公开(公告)号：US09806234B2

公开(公告)日：2017-10-31

申请号：US14610030

申请日：2015-01-30

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Mototaka Inobe ,  Kunihiro Izuno

IPC: H01L33/56 ,  H01L33/46 ,  H01L33/60 ,  H01L33/62 ,  H01L33/48 ,  H01L25/075 ,  H01L25/16

CPC classification number: H01L33/46 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48465 ,  H01L2224/4945 ,  H01L2924/01322 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method of manufacturing a light emitting device includes a first step of mounting a light emitting element on a substrate having a conductor wiring and electrically connecting the light emitting element with the conductor wiring, a second step of disposing a light reflecting resin which reflects light from the light emitting element to surround the light emitting element, and a third step of disposing a sealing member after hardening the light reflecting resin to cover the light emitting element.

公开(公告)号：US10319888B2

公开(公告)日：2019-06-11

申请号：US15350330

申请日：2016-11-14

Applicant: NICHIA CORPORATION

Inventor： Mototaka Inobe ,  Motokazu Yamada ,  Kazuhiro Kamada

IPC: H01L21/00 ,  H01L33/60 ,  H01L33/54 ,  H01L33/52 ,  H01L33/20 ,  H01L33/56 ,  H01L33/32 ,  H01L33/62 ,  H01L25/075

Abstract: A method of manufacturing a light emitting device including providing a light emitting element mounted on a substrate. The light emitting element is provided within a first cavity of the light emitting device. The method further includes covering continuously, with insulating material, at least side surfaces of the light emitting element. Light reflective resin is provided over the insulating material at a position surrounding the light emitting element to reflect light from the light emitting element.

公开(公告)号：US09525115B2

公开(公告)日：2016-12-20

申请号：US14517965

申请日：2014-10-20

Applicant: NICHIA CORPORATION

Inventor： Mototaka Inobe ,  Motokazu Yamada ,  Kazuhiro Kamada

IPC: H01L21/00 ,  H01L33/60 ,  H01L33/54 ,  H01L33/52 ,  H01L33/20 ,  H01L33/56 ,  H01L25/075

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/32 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A light emitting device includes a substrate, metallization, a light emitting element, conducting wire, light reflective resin, and insulating material. The metallization is provided on a surface of the substrate that is made of insulating substance. The light emitting element is mounted on the substrate. The conducting wire electrically connects the metallization and the light emitting element. The light reflective resin is provided on the substrate to reflect light from the light emitting element. The insulating material covers at least part of metallization surfaces. The insulating material is established to come in contact with a side of the light emitting element.

Abstract translation: 发光装置包括基板，金属化，发光元件，导线，光反射树脂和绝缘材料。 金属化被设置在由绝缘物质制成的基板的表面上。 发光元件安装在基板上。 导线将金属化和发光元件电连接。 光反射树脂设置在基板上以反射来自发光元件的光。 绝缘材料覆盖至少部分金属化表面。 建立绝缘材料以与发光元件的一侧接触。

公开(公告)号：US10559721B2

公开(公告)日：2020-02-11

申请号：US15784781

申请日：2017-10-16

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Mototaka Inobe

IPC: H01L33/46 ,  H01L33/62 ,  H01L33/60 ,  H01L33/48 ,  H01L33/56 ,  H01L25/075 ,  H01L25/16

Abstract: A light emitting device includes a substrate, a light emitting element, a light reflecting resin member, a sealing member, an electrically conductive wiring and a lens member. The light reflecting resin member surrounds the light emitting element. The sealing member is disposed in a region surrounded by the light reflecting resin member. The electrically conductive wiring is arranged on an upper surface of the substrate such that the substrate includes an exposed region exposed from the electrically conductive wiring with at least a part of the exposed region of the substrate being embedded in the light reflecting resin member. The lens member is disposed above the light emitting element to reach an outer edge of the substrate. The lens member is in contact with an upper surface of the sealing member and an upper surface and an outer lateral surface of the light reflecting resin member.

公开(公告)号：US09714757B2

公开(公告)日：2017-07-25

申请号：US14136749

申请日：2013-12-20

Applicant: NICHIA CORPORATION

Inventor： Mototaka Inobe

IPC: F21V21/00 ,  F21V21/14 ,  F21V31/00 ,  F21V19/00 ,  F21S4/24 ,  F21Y115/10

CPC classification number: F21V21/14 ,  F21S4/24 ,  F21V19/001 ,  F21V31/005 ,  F21Y2115/10 ,  H01L2224/73204

Abstract: A light emitting device with good handling performance for storage, transportation, or in use, which can prevent stress from concentrating on the light emitting elements. The substrate member includes a first end portion, a middle portion, and a second end portion. The first end portion defines a locking hole for insertion of a locking bar. A plurality of light emitting elements are disposed on the middle portion. On the second end portion, an electronic member such as a Zener Diode, a Bridge Diode, a connector, a fuse, a resistance etc., is disposed.

公开(公告)号：US08889459B2

公开(公告)日：2014-11-18

申请号：US13789677

申请日：2013-03-08

Applicant: Nichia Corporation

Inventor： Mototaka Inobe ,  Motokazu Yamada ,  Kazuhiro Kamada

IPC: H01L21/00 ,  H01L33/52 ,  H01L33/54 ,  H01L25/075 ,  H01L33/60

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/32 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In method of manufacturing a light emitting device, a substrate is provided, and metallization is established on an upper surface of the substrate. A light emitting element is mounted on top of the metallization, and the metallization and light emitting element are electrically connected. The surfaces of metallization and at least side surface of the light emitting element are continuously covered with insulating material. Light reflective resin is provided over the insulating material at a position surrounding the light emitting element to reflect light from the light emitting element.

Abstract translation: 在制造发光器件的方法中，提供衬底，并且在衬底的上表面上建立金属化。 发光元件安装在金属化的顶部，并且金属化和发光元件电连接。 金属化表面和发光元件的至少侧表面被绝缘材料连续覆盖。 光反射树脂在围绕发光元件的位置处设置在绝缘材料上方以反射来自发光元件的光。