摘要:
The wirings on an electron source substrate are formed to intersect with each other in a matrix so as to address the electron emission devices on the substrate. First and second wirings intersect with each other on a crossing point. As such a crossing point, an insulating layer is placed between the first and second wirings. To ensure insulation, a plurality of insulating layers are laminated. According to the present invention, a wiring pattern is provided on the substrate with a conductive paste and baking the wiring pattern of the conductive paste to form the first wiring. Subsequently part of the first wiring is coated at the crossing point with an insulating paste and baking the insulating paste to form a first insulating layer. The coating thickness of the insulating layer formed adjacent to sidewalls of the crossing point is substanially equal to the height of the first wiring.
摘要:
In an electron source having an electron emitting member, the electron emitting member is connected to a first or second conductive member by a third conductive member which is connected to the first or second conductive member through an aperture forming in an insulating member, and such aperture has such a shape as to become narrower from an end of the third conductive member toward the other end. Such configuration avoids that the third conductive member is damaged in the connecting portion with the first or second conductive member by the thermal stress therein.
摘要:
In an electron source having an electron emitting member, the electron emitting member is connected to a first or second conductive member by a third conductive member which is connected to the first or second conductive member through an aperture forming in an insulating member, and such aperture has such a shape as to become narrower from an end of the third conductive member toward the other end. Such configuration avoids that the third conductive member is damaged in the connecting portion with the first or second conductive member by the thermal stress therein.
摘要:
To provide an electron source including: a wiring board having: a substrate provided with a groove on its surface; a first conductive member which is arranged along the groove in the groove; and a second conductive member which is arranged above the first conductive member crossing the first conductive member; and an electron-emitting device which is arranged on the wiring board and is electrically connected to the first conductive member and the second conductive member; wherein a particle is arranged between the first conductive member and an inner wall of the groove.
摘要:
A method for manufacturing an electronic substrate structure comprising a substrate, a glass layer, and a conductive layer. This method may include the steps of arranging the glass layer on the substrate, arranging the conductive layer that includes a precious metal particle on the glass layer while directly contacting the glass layer, and heating the glass layer together with the conductive layer at a temperature that is lower than a softening point of the glass layer so that the particle is put into the glass layer. The particle has a diameter of not less than 1 μm and not more than 10 μm.
摘要:
There is provided a method of manufacturing a member pattern having on a substrate, a patterned first belt-shaped member and a plurality of second belt-shaped members that are patterned over from the first belt-shaped member to the substrate, the method including: forming the first belt-shaped member by a printing method; and forming the second belt-shaped members by a process involving exposure and development using a photosensitive material.
摘要:
To provide a method for simply manufacturing a substrate provided with a flat surface shape. Specifically, a method for manufacturing a substrate according to the present invention includes the steps of preparing a structure including a glass layer and a precious metal particle having a diameter not less than 1 μm and not more than 10 μm disposed on the glass layer while contacting thereto; and putting the precious metal particle in the glass layer by heating the structure at a temperature which is lower than a softening point of the glass layer.
摘要:
A method of manufacturing an ink jet recording head, having the steps of forming an ink flow path pattern on a substrate with the use of a dissoluble resin, the substrate having ink ejection pressure generating elements thereon, forming on the ink flow path pattern a coating resin layer, which will serve as ink flow path walls, by dissolving in a solvent a coating resin containing an epoxy resin which is solid at ordinary temperatures, and then solvent-coating the solution on the ink flow path pattern, forming ink ejection outlets in the coating resin layer above the ink ejection pressure generating elements, and dissolving the ink flow path pattern.
摘要:
A highly reliable ink jet recording head excellent in mechanical strength, weatherability, ink resistance, and adhesion to the substrate is provided. For its production, a cationically polymerized curing product of an epoxy resin having a structural unit expressed by the following formula (I) or (II), is used as a resin material which coats an ink flow path pattern formed from a dissoluble resin on the substrate.
摘要:
A hybrid integrated circuit is provided having a substrate with at least one active and passive element disposed thereon. A lead frame has a plurality of leads and a support plate. The support plate supports the substrate. The support plate and inner leads are encapsulated in a resin mold package. An opening is formed in the support plate to thermally connect the bottom surface of the substrate to the resin mold package, and a plurality of devoid portions are formed in the substrate causing the amount of edge area contacting the resin mold package to be increased and adhesion between the substrate and the resin mold package improved.