Abstract:
A method for producing a transparent conductive pattern having an improved conductivity by pulse light irradiation. A transparent conductive pattern is produced by coating and drying a dispersion liquid having metal nanowires dispersed therein on a substrate, to deposit the metal nanowires, and irradiating pulsed light having a pulse width of 20 microseconds to 50 milliseconds to the metal nanowires deposited on the substrate, to thereby join intersections of the metal nanowires.
Abstract:
Provided are a metal nanowire production method capable of producing long and thin metal nanowires, and metal nanowires produced thereby. A metal nanowire production method comprising, a step for preparing a solution containing a metal salt, a polymer, at least one selected from a group consisting of halides, sulfides, carbonates, and sulfates, and an aliphatic alcohol, and a step for heating and reacting the solution at the temperature of 100° C. to 250° C. for 10 minutes or more while maintaining a practical shear stress applied to the solution at 10 mPa·m or less, wherein, during the heating and reacting step, ultraviolet-visible absorption spectrum change of the solution is measured, and a reaction time is controlled on the basis of the ultraviolet-visible absorption spectrum information.
Abstract:
Provided are a transparent conductive substrate production method for an electrostatic capacitance touch panel having a high pattern recognition property, by simple steps without using a vacuum process and a wet etching method, as well as a transparent conductive substrate and an electrostatic capacitance touch panel. An electrode drawing lead wiring pattern is formed on at least one main face of a transparent film using a conductive paste. An electrode pattern forming unit prints an electrode pattern with a transparent conductive pattern forming ink containing metal nanowires or metal nanoparticles so that the electrode pattern is connected to the electrode drawing lead wiring pattern, and dries the printed electrode pattern. The dried electrode pattern is subjected to pulsed light irradiation by a photoirradiation unit 18, to sinter the metal nanowires or the metal nanoparticles contained in the transparent conductive pattern forming ink.
Abstract:
A thermosetting resin composition includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). Polyalkenyl phenol resin (A) has at least one aromatic ring unit (a1) which may have a 2-alkenyl group bonded thereto and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group and which may have a 2-alkenyl group bonded thereto. At least one of aromatic ring units (a1, a2) has a 2-alkenyl group. Each aromatic ring unit is bonded by a linking group. When m represents the number of aromatic ring units (a1), and n represents the number of aromatic ring units (a2), n to (m+n) is 10-60%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).
Abstract:
Provided are a transparent electrode and a production method thereof, the transparent electrode using metal nanowires and/or metal nanotubes as conductive components, and showing favorable surface flatness, conductivity, and light transmittance. A transparent conductive ink is prepared by dispersing metal nanowires and/or metal nanotubes in a solution formed by dissolving a thermoset or thermoplastic binder resin having no fluidity within the range of 5 to 40° C. to a solvent, the content of the binder resin being 100 to 2500 parts by mass relative to 100 parts by mass of the metal nanowires and/or metal nanotubes. An electrode pattern having a desired shape is printed on a substrate with the transparent conductive ink, and pulsed light is irradiated to the printed electrode pattern, to thereby obtain a transparent electrode having a surface resistance of 0.1 to 500Ω/□ and a surface arithmetic average roughness Ra satisfying Ra≦5 nm.
Abstract:
Provided are a conductive pattern forming method and a composition for forming a conductive pattern by photo irradiation or microwave heating, capable of increasing the conductivity of the conductive pattern. A conductive pattern is formed by preparing a composition for forming a conductive pattern comprising, copper particles each having a copper oxide thin film on the entirety or a part of the surface thereof, copper oxide particles, a reducing agent such as a polyhydric alcohol, a carboxylic acid, or a polyalkylene glycol, and a binder resin; forming a printed pattern having any selected shape on a substrate using this composition for forming a conductive pattern; and subjecting the printed pattern to photo irradiation or microwave heating to generate a sintered body of copper.
Abstract:
To provide a conductive pattern formation method capable of improving conductivity of a conductive pattern and a composition for forming a conductive pattern by means of photo irradiation or microwave heating. A composition for forming a conductive pattern that contains copper particles each having a copper oxide thin film formed on the entire or a part of a surface thereof, plate-like silver particles each being 10 to 200 nm thickness, and a binder resin is prepared. The composition for forming a conductive pattern is printed in a pattern having a desired shape on a substrate. Photo irradiation or microwave heating is applied to the printed pattern to thereby produce a copper/silver sintered body, to form a conductive film.
Abstract:
A coating layer 12 is formed on a base film 10 by heat resistant resin having a Tg (glass transition temperature) of 120° C. or more, and more preferably 200° C. or more, and a functional thin film 14 is produced by printing ink composite including conductive particles on a surface of the coating layer 12 and thereby forming an ink layer. This functional thin film 14 is sintered by heating performed by photo irradiation, and a conductive layer is formed thereby.
Abstract:
Provided is a microwave heating apparatus capable of effectively preventing the generation of sparks when an object containing a conductor (including a metal precursor such as a metal oxide) or a semiconductor is subjected to microwave heating. A microwave heating apparatus supplies a microwave so that the direction of the electrical flux line of the microwave is identical with the direction substantially parallel with a surface of a plate-like substrate and having thereon a pattern containing a conductor, a metal oxide, or a semiconductor, the substrate being arranged in the waveguide. The microwave heating apparatus also controls a pulse width of the microwave so that pulsed microwaves are supplied to the surface having the pattern thereon.
Abstract:
Provided is a microwave heating apparatus capable of effectively preventing the generation of sparks when an object containing a conductor (including a metal precursor such as a metal oxide) or a semiconductor is subjected to microwave heating. A microwave heating apparatus supplies a microwave so that the direction of the electrical flux line of the microwave is identical with the direction substantially parallel with a surface of a plate-like substrate and having thereon a pattern containing a conductor, a metal oxide, or a semiconductor, the substrate being arranged in the waveguide. The microwave heating apparatus also controls a pulse width of the microwave so that pulsed microwaves are supplied to the surface having the pattern thereon.