公开(公告)号：US20160240505A1

公开(公告)日：2016-08-18

申请号：US15024682

申请日：2014-11-11

申请人： NIPPON STEEL & SUMITOMO METAL CORPORATION ,  WASEDA UNIVERSITY

发明人： Kohei TATSUMI ,  Shinji ISHIKAWA ,  Norie MATSUBARA ,  Masamoto TANAKA

IPC分类号： H01L23/00

CPC分类号： H01L24/32 ,  B22F7/08 ,  B22F2999/00 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/28 ,  B23K35/30 ,  B23K35/3033 ,  C22C5/06 ,  C22C5/08 ,  C22C19/00 ,  C22C21/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/03436 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/04026 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2741 ,  H01L2224/29083 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29155 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2949 ,  H01L2224/29639 ,  H01L2224/29644 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/83055 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8384 ,  H01L2224/85207 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00015 ,  B22F1/0018 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01014 ,  H01L2924/0104 ,  H01L2924/01026 ,  H01L2924/01025 ,  H01L2924/01047 ,  H01L2924/01015 ,  H01L2924/01079 ,  H01L2924/0103 ,  H01L2924/0105 ,  H01L2924/00012

摘要： The present invention can give a joining structure using metal nanoparticles to join the same types or different types of metal where when one surface metal is Al based, the parts are joined through a joining layer containing Ni nanoparticles, whereby a good joining strength is obtained. Further, by using two joining layers (6, 8) including metal nanoparticles to sandwich metal foil (7) so as to form a joining layer and joining the same type or different types of surface metals (3-4) through this joining layer, it is possible to ease the thermal stress due to the difference in amounts of thermal expansion of joined members which have two surface metals.

摘要翻译： 本发明可以使用金属纳米粒子连接相同类型或不同类型的金属的接合结构，其中当一个表面金属为Al时，通过包含Ni纳米颗粒的接合层将部件接合，从而获得良好的接合强度。 此外，通过使用包含金属纳米颗粒的两个接合层（6,8）夹住金属箔（7）以形成接合层并通过该接合层接合相同类型或不同类型的表面金属（3-4） 由于具有两个表面金属的接合部件的热膨胀量的差异，可以减轻热应力。

公开(公告)号：US20170317048A1

公开(公告)日：2017-11-02

申请号：US15523865

申请日：2015-11-06

申请人： NIPPON STEEL & SUMITOMO METAL CORPORATION

发明人： Norie MATSUBARA ,  Shinji ISHIKAWA ,  Tomohiro UNO ,  Takayuki SHIMIZU ,  Naoya KITAMURA

IPC分类号： H01L23/00 ,  B22F7/08 ,  C22C1/08 ,  C22C19/03

CPC分类号： H01L24/32 ,  B22F7/08 ,  B23K20/00 ,  C22C1/08 ,  C22C19/03 ,  H01B5/16 ,  H01L21/52 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27436 ,  H01L2224/27848 ,  H01L2224/29011 ,  H01L2224/29155 ,  H01L2224/29355 ,  H01L2224/3201 ,  H01L2224/32245 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2924/10253 ,  H01L2924/10272

摘要： The present invention provides a conductive bonded assembly utilizing particles of Ni or an Ni alloy as conductive particles so as to enable firing under non-pressing conditions and further realize an excellent bonding strength, electron migration characteristic, and ion migration characteristic. The conductive bonded assembly of the present invention is a conductive bonded assembly of an electronic component which has a first bondable member (for example, electrode material), a second bondable member (for example, a semiconductor device on an Si or SiC substrate), and a conductive bonding layer bonding these bondable members together, where the bonding layer is an Ni sintered body formed by a sintered body of Ni particles which has a porosity of 30% or less, and, further, can be obtained by heating and sintering the Ni particles at the time of firing where the Ni sintered bonding layer is formed.

公开(公告)号：US20180033760A1

公开(公告)日：2018-02-01

申请号：US15546181

申请日：2016-01-26

申请人： NIPPON STEEL & SUMITOMO METAL CORPORATION

发明人： Shinji ISHIKAWA ,  Yoshiaki HAGIWARA ,  Norie MATSUBARA ,  Tomohiro UNO ,  Takayuki SHIMIZU

IPC分类号： H01L23/00 ,  B23K35/30 ,  B23K35/02

CPC分类号： H01L24/29 ,  B22F1/0014 ,  B22F7/064 ,  B22F7/08 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  H01L21/52 ,  H01L24/27 ,  H01L2224/27505 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/29255 ,  H01L2224/29266 ,  H01L2224/2927 ,  H01L2224/29271 ,  H01L2224/2928 ,  H01L2224/29284 ,  H01L2924/0424 ,  H01L2924/35121

摘要： A conductive joining material and conductive joined structure for joining two joining members by a joining layer using metal nanoparticles at the time of which even if there is a difference in the amounts of heat expansion due to a difference in linear thermal expansion coefficients between these two joining members and further use at a high temperature is sought, it is possible to adjust the amount of heat expansion of the joining layer to a suitable value between the two joining members to ease the thermal stress occurring at the joining layer and possible to sufficiently hold the joint strength between the two joining members are provided.A conductive joining material containing metal nanoparticles, microparticles of a conductive material, and a solvent, wherein the conductive material forming the microparticles has a linear thermal expansion coefficient smaller than the linear thermal expansion coefficient of the metal forming the nanoparticles and the microparticles of conductive material have an average particle size of 0.5 to 10 μm.