switching device. The high frequency module includes a switching device and a module board. The switching device includes a common port and connection switch ports. The module board includes external connection ports and a third filter circuit. An external connection port is connected to one of the connection switch ports of the switching device via a transmission line inside the module board. The third filter circuit is connected to a second external connection port and a third external connection port independently from the device connection ports of the switching device.

Abstract translation: 高频模块被配置为与多个规格的蜂窝电话兼容，而不增加交换设备中的端口数量。 高频模块包括开关装置和模块板。 交换设备包括公共端口和连接交换机端口。 模块板包括外部连接端口和第三个滤波电路。 外部连接端口通过模块板内的传输线连接到交换设备的一个连接交换机端口。 第三滤波电路与开关装置的装置连接端口独立地连接到第二外部连接端口和第三外部连接端口。