公开(公告)号：US20170133647A1

公开(公告)日：2017-05-11

申请号：US15318852

申请日：2015-06-12

Applicant: NITTO DENKO CORPORATION

Inventor： Takahiro FUKUOKA ,  Yoshiko KIRA ,  Kyoko ISHII ,  Kenta HATA ,  Hiroshi YUKAWA ,  Tomonori NANBU

IPC: H01M2/12 ,  H01G9/045 ,  H01G9/12 ,  H01M10/0525 ,  C22C5/04

CPC classification number: H01M2/1264 ,  B01D69/10 ,  B01D69/12 ,  B01D71/02 ,  B01D71/36 ,  B01D71/68 ,  C22C5/02 ,  C22C5/04 ,  C22C5/06 ,  C22C9/00 ,  C22F1/00 ,  C22F1/08 ,  C22F1/14 ,  H01G9/045 ,  H01G9/12 ,  H01G11/14 ,  H01M2/12 ,  H01M2/1241 ,  H01M10/0525 ,  H01M2200/20 ,  Y02E60/13

Abstract: The present invention provides a hydrogen-releasing film and a hydrogen-releasing laminated film that is free from defects even when the amount of hydrogen release is increased due to a large quantity of hydrogen gas generated within the electrochemical element, or an electrochemical element is used for a long period of time. The hydrogen-releasing film containing an alloy having Pd as an essential metal, wherein the hydrogen storage quantity when measured at 50° C. and a hydrogen partial pressure of 0.01 MPa is 0.4 (H/M) or less.

公开(公告)号：US20170133648A1

公开(公告)日：2017-05-11

申请号：US15318856

申请日：2015-06-12

Applicant: NITTO DENKO CORPORATION

Inventor： Takahiro FUKUOKA ,  Kyoko ISHII ,  Shunsuke MASAKI ,  Kenta HATA ,  Hiroshi YUKAWA ,  Tomonori NANBU

IPC: H01M2/12 ,  H01G9/12 ,  H01G9/045 ,  H01M10/0525

CPC classification number: H01M2/1264 ,  B01D69/10 ,  B01D69/12 ,  B01D71/02 ,  B01D71/36 ,  B01D71/38 ,  C22C5/04 ,  H01G9/045 ,  H01G9/12 ,  H01G11/14 ,  H01M2/12 ,  H01M2/1241 ,  H01M10/0525 ,  H01M2200/20 ,  Y02E60/13

Abstract: The objective of the present invention is to provide a hydrogen-releasing film, a composite hydrogen-releasing film and a hydrogen-releasing laminated film that are not prone to embrittlement in the usage environmental temperatures of electrochemical elements. The hydrogen-releasing film containing an alloy, wherein the alloy is a Pd—Au alloy, and the Au content in the Pd—Au alloy is 15 mol % or more.

公开(公告)号：US20150325380A1

公开(公告)日：2015-11-12

申请号：US14652144

申请日：2013-12-16

Applicant: NITTO DENKO CORPORATION ,  National University Corporation Nagoya University ,  Institute of National Colleges of Technology

Inventor： Takahiro FUKUOKA ,  Yoshiko KIRA ,  Kyoko ISHII ,  Kenta HATA ,  Hiroshi YUKAWA ,  Tomonori NANBU

IPC: H01G9/12 ,  H01G11/18 ,  H01M2/12 ,  F16K17/00 ,  C22C5/06 ,  C22C5/04

CPC classification number: B01D69/10 ,  B01D71/022 ,  C01B3/503 ,  C22C5/04 ,  C22C5/06 ,  C22C19/007 ,  C22C30/00 ,  C22C45/00 ,  C22C45/04 ,  C22F1/14 ,  F16K17/00 ,  H01G9/12 ,  H01G11/18 ,  H01M2/1223 ,  H01M2/1241 ,  H01M2/1294 ,  Y10T137/7837 ,  Y10T428/249979 ,  Y10T428/31533 ,  Y10T428/31544

Abstract: The purpose of the present invention is to provide a hydrogen-releasing film and a hydrogen-releasing laminated film which are less susceptible to embrittling at an ambient operating temperature of an electrochemical element. This hydrogen-releasing film comprises a Pd—Ag alloy and is characterized in that the content of Ag in the Pd—Ag alloy is 20 mol % or higher.

Abstract translation: 本发明的目的是提供一种在电化学元件的环境工作温度下不易脆化的释氢膜和放氢层压膜。 该释放氢的膜包含Pd-Ag合金，其特征在于Pd-Ag合金中的Ag含量为20摩尔％以上。

公开(公告)号：US20170133646A1

公开(公告)日：2017-05-11

申请号：US15318845

申请日：2015-06-12

Applicant: NITTO DENKO CORPORATION

Inventor： Takahiro FUKUOKA ,  Yoshiko KIRA ,  Kyoko ISHII ,  Kenta HATA ,  Hiroshi YUKAWA ,  Tomonori NANBU

IPC: H01M2/12 ,  H01M10/0525 ,  B21B3/00 ,  C23C14/34 ,  C23C14/14 ,  H01G9/12 ,  C22C5/04

CPC classification number: H01M2/1264 ,  B01D69/02 ,  B01D69/12 ,  B01D71/022 ,  B21B3/00 ,  C01B3/505 ,  C22C5/04 ,  C23C14/14 ,  C23C14/34 ,  H01G9/12 ,  H01G11/14 ,  H01M2/12 ,  H01M2/1241 ,  H01M10/0525 ,  H01M2200/20 ,  Y02E60/13

Abstract: The present invention provides a hydrogen-releasing film and a hydrogen-releasing laminated film that have high reliability as a safety valve since defects such as cracks do not occur before the internal pressure of an electrochemical element reaches a predetermined pressure. The hydrogen-releasing film contains an alloy having Pd as an essential metal, and the size of the crystal grains in the alloy is 0.028 μm or more.

公开(公告)号：US20160181583A1

公开(公告)日：2016-06-23

申请号：US14910373

申请日：2014-07-30

Applicant: NITTO DENKO CORPORATION ,  NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY ,  INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY, JAPAN

Inventor： Takahiro FUKUOKA ,  Yoshiko KIRA ,  Kyoko ISHII ,  Kenta HATA ,  Hiroshi YUKAWA ,  Tomonori NANBU

IPC: H01M2/12 ,  B01D53/22 ,  C22C5/04 ,  C22C9/00 ,  H01G9/12 ,  H01M10/0525

CPC classification number: H01M2/1264 ,  B01D53/02 ,  B01D53/22 ,  B01D65/003 ,  B01D69/12 ,  B01D71/022 ,  B01D2255/1023 ,  B01D2255/20761 ,  B01D2256/16 ,  B01D2257/108 ,  B01D2259/4525 ,  C22C5/04 ,  C22C9/00 ,  H01G9/12 ,  H01G11/18 ,  H01M2/1229 ,  H01M10/0525 ,  H01M2200/20 ,  Y02E60/13

Abstract: The purpose of the present invention is to provide a hydrogen-releasing film and a hydrogen-releasing laminated film which are less susceptible to embrittling at an ambient operating temperature of an electrochemical element. This hydrogen-releasing film is characterized by containing a Pd—Cu alloy, and the Cu content in the Pd—Cu alloy being at least 30 mol %.

Abstract translation: 本发明的目的是提供一种在电化学元件的环境工作温度下不易脆化的释氢膜和放氢层压膜。 该脱氢膜的特征在于含有Pd-Cu合金，Pd-Cu合金中的Cu含量为30摩尔％以上。