公开(公告)号：US08429815B2

公开(公告)日：2013-04-30

申请号：US12298962

申请日：2007-06-29

申请人： Naoki Matsuzaki ,  Kazuya Ishiwata ,  Hiroaki Toshima

发明人： Naoki Matsuzaki ,  Kazuya Ishiwata ,  Hiroaki Toshima

IPC分类号： H05K3/02 ,  H05K3/10 ,  H05K1/09

CPC分类号： C03C17/008 ,  C03C17/02 ,  C03C17/06 ,  C03C17/36 ,  C03C17/3607 ,  C03C17/3642 ,  C03C17/3655 ,  C03C17/3668 ,  C03C2217/40 ,  C03C2217/479 ,  C03C2218/32 ,  H01L21/4867 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/02 ,  H05K3/38 ,  H05K2203/0514 ,  H05K2203/1105 ,  Y10T29/49155 ,  H01L2924/00

摘要： A method for manufacturing an electronic substrate structure comprising a substrate, a glass layer, and a conductive layer. This method may include the steps of arranging the glass layer on the substrate, arranging the conductive layer that includes a precious metal particle on the glass layer while directly contacting the glass layer, and heating the glass layer together with the conductive layer at a temperature that is lower than a softening point of the glass layer so that the particle is put into the glass layer. The particle has a diameter of not less than 1 μm and not more than 10 μm.

摘要翻译： 一种用于制造包括基板，玻璃层和导电层的电子基板结构的方法。 该方法可以包括以下步骤：将玻璃层布置在基板上，将包含贵金属颗粒的导电层布置在玻璃层上，同时直接接触玻璃层，并在与导电层一起加热玻璃层的温度下， 低于玻璃层的软化点，使得颗粒放入玻璃层中。 颗粒的直径不小于1μm，不大于10μm。

公开(公告)号：US20090091916A1

公开(公告)日：2009-04-09

申请号：US12298962

申请日：2007-06-29

申请人： Naoki Matsuzaki ,  Kazuya Ishiwata ,  Hiroaki Toshima

发明人： Naoki Matsuzaki ,  Kazuya Ishiwata ,  Hiroaki Toshima

IPC分类号： F21V9/16 ,  H05K1/16 ,  H05K7/02 ,  C03B19/00

CPC分类号： C03C17/008 ,  C03C17/02 ,  C03C17/06 ,  C03C17/36 ,  C03C17/3607 ,  C03C17/3642 ,  C03C17/3655 ,  C03C17/3668 ,  C03C2217/40 ,  C03C2217/479 ,  C03C2218/32 ,  H01L21/4867 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/02 ,  H05K3/38 ,  H05K2203/0514 ,  H05K2203/1105 ,  Y10T29/49155 ,  H01L2924/00

摘要： To provide a method for simply manufacturing a substrate provided with a flat surface shape. Specifically, a method for manufacturing a substrate according to the present invention includes the steps of preparing a structure including a glass layer and a precious metal particle having a diameter not less than 1 μm and not more than 10 μm disposed on the glass layer while contacting thereto; and putting the precious metal particle in the glass layer by heating the structure at a temperature which is lower than a softening point of the glass layer.

摘要翻译： 提供简单地制造具有平坦表面形状的基板的方法。 具体而言，本发明的基板的制造方法包括以下工序：在玻璃层上配置玻璃层和玻璃层的直径不小于1μm且为10μm以下的贵金属粒子的结构， 到; 并通过在比玻璃层的软化点低的温度下加热该结构，将贵金属颗粒放入玻璃层。

公开(公告)号：US06902455B2

公开(公告)日：2005-06-07

申请号：US10241576

申请日：2002-09-12

申请人： Yoshihiro Yanagisawa ,  Kazuya Ishiwata ,  Hiroaki Toshima

发明人： Yoshihiro Yanagisawa ,  Kazuya Ishiwata ,  Hiroaki Toshima

IPC分类号： H01J1/316 ,  H01J9/02 ,  H01J9/00

CPC分类号： H01J9/027 ,  H01J1/316

摘要： There is provided a method of manufacturing a member pattern having on a substrate, a patterned first belt-shaped member and a plurality of second belt-shaped members that are patterned over from the first belt-shaped member to the substrate, the method including: forming the first belt-shaped member by a printing method; and forming the second belt-shaped members by a process involving exposure and development using a photosensitive material.

摘要翻译： 提供了一种制造在基板上形成图案化的第一带状构件和从第一带状构件到基板图案化的多个第二带状构件的构件图案的方法，该方法包括： 通过印刷方法形成第一带状构件; 以及通过使用感光材料进行曝光和显影的工艺来形成第二带状构件。

公开(公告)号：US07642702B2

公开(公告)日：2010-01-05

申请号：US11767877

申请日：2007-06-25

申请人： Masafumi Moriya ,  Kazuya Ishiwata ,  Hiroaki Toshima

发明人： Masafumi Moriya ,  Kazuya Ishiwata ,  Hiroaki Toshima

IPC分类号： H01J1/02

CPC分类号： H05K3/4685 ,  H01J17/04 ,  H01J29/04 ,  H05K3/107 ,  H05K2201/0209 ,  H05K2201/09245 ,  H05K2201/10287 ,  H05K2203/0315

摘要： To provide an electron source including: a wiring board having: a substrate provided with a groove on its surface; a first conductive member which is arranged along the groove in the groove; and a second conductive member which is arranged above the first conductive member crossing the first conductive member; and an electron-emitting device which is arranged on the wiring board and is electrically connected to the first conductive member and the second conductive member; wherein a particle is arranged between the first conductive member and an inner wall of the groove.

摘要翻译： 提供一种电子源，包括：布线板，其具有：在其表面上设置有沟槽的基板; 第一导电构件，沿着沟槽中的凹槽布置; 以及第二导电构件，其布置在与所述第一导电构件交叉的所述第一导电构件的上方; 以及电子发射器件，其布置在所述布线板上并电连接到所述第一导电部件和所述第二导电部件; 其中，所述第一导电构件和所述凹槽的内壁之间布置有颗粒。

公开(公告)号：US20050062391A1

公开(公告)日：2005-03-24

申请号：US10959195

申请日：2004-10-07

申请人： Hiroaki Toshima ,  Kazuya Ishiwata ,  Yoshimi Uda

发明人： Hiroaki Toshima ,  Kazuya Ishiwata ,  Yoshimi Uda

IPC分类号： H01J1/316 ,  H01J9/02 ,  H01J1/62

CPC分类号： H01J1/316 ,  H01J9/027

摘要： In an electron source having an electron emitting member, the electron emitting member is connected to a first or second conductive member by a third conductive member which is connected to the first or second conductive member through an aperture forming in an insulating member, and such aperture has such a shape as to become narrower from an end of the third conductive member toward the other end. Such configuration avoids that the third conductive member is damaged in the connecting portion with the first or second conductive member by the thermal stress therein.

公开(公告)号：US06853117B2

公开(公告)日：2005-02-08

申请号：US10207842

申请日：2002-07-31

申请人： Hiroaki Toshima ,  Kazuya Ishiwata ,  Yoshimi Uda

发明人： Hiroaki Toshima ,  Kazuya Ishiwata ,  Yoshimi Uda

IPC分类号： H01J1/316 ,  H01J9/02 ,  H01J1/00

CPC分类号： H01J1/316 ,  H01J9/027

摘要： In an electron source having an electron emitting member, the electron emitting member is connected to a first or second conductive member by a third conductive member which is connected to the first or second conductive member through an aperture forming in an insulating member, and such aperture has such a shape as to become narrower from an end of the third conductive member toward the other end. Such configuration avoids that the third conductive member is damaged in the connecting portion with the first or second conductive member by the thermal stress therein.

摘要翻译： 在具有电子发射部件的电子源中，电子发射部件通过第三导电部件连接到第一导电部件或第二导电部件，该第三导电部件通过在绝缘部件上形成的孔与第一导电部件或第二导电部件连接， 具有从第三导电构件的端部朝向另一端变窄的形状。 这种构造避免了第三导电构件在与第一或第二导电构件的连接部分中受其中的热应力的损坏。

公开(公告)号：US06758712B2

公开(公告)日：2004-07-06

申请号：US10011405

申请日：2001-12-11

申请人： Shinsaku Kubo ,  Kazuya Ishiwata ,  Yoshimi Uda ,  Yasuyuki Watanabe ,  Hiroaki Toshima

发明人： Shinsaku Kubo ,  Kazuya Ishiwata ,  Yoshimi Uda ,  Yasuyuki Watanabe ,  Hiroaki Toshima

IPC分类号： H01J924

CPC分类号： H01J9/027 ,  H01J9/185 ,  H05K3/4664 ,  Y10T29/49155

摘要： The wirings on an electron source substrate are formed to intersect with each other in a matrix so as to address the electron emission devices on the substrate. First and second wirings intersect with each other on a crossing point. As such a crossing point, an insulating layer is placed between the first and second wirings. To ensure insulation, a plurality of insulating layers are laminated. According to the present invention, a wiring pattern is provided on the substrate with a conductive paste and baking the wiring pattern of the conductive paste to form the first wiring. Subsequently part of the first wiring is coated at the crossing point with an insulating paste and baking the insulating paste to form a first insulating layer. The coating thickness of the insulating layer formed adjacent to sidewalls of the crossing point is substanially equal to the height of the first wiring.

摘要翻译： 电子源基板上的布线形成为以矩阵相互交叉，以便寻址基板上的电子发射器件。 第一和第二布线在交叉点处彼此相交。 作为这样的交叉点，绝缘层被放置在第一和第二布线之间。 为了确保绝缘，层叠多个绝缘层。 根据本发明，通过导电膏在基板上设置布线图案，并烘烤导电浆料的布线图形，形成第一布线。 随后，第一布线的一部分在交叉点用绝缘膏涂覆并烘烤绝缘膏以形成第一绝缘层。 与交叉点的侧壁相邻形成的绝缘层的涂层厚度基本等于第一布线的高度。

公开(公告)号：US08089205B2

公开(公告)日：2012-01-03

申请号：US12296016

申请日：2007-05-31

申请人： Yoshio Suzuki ,  Kazuya Ishiwata

发明人： Yoshio Suzuki ,  Kazuya Ishiwata

IPC分类号： H01J9/02 ,  H01J63/04 ,  H05K1/00

CPC分类号： H05K3/1258 ,  H01J9/027 ,  H01J29/02 ,  H05K1/092 ,  H05K3/107 ,  H05K3/4092 ,  H05K2201/09109 ,  H05K2201/09909 ,  Y10T29/49124 ,  Y10T29/49155

摘要： A wiring board has a substrate having a groove on its surface, a first wiring placed in the groove, a plurality of bonding members located at mutually separated positions and each of which bonds the first wiring and the substrate. A gap is located between the first wiring and the surface of the groove.

摘要翻译： 布线基板具有在其表面上具有槽的基板，设置在槽中的第一布线，位于相互分开的位置的多个接合构件，每个接合构件将第一布线和基板接合。 间隙位于第一布线和凹槽表面之间。

公开(公告)号：US07619355B2

公开(公告)日：2009-11-17

申请号：US11766147

申请日：2007-06-21

申请人： Masafumi Moriya ,  Kazuya Ishiwata

发明人： Masafumi Moriya ,  Kazuya Ishiwata

IPC分类号： H01J1/62 ,  H01J9/00

CPC分类号： H05K3/4685 ,  H01J17/04 ,  H01J29/04 ,  H05K3/107 ,  H05K2201/09245 ,  H05K2201/10287 ,  H05K2203/0315 ,  Y10T29/49162

摘要： To provide an electron source including: a wiring board having: a substrate having a groove on its surface; a conductive wire containing a metal which is arranged along the groove in the groove; and a wiring which is arranged above the wire crossing the wire; and an electron-emitting device which is arranged on the wiring board and is electrically connected to the conductive wire and the wiring; wherein the wire has an oxide layer of the metal contained in the wire on its surface.

摘要翻译： 提供一种电子源，包括：布线板，其具有：具有在其表面上的沟槽的衬底; 导电线，其包含沿着所述凹槽中的所述凹槽布置的金属; 以及布置在穿过导线的导线上方的布线; 以及布置在所述布线板上并电连接到所述导线和所述布线的电子发射器件; 其中所述线具有在其表面上的所述金属线中包含的金属的氧化物层。

公开(公告)号：US07285428B2

公开(公告)日：2007-10-23

申请号：US11038276

申请日：2005-01-21

申请人： Yoshimi Uda ,  Kazuya Ishiwata

发明人： Yoshimi Uda ,  Kazuya Ishiwata

IPC分类号： H01L21/00

CPC分类号： H01J9/027 ,  H01L27/14683 ,  Y10S438/94

摘要： In a production method of an electron source wherein a plurality of electron-emitting devices are connected by and driven by matrix wirings, the upper wiring of the matrix wiring is partially removed at a short circuit region at a cross portion between the matrix wirings, thereby removing the short circuit and effectively repairing an electrical connecting relation of the matrix wirings.

摘要翻译： 在电子源的制造方法中，多个电子发射器件由矩阵布线连接并由矩阵布线驱动，矩阵布线的上布线在矩阵布线之间的交叉部分处的短路区域被部分去除，从而 消除短路并有效修复矩阵布线的电连接关系。