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公开(公告)号：US08110917B2
公开(公告)日：2012-02-07
申请号：US12581205
申请日：2009-10-19
申请人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
发明人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
IPC分类号： H01L23/48
CPC分类号： H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
摘要： A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.
摘要翻译： 一种包含衬底的封装衬底310，该衬底设置有导体层5，导电连接销100被布置成与主板建立电连接并固定到衬底的表面，其中提供用于固定导电连接销的焊盘16，用于 封装衬底310.衬垫16被具有开口18的有机树脂绝缘层15覆盖，衬垫16通过该开口局部暴露于外部。 导电连接销100通过导电粘合剂17通过开口固定到暴露于外部的焊盘，从而防止例如当执行安装时发生例如导电连接销100从基板的溶液。
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公开(公告)号：US07902659B2
公开(公告)日：2011-03-08
申请号：US12359663
申请日：2009-01-26
申请人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
发明人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
IPC分类号： H01L23/48 , H01L21/4763
CPC分类号： H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
摘要： A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.
摘要翻译： 一种包含衬底的封装衬底310，该衬底设置有导体层5，导电连接销100被布置成与母板建立电连接并固定到衬底的表面，其中提供用于固定导电连接销的衬垫16 用于封装衬底310.衬垫16被具有开口18的有机树脂绝缘层15覆盖，衬垫16通过该开口部分地暴露于外部。 导电连接销100通过导电粘合剂17通过开口固定到暴露于外部的焊盘，从而防止例如当执行安装时发生例如导电连接销100从基板的溶液。
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公开(公告)号：US08035214B1
公开(公告)日：2011-10-11
申请号：US09830949
申请日：1999-11-17
申请人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
发明人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
IPC分类号： H01L23/48 , H01L21/4763
CPC分类号： H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
摘要： A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.
摘要翻译： 一种包含衬底的封装衬底310，该衬底设置有导体层5，导电连接销100被布置成与母板建立电连接并固定到衬底的表面，其中提供用于固定导电连接销的衬垫16 用于封装衬底310.衬垫16被具有开口18的有机树脂绝缘层15覆盖，衬垫16通过该开口部分地暴露于外部。 导电连接销100通过导电粘合剂17通过开口固定到暴露于外部的焊盘，从而防止例如当执行安装时发生例如导电连接销100从基板的溶液。
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公开(公告)号：US20100032200A1
公开(公告)日：2010-02-11
申请号：US12581205
申请日：2009-10-19
申请人： Naohiro HIROSE , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
发明人： Naohiro HIROSE , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
IPC分类号： H05K1/11
CPC分类号： H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
摘要： A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.
摘要翻译： 一种包含衬底的封装衬底310，该衬底设置有导体层5，导电连接销100被布置成与主板建立电连接并固定到衬底的表面，其中提供用于固定导电连接销的焊盘16，用于 封装衬底310.衬垫16被具有开口18的有机树脂绝缘层15覆盖，衬垫16通过该开口局部暴露于外部。 导电连接销100通过导电粘合剂17通过开口固定到暴露于外部的焊盘，从而防止例如当执行安装时发生例如导电连接销100从基板的溶液。
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公开(公告)号：US08536696B2
公开(公告)日：2013-09-17
申请号：US12546950
申请日：2009-08-25
申请人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
发明人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
CPC分类号： H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
摘要： A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed through the outermost interlayer resin insulating layer and for electrically connecting the pad structure to one or more conductive circuits formed below the outermost interlayer resin insulating layer, the via holes being positioned directly below the pad structure.
摘要翻译： 包括最外层间树脂绝缘层，形成在最外层间树脂绝缘层上的焊盘结构的封装基板，用于与另一基板建立电连接的导电连接引脚，所述导电连接引脚通过焊料固定在焊盘结构上， 以及通过最外层间树脂绝缘层形成的通孔，并且将焊盘结构电连接到在最外层间树脂绝缘层下形成的一个或多个导电电路，通孔位于焊盘结构的正下方。
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公开(公告)号：US07847393B2
公开(公告)日：2010-12-07
申请号：US12257501
申请日：2008-10-24
申请人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
发明人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
IPC分类号： H01L23/48 , H01L21/4763
CPC分类号： H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
摘要： A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.
摘要翻译： 一种包含衬底的封装衬底310，该衬底设置有导体层5，导电连接销100被布置成与母板建立电连接并固定到衬底的表面，其中提供用于固定导电连接销的衬垫16 用于封装衬底310.衬垫16被具有开口18的有机树脂绝缘层15覆盖，衬垫16通过该开口部分地暴露于外部。 导电连接销100通过导电粘合剂17通过开口固定到暴露于外部的焊盘，从而防止例如当执行安装时发生例如导电连接销100从基板的溶液。
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公开(公告)号：US20090053459A1
公开(公告)日：2009-02-26
申请号：US12257501
申请日：2008-10-24
申请人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
发明人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
IPC分类号： B32B1/04
CPC分类号： H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
摘要： A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.
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公开(公告)号：US07723620B2
公开(公告)日：2010-05-25
申请号：US11572334
申请日：2005-08-30
申请人： Masanori Kawade , Hiroyuki Tsuruga , Makoto Ebina
发明人： Masanori Kawade , Hiroyuki Tsuruga , Makoto Ebina
CPC分类号： H01L24/81 , H01L23/49811 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15312 , H05K3/3426 , H05K2201/10318 , H05K2201/1084 , Y02P70/613 , H01L2224/05599
摘要： A semiconductor loading lead pin that does not tilt at a time of reflow. A void is sometimes left in solder between an electrode pad and the flange of a semiconductor loading lead pin. When reflow is carried out to load an IC chip, the solder for connection is melted and at the same time, the void in the solder is expanded. The solder escapes sideway along the groove portion, and thereby a flange is not raised by the void so that the semiconductor loading lead pin is not tilted.
摘要翻译： 半导体负载引脚，在回流时不倾斜。 在电极焊盘和半导体负载引脚的凸缘之间的焊料中有时留下空隙。 当进行回流以加载IC芯片时，用于连接的焊料熔化，并且同时焊料中的空隙膨胀。 焊料沿着槽部侧向逸出，由此凸缘不会被空隙升高，使得半导体负载引脚不倾斜。
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公开(公告)号：US08426748B2
公开(公告)日：2013-04-23
申请号：US12725546
申请日：2010-03-17
申请人： Masanori Kawade , Hiroyuki Tsuruga , Makoto Ebina
发明人： Masanori Kawade , Hiroyuki Tsuruga , Makoto Ebina
IPC分类号： H05K1/11
CPC分类号： H01L24/81 , H01L23/49811 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15312 , H05K3/3426 , H05K2201/10318 , H05K2201/1084 , Y02P70/613 , H01L2224/05599
摘要： A lead pin comprising including a body having a shaft portion and a flange portion. The flange portion has at least one flat portion configured to face a connection pad and groove portions positioned to face toward the connection pad and extending from a peripheral portion toward a center portion of the flange portion, the flat portion includes extending portions extending from a center of the flange toward the peripheral portion of the flange and connected at the center of the flange, and the groove portions are tilted to become deeper toward the peripheral portion of the flange.
摘要翻译： 一种引导销，包括包括具有轴部分的主体和凸缘部分。 凸缘部具有至少一个平坦部分，其被构造成面对连接焊盘和定位成面向连接焊盘并从周边部分朝向凸缘部分的中心部分延伸的凹槽部分，平坦部分包括从中心延伸的延伸部分 凸缘朝向凸缘的周边部分并且连接在凸缘的中心，并且槽部倾斜以朝向凸缘的周边部分变深。
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公开(公告)号：US20080055874A1
公开(公告)日：2008-03-06
申请号：US11572334
申请日：2005-08-30
申请人： Masanori Kawade , Hiroyuki Tsuruga , Makoto Ebina
发明人： Masanori Kawade , Hiroyuki Tsuruga , Makoto Ebina
IPC分类号： H01R9/00
CPC分类号： H01L24/81 , H01L23/49811 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15312 , H05K3/3426 , H05K2201/10318 , H05K2201/1084 , Y02P70/613 , H01L2224/05599
摘要： A semiconductor loading lead pin that does not tilt at a time of reflow. A void is sometimes left in solder between an electrode pad and the flange of a semiconductor loading lead pin. When reflow is carried out to load an IC chip, the solder for connection is melted and at the same time, the void in the solder is expanded. The solder escapes sideway along the groove portion, and thereby a flange is not raised by the void so that the semiconductor loading lead pin is not tilted.
摘要翻译： 半导体负载引脚，在回流时不倾斜。 在电极焊盘和半导体负载引脚的凸缘之间的焊料中有时留下空隙。 当进行回流以加载IC芯片时，用于连接的焊料熔化，并且同时焊料中的空隙膨胀。 焊料沿着槽部侧向逸出，由此凸缘不会被空隙升高，使得半导体负载引脚不倾斜。
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