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公开(公告)号:US10325886B2
公开(公告)日:2019-06-18
申请号:US15705263
申请日:2017-09-15
Applicant: NICHIA CORPORATION
Inventor: Yukitoshi Marutani
IPC: H01L25/075 , H01L33/20
Abstract: A light emitting element includes a semiconductor including an active layer, and a planar shape of the light emitting elements including a concave polygon. The planar shape of the concave polygon has interior angles including at least one acute angle.
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公开(公告)号:US09279571B2
公开(公告)日:2016-03-08
申请号:US14080495
申请日:2013-11-14
Applicant: NICHIA CORPORATION
Inventor: Yukitoshi Marutani
IPC: F21S4/00 , F21V21/00 , F21V21/14 , H01L25/075 , H01L33/62
CPC classification number: F21V21/14 , H01L25/0753 , H01L33/62 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
Abstract: A light emitting device includes a substrate member and at least one light emitting element. The substrate member has a groove portion defined between two wiring portions spaced apart from each other. The groove portion includes a first groove portion, a second groove portion, and a third groove portion. The first groove portion extends in a direction that forms a slanted angle with respect to a first direction, the second groove portion is spaced apart from the first groove and extends in a direction that forms a slanted angle with respect to the first direction, and the third groove portion is interconnected with the first groove portion and the second groove portion. The light emitting element is disposed over the third groove portion.
Abstract translation: 发光器件包括衬底构件和至少一个发光元件。 基板部件具有限定在彼此间隔开的两个布线部分之间的槽部。 槽部包括第一槽部,第二槽部和第三槽部。 所述第一槽部沿相对于第一方向形成倾斜角的方向延伸,所述第二槽部与所述第一槽间隔开并且沿相对于所述第一方向形成倾斜角度的方向延伸, 第三槽部与第一槽部和第二槽部互连。 发光元件设置在第三凹槽部分上。
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公开(公告)号:US12189153B2
公开(公告)日:2025-01-07
申请号:US17214122
申请日:2021-03-26
Applicant: NICHIA CORPORATION
Inventor: Yukitoshi Marutani
Abstract: A method of producing a transmission grating includes: providing first and second glass plates, each having a first main surface defining a plurality of elongated reverse trapezoidal grooves, each having a reverse trapezoidal shape in a vertical cross-section and being defined by a first wall, a second wall, and a bottom surface, wherein the elongated reverse trapezoidal grooves are formed at an uniform interval, thus defining a plurality of elongated trapezoidal protrusions, each having a first wall, a second wall, and an upper surface; engaging the elongated trapezoidal protrusions of the first glass plate with the elongated reverse trapezoidal grooves of the second glass plate; and fitting the first walls of the protrusions with the first walls of the grooves and closely fitting the upper surfaces of the protrusions with the bottom surfaces of the grooves, and bonding the first glass plate to the second glass plate.
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公开(公告)号:US12095017B2
公开(公告)日:2024-09-17
申请号:US17369512
申请日:2021-07-07
Applicant: NICHIA CORPORATION
Inventor: Yukitoshi Marutani
IPC: H01L33/62 , H01L33/48 , H01L33/54 , H01L23/538 , H01L25/075 , H01L33/50 , H01L33/58 , H01L33/60 , H01L33/64
CPC classification number: H01L33/62 , H01L33/486 , H01L33/54 , H01L23/5387 , H01L25/0753 , H01L33/502 , H01L33/58 , H01L33/60 , H01L33/641 , H01L2224/16225
Abstract: A light emitting device includes a flexible substrate, a light emitting element, a conductive connecting material and a first holding member. The flexible substrate includes a flexible base and a wire. The first holding member is arranged on an opposite side surface to a surface of a side of the substrate on which the light emitting element is mounted. The first holding member surrounds a region corresponding to a region on the substrate including the light emitting element and the conductive connecting material in a plan view. The first holding member is arranged adjacent to the wire. The first holding member includes an inner region arranged on an inner side of the first holding member, and having higher rigidity than rigidity of the flexible base, and an outer region arranged adjacent to the inner region outside the inner region, and having lower rigidity than rigidity of the inner region.
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公开(公告)号:US11387392B2
公开(公告)日:2022-07-12
申请号:US16723857
申请日:2019-12-20
Applicant: NICHIA CORPORATION
Inventor: Yukitoshi Marutani
Abstract: A light-emitting device includes: a semiconductor stacked body comprising a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked in this order; a first insulating film that covers the active layer and the second conductive semiconductor layer; a first conductive layer that continuously surrounds a lateral surface of the first conductive semiconductor layer that is exposed from the first insulating film; a second insulating film that covers the first conductive layer, the active layer, and the second conductive semiconductor layer and that has a hole disposed above the second conductive semiconductor layer; and a second conductive layer that continuously covers, via the second insulating film, an end portion of the first conductive layer located in proximity to an end portion of the second conductive semiconductor layer, wherein the second conductive layer is connected to an upper surface of the second conductive semiconductor layer through the hole.
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公开(公告)号:US09711491B2
公开(公告)日:2017-07-18
申请号:US14928009
申请日:2015-10-30
Applicant: NICHIA CORPORATION
Inventor: Yukitoshi Marutani , Hiroto Tamaki , Tadaaki Miyata
IPC: H01L25/075 , H01L33/62 , H01L33/50 , H01L33/60 , F21K9/27 , F21Y103/10 , F21Y115/10
CPC classification number: H01L25/0753 , F21K9/27 , F21Y2103/10 , F21Y2115/10 , H01L33/50 , H01L33/60 , H01L33/62 , H01L2224/16
Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.
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公开(公告)号:US11430924B2
公开(公告)日:2022-08-30
申请号:US16750868
申请日:2020-01-23
Applicant: NICHIA CORPORATION
Inventor: Yukitoshi Marutani
Abstract: A wavelength conversion component includes a plurality of wavelength conversion members, a plurality of transmission type optical members respectively disposed on the wavelength conversion members, and a first member including a plurality of wall portions respectively located between adjacent ones of the wavelength conversion members. A light emitting device includes such wavelength conversion component.
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公开(公告)号:US11223000B2
公开(公告)日:2022-01-11
申请号:US16831812
申请日:2020-03-27
Applicant: NICHIA CORPORATION
Inventor: Yukitoshi Marutani
IPC: H01L33/00 , H01L33/62 , H01L25/075 , H01L25/13 , H01L25/00 , H01L33/58 , H01L23/492 , H01L23/498 , H01S5/023 , H01S5/0233 , H01S5/0235 , H01L33/60
Abstract: A method of manufacturing a light emitting element mounting base member includes: providing a first insulating member in a plate shaped having at least one recess portion or at least one through-hole; disposing in the recess portion or in the through-hole a light blocking resin and a plurality of core members each equipped with a second insulating member having light reflectivity on each surface of a plurality of electrical conductor cores; and exposing at least one of the surface of the electrical conductor cores from the second insulating members by removing each part of at least one of the second insulating members.
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公开(公告)号:US10790424B2
公开(公告)日:2020-09-29
申请号:US16006761
申请日:2018-06-12
Applicant: NICHIA CORPORATION
Inventor: Yukitoshi Marutani
IPC: H01L27/15 , H01L29/26 , H01L31/12 , H01L33/00 , H01L33/60 , H01L33/50 , H01L33/62 , H01L33/58 , H01L33/48 , H01L33/64
Abstract: A method of manufacturing a light-emitting device includes: providing a substrate having: a first surface, a second surface opposite to the first surface, a first through-hole extending from the first surface to the second surface, and wiring on the first surface; mounting a light-emitting element on the first surface to electrically connect an electrode of the light-emitting element and the wiring; providing a cover member having a concave portion for accommodating the light-emitting element; disposing the cover member such that the cover member faces the first surface of the substrate and the concave portion accommodates the light-emitting element and leads to the first through-hole; forming a light-transmissive resin in the concave portion such that a cavity is formed between (i) part of the first surface of the substrate around the light-emitting element and (ii) the light-transmissive resin; and injecting a reflective resin material into the cavity and the first through-hole.
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公开(公告)号:US10573796B2
公开(公告)日:2020-02-25
申请号:US16223229
申请日:2018-12-18
Applicant: NICHIA CORPORATION
Inventor: Yukitoshi Marutani
Abstract: A method of manufacturing a light emitting element mounting base member includes: arranging a plurality of core members each including an electrical conductor core and a light-reflecting insulating member provided on a surface of the electrical conductor core; cutting the arranged core members to form a base member preparatory body including at least one cut surface on which at least one of the electrical conductor cores and the insulating members are exposed; and insert molding by placing the base member preparatory body in a set of mold, and injecting a light blocking resin composition into the set of mold such that at least one of the electrical conductor cores or at least one metal film formed on at least one of the electrical conductor cores are exposed on at least one outer surface of the light emitting element mounting base member.
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