公开(公告)号：US09157004B2

公开(公告)日：2015-10-13

申请号：US14358164

申请日：2012-10-23

申请人： NOF CORPORATION ,  OSAKA UNIVERSITY

发明人： Eui-chul Kang ,  Tomoyuki Ohtake ,  Katsuaki Suganuma ,  Masaya Nogi ,  Natsuki Komoda

IPC分类号： C09K13/06 ,  C09D11/52 ,  C23C18/08 ,  H01B1/22 ,  C09D11/30 ,  C23C18/06 ,  H05K1/09 ,  H05K3/12

CPC分类号： C09D11/52 ,  C09D11/30 ,  C09D11/32 ,  C23C18/06 ,  C23C18/08 ,  H01B1/22 ,  H05K1/097 ,  H05K3/1283 ,  H05K2203/121

摘要： A composition for copper patterning and a method of copper patterning using the composition are provided, which composition is excellently safe in copper patterning, sintering at lower temperatures, and capable of forming a highly conducive copper pattern of a desired shape even on a plastic substrate. The composition contains Component A: a copper β-ketocarboxylate compound of formula (1): (R1, R2: H or C1-C6 straight- or C3-C6 branched-hydrocarbon group, etc.); and based on 1 mol of this compound, Component B: an amine compound having a boiling point of not higher than 250° C. at 0.1 to 500 mol; and Component C-1: an organic acid having pKa of not more than 4 at 0.01 to 20 mol, and/or Component C-2: an organic copper compound composed of copper and an organic acid having pKa of not more than 4 at 0.01 to 100 mol. The composition is useful in the field of electronics.

摘要翻译： 提供了一种用于铜图案化的组合物和使用该组合物的铜图案化方法，该组合物在铜图案化中是非常安全的，在较低温度下烧结，并且即使在塑料基板上也能够形成所需形状的高导电性铜图案。 该组合物含有组分A：式（1）的铜＆bgr-酮羧酸盐化合物：（R1，R2：H或C1-C6直链或C3-C6支链烃基等）; 并且基于1摩尔该化合物，组分B：沸点不高于250℃的胺化合物，0.1至500摩尔; 和组分C-1：在0.01至20mol下pKa不大于4的有机酸和/或组分C-2：由铜和有机酸组成的有机铜化合物，其中pKa不大于4，0.01 至100mol。 该组合物在电子领域是有用的。

公开(公告)号：US20140305684A1

公开(公告)日：2014-10-16

申请号：US14358164

申请日：2012-10-23

申请人： NOF CORPORATION ,  OSAKA UNIVERSITY

发明人： Eui-chul Kang ,  Tomoyuki Ohtake ,  Katsuaki Suganuma ,  Masaya Nogi ,  Natsuki Komoda

IPC分类号： C09D11/00 ,  C23C18/08

CPC分类号： C09D11/52 ,  C09D11/30 ,  C09D11/32 ,  C23C18/06 ,  C23C18/08 ,  H01B1/22 ,  H05K1/097 ,  H05K3/1283 ,  H05K2203/121

摘要： A composition for copper patterning and a method of copper patterning using the composition are provided, which composition is excellently safe in copper patterning, sintering at lower temperatures, and capable of forming a highly conducive copper pattern of a desired shape even on a plastic substrate. The composition contains Component A: a copper β-ketocarboxylate compound of formula (1): (R1, R2: H or C1-C6 straight- or C3-C6 branched-hydrocarbon group, etc.); and based on 1 mol of this compound, Component B: an amine compound having a boiling point of not higher than 250° C. at 0.1 to 500 mol; and Component C-1: an organic acid having pKa of not more than 4 at 0.01 to 20 mol, and/or Component C-2: an organic copper compound composed of copper and an organic acid having pKa of not more than 4 at 0.01 to 100 mol. The composition is useful in the field of electronics.

摘要翻译： 提供了一种用于铜图案化的组合物和使用该组合物的铜图案化方法，该组合物在铜图案化中是非常安全的，在较低温度下烧结，并且即使在塑料基板上也能够形成所需形状的高导电性铜图案。 该组合物含有组分A：式（1）的铜＆bgr-酮羧酸盐化合物：（R1，R2：H或C1-C6直链或C3-C6支链烃基等）; 并且基于1摩尔该化合物，组分B：沸点不高于250℃的胺化合物，0.1至500摩尔; 和组分C-1：在0.01至20mol下pKa不大于4的有机酸和/或组分C-2：由铜和有机酸组成的有机铜化合物，其中pKa不大于4，0.01 至100mol。 该组合物在电子领域是有用的。

公开(公告)号：US09620286B2

公开(公告)日：2017-04-11

申请号：US14311546

申请日：2014-06-23

申请人： NIPPON MEKTRON, LTD. ,  OSAKA UNIVERSITY

发明人： Masaya Nogi ,  Katsuaki Suganuma ,  Hirotaka Koga ,  Natsuki Komoda ,  Hirofumi Matsumoto ,  Masayuki Iwase ,  Kazuyuki Ozaki ,  Keizo Toyama

IPC分类号： H01G4/16 ,  H05K1/09 ,  H05K1/00 ,  H05K1/16 ,  D21H21/14 ,  D21H11/10 ,  H01G4/20 ,  H05K3/46 ,  H05K1/03 ,  H05K1/02

CPC分类号： H01G4/16 ,  D21H11/10 ,  D21H21/14 ,  H01G4/203 ,  H05K1/02 ,  H05K1/0386 ,  H05K1/162 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/026 ,  H05K2201/09672 ,  H05K2203/178 ,  Y10T428/249921

摘要： Disclosed are an insulating material (high-k layer) which includes a fiber assembly mainly composed of a cellulose nanofiber, and an electroconductive metal material supported by the fiber assembly; and a passive element (capacitor) which includes a high-k layer which is composed of the insulating material, and an electroconductive part stacked on the high-k layer.

公开(公告)号：US20150030783A1

公开(公告)日：2015-01-29

申请号：US14383170

申请日：2013-03-08

申请人： SHOWA DENKO K.K. ,  OSAKA UNIVERSITY

发明人： Katsuaki Suganuma ,  Masaya Nogi ,  Jinting Jiu ,  Tohru Sugahara ,  Hiroshi Uchida ,  Kenji Shinozaki

IPC分类号： H01B13/00 ,  H05K3/10

CPC分类号： H01B13/003 ,  H01B13/0026 ,  H05K1/0306 ,  H05K1/097 ,  H05K3/10 ,  H05K3/106 ,  H05K2201/0108 ,  H05K2201/026

摘要： A method for producing a transparent conductive pattern having an improved conductivity by pulse light irradiation. A transparent conductive pattern is produced by coating and drying a dispersion liquid having metal nanowires dispersed therein on a substrate, to deposit the metal nanowires, and irradiating pulsed light having a pulse width of 20 microseconds to 50 milliseconds to the metal nanowires deposited on the substrate, to thereby join intersections of the metal nanowires.

摘要翻译： 一种通过脉冲光照射产生具有改善的导电性的透明导电图案的方法。 通过将分散在其中的金属纳米线的分散液涂布并干燥在基板上，沉积金属纳米线，并将脉冲宽度为20微秒至50毫秒的脉冲光照射到沉积在基板上的金属纳米线，制成透明导电图案 从而连接金属纳米线的交点。

公开(公告)号：US10099291B2

公开(公告)日：2018-10-16

申请号：US14893329

申请日：2014-05-26

申请人： SHOWA DENKO K.K. ,  OSAKA UNIVERSITY

发明人： Katsuaki Suganuma ,  Jinting Jiu ,  Masaya Nogi ,  Tohru Sugahara ,  Teppei Araki ,  Hiroshi Uchida ,  Hideki Ohata ,  Masanao Hara ,  Eri Okazaki

IPC分类号： B22F9/24 ,  B22F1/00 ,  B82Y30/00 ,  B82Y40/00

摘要： Provided are a metal nanowire production method capable of producing long and thin metal nanowires, and metal nanowires produced thereby. A metal nanowire production method comprising, a step for preparing a solution containing a metal salt, a polymer, at least one selected from a group consisting of halides, sulfides, carbonates, and sulfates, and an aliphatic alcohol, and a step for heating and reacting the solution at the temperature of 100° C. to 250° C. for 10 minutes or more while maintaining a practical shear stress applied to the solution at 10 mPa·m or less, wherein, during the heating and reacting step, ultraviolet-visible absorption spectrum change of the solution is measured, and a reaction time is controlled on the basis of the ultraviolet-visible absorption spectrum information.

公开(公告)号：US20150014039A1

公开(公告)日：2015-01-15

申请号：US14311546

申请日：2014-06-23

申请人： NIPPON MEKTRON, LTD. ,  OSAKA UNIVERSITY

发明人： Masaya Nogi ,  Katsuaki Suganuma ,  Hirotaka Koga ,  Natsuki Komoda ,  Hirofumi Matsumoto ,  Masayuki Iwase ,  Kazayuki Ozaki ,  Keizo Toyama

IPC分类号： H01G4/16 ,  D21H21/14 ,  D21H11/10 ,  H05K1/18

CPC分类号： H01G4/16 ,  D21H11/10 ,  D21H21/14 ,  H01G4/203 ,  H05K1/02 ,  H05K1/0386 ,  H05K1/162 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/026 ,  H05K2201/09672 ,  H05K2203/178 ,  Y10T428/249921

摘要： Disclosed are an insulating material (high-k layer) which includes a fiber assembly mainly composed of a cellulose nanofiber, and an electroconductive metal material supported by the fiber assembly; and a passive element (capacitor) which includes a high-k layer which is composed of the insulating material, and an electroconductive part stacked on the high-k layer.

摘要翻译： 公开了一种绝缘材料（高k层），其包括主要由纤维素纳米纤维构成的纤维集合体和由纤维集合体支撑的导电金属材料; 以及包括由绝缘材料构成的高k层的无源元件（电容器）和堆叠在高k层上的导电部分。