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公开(公告)号：US20170141276A1
公开(公告)日：2017-05-18
申请号：US15417373
申请日：2017-01-27
Applicant: NICHIA CORPORATION
Inventor： Motokazu YAMADA , Tadaaki MIYATA , Naoki MORI
CPC classification number: H01L33/56 , F21S4/22 , F21Y2101/00 , F21Y2103/00 , F21Y2103/10 , F21Y2115/10 , H01L25/0753 , H01L27/15 , H01L33/32 , H01L33/483 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2224/73204 , H05K1/111 , H05K1/189 , H05K2201/09363 , H05K2201/10106
Abstract: A light emitting device includes a substrate, a light emitting element and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions and a groove portion. The groove portion is formed between the plurality of wiring portions spaced apart from each other, and includes a first groove portion, a second groove portion, and a third groove portion extending in a direction intersecting the first and second groove portions. The first and third groove portions are connected to each other with a curve. The second and third groove portions are connected to each other with a curve. The sealing resin member seals the light emitting element and the substrate. The sealing resin member is arranged on the third groove portion and spaced apart from the first groove portion and the second groove portion.
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公开(公告)号：US20150084073A1
公开(公告)日：2015-03-26
申请号：US14565045
申请日：2014-12-09
Applicant: NICHIA CORPORATION
Inventor： Motokazu YAMADA , Tadaaki MIYATA , Naoki MORI
CPC classification number: H01L33/56 , F21S4/22 , F21Y2101/00 , F21Y2103/00 , F21Y2103/10 , F21Y2115/10 , H01L25/0753 , H01L27/15 , H01L33/32 , H01L33/483 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2224/73204 , H05K1/111 , H05K1/189 , H05K2201/09363 , H05K2201/10106
Abstract: A light emitting device includes a light emitting element and a substrate including a flexible base, a plurality of wiring portions, a groove portion, and a reflective layer. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate. The wiring portions are arranged on the flexible base. The groove portion is formed between the wiring portions spaced apart from each other. The groove portion includes a first groove portion extending in a second direction intersecting the first direction. The reflective layer is arranged on the plurality of wiring portions. The light emitting element is disposed near the reflective layer and electrically connected to the plurality of wiring portions. The light emitting element is spaced apart from the first groove portion.
Abstract translation: 发光器件包括发光元件和包括柔性基底，多个布线部分，凹槽部分和反射层的基底。 柔性基部沿对应于基板纵向的第一方向延伸。 布线部分布置在柔性基座上。 沟槽部分形成在彼此间隔开的布线部分之间。 槽部包括沿与第一方向交叉的第二方向延伸的第一槽部。 反射层设置在多个布线部分上。 发光元件设置在反射层附近并电连接到多个布线部分。 发光元件与第一槽部间隔开。
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公开(公告)号：US20140008694A1
公开(公告)日：2014-01-09
申请号：US13936399
申请日：2013-07-08
Applicant: NICHIA CORPORATION
Inventor： Motokazu YAMADA , Tadaaki MIYATA , Naoki MORI
IPC: H01L33/48
CPC classification number: H01L33/56 , F21S4/22 , F21Y2101/00 , F21Y2103/00 , F21Y2103/10 , F21Y2115/10 , H01L25/0753 , H01L27/15 , H01L33/32 , H01L33/483 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2224/73204 , H05K1/111 , H05K1/189 , H05K2201/09363 , H05K2201/10106
Abstract: A light emitting device that includes a substrate, a light emitting element and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions and a groove portion between the plurality of wiring portions. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate and the plurality of wiring portions are arranged on the base. The light emitting element is disposed on the substrate and electrically connected to the plurality of wiring portions. The sealing resin member seals the light emitting element and a part of the substrate. The sealing resin member is spaced apart from a first groove portion of the groove portion, the first groove portion extending in a second direction intersecting the first direction.
Abstract translation: 一种发光器件，包括衬底，发光元件和密封树脂构件。 基板包括柔性基座，多个布线部分和多个布线部分之间的槽部分。 柔性基部沿着与基板的纵向方向对应的第一方向延伸，并且多个布线部分布置在基部上。 发光元件设置在基板上并电连接到多个布线部分。 密封树脂构件密封发光元件和基板的一部分。 密封树脂部件与槽部的第一槽部分隔开，第一槽部沿与第一方向交叉的第二方向延伸。
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公开(公告)号：US20160087169A1
公开(公告)日：2016-03-24
申请号：US14956804
申请日：2015-12-02
Applicant: NICHIA CORPORATION
Inventor： Motokazu YAMADA , Tadaaki MIYATA , Naoki MORI
CPC classification number: H01L33/56 , F21S4/22 , F21Y2101/00 , F21Y2103/00 , F21Y2103/10 , F21Y2115/10 , H01L25/0753 , H01L27/15 , H01L33/32 , H01L33/483 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2224/73204 , H05K1/111 , H05K1/189 , H05K2201/09363 , H05K2201/10106
Abstract: A light emitting device includes a substrate, a light emitting device and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions, a groove portion and a pair of terminal portions. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate and the plurality of wiring portions are arranged on the flexible base. The groove portion is formed between the plurality of wiring portions spaced apart from each other. The pair of terminal portions is arranged along the first direction at the both sides of the plurality of wiring portions. The light emitting element is disposed on the substrate and electrically connected to the plurality of wiring portions. The sealing resin member seals the light emitting element and a part of the substrate. The light emitting element is mounted on the substrate in a flip-chip manner.
Abstract translation: 发光器件包括衬底，发光器件和密封树脂构件。 基板包括柔性基座，多个布线部分，槽部分和一对端子部分。 柔性基部沿着与基板的纵向相对应的第一方向延伸，并且多个布线部布置在柔性基部上。 槽部形成在彼此间隔开的多个配线部之间。 一对端子部分沿着第一方向布置在多个布线部分的两侧。 发光元件设置在基板上并电连接到多个布线部分。 密封树脂构件密封发光元件和基板的一部分。 发光元件以倒装芯片方式安装在基板上。
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