公开(公告)号：US5506444A

公开(公告)日：1996-04-09

申请号：US212786

申请日：1994-03-15

申请人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda ,  Mitsuaki Osono

发明人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda ,  Mitsuaki Osono

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/28

CPC分类号： H01L21/56 ,  H01L23/293 ,  H01L23/3121 ,  H01L2924/0002

摘要： In a semiconductor device of a tape carrier package type, the gap width between inner leads connected with a first edge side of a semiconductor chip set within a device mounting hole provided in the tape carrier is larger than the gap width between leads connected with a second edge side opposite to the first edge side of the semiconductor chip, and the gap length of device mounting hole between the first edge of the semiconductor chip and the first edge of the device mounting hole corresponding to the first edge of the semiconductor chip is smaller than the gap length between the second edge of the semiconductor chip and the second edge of the device mounting hole corresponding to the second edge of the semiconductor chip. Such structure enables an encapsulation resin to fill uniformly the device mounting hole, and the encapsulation resin after encapsulation has a shape of a designed dimension.

摘要翻译： 在载带封装型的半导体器件中，与设置在带载体中的器件安装孔内的半导体芯片的与第一边缘侧连接的内部引线之间的间隙宽度大于与第二引线连接的引线之间的间隙宽度 边缘侧与半导体芯片的第一边缘侧相对，并且半导体芯片的第一边缘与对应于半导体芯片的第一边缘的器件安装孔的第一边缘之间的器件安装孔的间隙长度小于 半导体芯片的第二边缘与器件安装孔的与半导体芯片的第二边缘对应的第二边缘之间的间隙长度。 这样的结构能够使封装树脂均匀地填充装置安装孔，并且封装后的封装树脂具有设计尺寸的形状。

公开(公告)号：US5336650A

公开(公告)日：1994-08-09

申请号：US112315

申请日：1993-08-27

申请人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda

发明人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L21/56 ,  H01L23/293 ,  H01L23/3121 ,  H01L2924/0002 ,  Y10T29/49121

摘要： A tape carrier semiconductor device has a resin sealed area not so larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.

摘要翻译： 带载半导体器件具有树脂密封区域不大于半导体芯片的尺寸，例如， 基本上不超过2mm。 器件孔不大于通过将半导体芯片的外周向外延伸0.3mm而形成的区域，并且使用粘度为500-1200ps的环氧树脂来密封芯片。

公开(公告)号：US5281848A

公开(公告)日：1994-01-25

申请号：US796431

申请日：1991-11-22

申请人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda

发明人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28

CPC分类号： H01L21/56 ,  H01L23/293 ,  H01L23/3121 ,  H01L2924/0002 ,  Y10T29/49121

摘要： A tape carrier semiconductor device has a resin sealed area not much larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.

摘要翻译： 带载半导体器件具有不比半导体芯片的尺寸大得多的树脂密封区域，例如， 基本上不超过2mm。 器件孔不大于通过将半导体芯片的外周向外延伸0.3mm而形成的区域，并且使用粘度为500-1200ps的环氧树脂来密封芯片。

公开(公告)号：US4949155A

公开(公告)日：1990-08-14

申请号：US219218

申请日：1988-07-14

申请人： Naoyuki Tajima ,  Takaaki Tsuda ,  Yasunori Chikawa

发明人： Naoyuki Tajima ,  Takaaki Tsuda ,  Yasunori Chikawa

IPC分类号： H01L23/495 ,  H05K1/02

CPC分类号： H01L23/49572 ,  H01L2924/0002 ,  H05K1/0254

摘要： A tape carrier for semiconductor chips including an insulating tape; a plurality of first conductor patterns longitudinally formed on the tape and spaced from each other each of the first conductor patterns having first leads connected with substrate electrodes of a semiconductor chip and second lead connected with the other electrodes of the chip; a second conductor shaped like a stripe and disposed near each of the first conductor patterns on the tape; and a third conductor pattern formed on the tape and having conductors electrically connecting the first leads with the second conductor pattern.

公开(公告)号：US5398128A

公开(公告)日：1995-03-14

申请号：US868561

申请日：1992-04-15

申请人： Naoyuki Tajima ,  Takaaki Tsuda

发明人： Naoyuki Tajima ,  Takaaki Tsuda

IPC分类号： H01L21/60 ,  G02F1/13 ,  H01L23/14 ,  H05K1/00 ,  H05K1/02 ,  H05K3/28 ,  H05K3/36 ,  G02F1/1333 ,  G02F1/1335

CPC分类号： H05K1/028 ,  H01L23/145 ,  H05K1/0278 ,  G02F1/13452 ,  H01L2924/0002 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/10136 ,  H05K2203/063 ,  H05K2203/302 ,  H05K3/28 ,  H05K3/281 ,  H05K3/361

摘要： A board for installation in a liquid crystal panel with at least one slit at a portion thereof to be bent has a resin coating applied to a bridge portion of a conductive pattern formed over the slit. The resin coating resists external load applied during bending of the board. This board may be made by a method having the steps of punching a slit in the board corresponding to a position where the board is to be bent; forming a metal laminate on the board; forming a conductive pattern by etching the metal laminate; applying a resin coating capable of resisting an external load, which is applied during subsequent bending of the board, onto the conductive pattern across the slit; and curing the resin coating. The board is thereafter bent and installed in a liquid crystal panel.

摘要翻译： 用于安装在液晶面板中的用于弯曲部分的至少一个狭缝的板具有施加到形成在狭缝上的导电图案的桥接部分的树脂涂层。 树脂涂层可抵抗板弯曲期间施加的外部载荷。 该板可以通过以下步骤制成：具有对与板要弯曲的位置对应的板中的狭缝进行冲压的步骤; 在板上形成金属层压板; 通过蚀刻金属层压体形成导电图案; 施加能够抵抗在随后的板弯曲期间施加的外部负载的树脂涂层穿过所述狭缝; 并固化树脂涂层。 然后将板弯曲并安装在液晶面板中。

公开(公告)号：US6155386A

公开(公告)日：2000-12-05

申请号：US474156

申请日：1999-12-29

申请人： Tatsuya Hirai ,  Kenshi Suzuki ,  Takaaki Tsuda ,  Masatoshi Sonoda

发明人： Tatsuya Hirai ,  Kenshi Suzuki ,  Takaaki Tsuda ,  Masatoshi Sonoda

IPC分类号： F16D55/06 ,  F16D55/02 ,  F16D65/00 ,  F16D65/14 ,  F16D65/18 ,  B60L7/00 ,  B60T13/04 ,  F16D19/00

CPC分类号： F16D55/02 ,  F16D65/0006 ,  F16D2065/1332 ,  F16D2121/22

摘要： A spring-actuated electromagnetic brake includes an adjustment plate attached a rotating shaft and having an annular recess in one end face thereof facing a boss of a brake plate slidably mounted on the rotating plate. An annular elastic member is disposed in the annular recess in such a manner that when the brake is in the released state, the elastic member partially projects from the recess and is in contact with an end face of the boss. A slide-distance adjustment bolt having an enlarged head and a thread-free shank of a length larger than the thickness of the adjustment plate extends through an opening of the adjustment plate and is threaded on the end face of the boss. The brake plate is slidable in one direction by the force of the brake spring and in the opposite direction by the recovery force of the elastic member. The range of sliding movement of the brake plate is determined by the difference between the length of the shank of the bolt and the thickness of the adjustment plate. The gap provided between the armature and the lining when the brake is in the released state is smaller than the gap provided between the field and the armature when the brake is in the engaged state, so that a striking noise generated when the armature strikes against the lining by the force of brake springs is reduced correspondingly.

摘要翻译： 弹簧驱动的电磁制动器包括安装有旋转轴的调节板，并且在其一个端面中具有环形凹部，该环形凹槽面向可滑动地安装在旋转板上的制动板的凸台。 环形弹性构件以这样的方式设置在环形凹部中，使得当制动器处于释放状态时，弹性构件从凹部部分地突出并与凸台的端面接触。 具有扩大头部的滑动距离调节螺栓和长度大于调节板厚度的无螺纹柄延伸穿过调节板的开口并且螺纹连接在凸台的端面上。 制动板可以通过制动弹簧的力沿一个方向滑动，并且通过弹性构件的回复力沿相反方向滑动。 制动板的滑动范围由螺栓的柄部的长度与调整板的厚度之差决定。 当制动器处于释放状态时，在电枢和衬里之间提供的间隙小于当制动器处于接合状态时在电场和电枢之间提供的间隙，使得当电枢撞击 制动弹簧力的衬里相应减少。

公开(公告)号：US20050036722A1

公开(公告)日：2005-02-17

申请号：US10888720

申请日：2004-07-09

申请人： Kiyoshi Sato ,  Gen Sasaki ,  Takaaki Tsuda

发明人： Kiyoshi Sato ,  Gen Sasaki ,  Takaaki Tsuda

IPC分类号： C23C8/30 ,  F16C23/04 ,  F16C33/12 ,  F16C33/20 ,  F16C33/24 ,  F16C23/08 ,  F16C25/04

CPC分类号： F16C23/045 ,  F16C33/12 ,  F16C33/122 ,  F16C33/20 ,  F16C2208/04 ,  F16C2208/32 ,  F16C2223/16 ,  F16C2223/60 ,  F16C2240/06 ,  F16C2240/60

摘要： The present invention provides a spherical bearing with good endurance and high resistance to scratching on the convex spherical body of the inner retaining piece even when in long-term sliding contact with a polytetrafluoroethylene-based liner. A spherical bearing comprising an outer retaining piece forming a sliding surface in the form of a concave spherical surface having a polytetrafluoroethylene-based liner on the race inner peripheral surface is disclosed. An inner retaining piece of the spherical bearing is held by the outer retaining piece and has an outer peripheral surface in the form of a convex spherical surface that is in sliding contact with the sliding surface of the outer retaining piece. The convex spherical surface of the inner retaining piece has a uniform thin-film layer of a TiAlN compound.

摘要翻译： 本发明提供一种即使在与聚四氟乙烯类衬垫长期滑动接触时，也能够在内保持片的凸球形体上具有良好的耐久性和耐划伤性的球形轴承。 公开了一种球面轴承，其包括在座圈内周面上形成具有聚四氟乙烯衬垫的凹形球面形状的滑动表面的外保持件。 球形轴承的内保持件由外保持件保持，并且具有与外保持件的滑动面滑动接触的凸球面形状的外周面。 内保持片的凸球面具有均匀的TiAlN化合物薄膜层。

公开(公告)号：US06491768B1

公开(公告)日：2002-12-10

申请号：US09522685

申请日：2000-03-10

申请人： Tokushichi Furuta ,  Shigenori Hoya ,  Takaaki Tsuda ,  Yutaka Daikuhara

发明人： Tokushichi Furuta ,  Shigenori Hoya ,  Takaaki Tsuda ,  Yutaka Daikuhara

IPC分类号： C12D936

CPC分类号： C21D9/40 ,  C21D9/36 ,  C21D2211/008 ,  C22C38/38 ,  F16C33/30 ,  Y10S148/906 ,  Y10S384/912

摘要： A bearing and a method for fabricating a bearing. The bearing is intended to be used in office automation equipment and the like is improved in impact resistance and load capacity. Its rotational accuracy will not deteriorate in long-term use and its quietness can be maintained over a long period of time. The bearing is an anti-friction bearing located between portions supporting a load and in relative motion to each other. The anti-friction bearing has an outer ring of 30 mm or less in diameter, in which high carbon chromium bearing steel constituting the anti-friction bearing includes the following compositions: C of 0.90-1.30 wt %, Si of 0.40-1.20 wt %, Mn of 0.90-1.0 wt %, and Cr of 0.90-1.70 wt %. After quenching, the tempering temperature used for this bearing is maintained in the range of 170° C. and 250° C. so that the amount of retained austenite in the surface layer after heat treatment is stabilized at 6 by volume or less.

摘要翻译： 轴承和轴承的制造方法。 该轴承旨在用于办公自动化设备等中，提高了耐冲击性和负载能力。 其旋转精度在长期使用中不会变差，并且可以长时间保持其安静性。 轴承是位于支撑负载并相对于彼此运动的部分之间的抗摩擦轴承。 该抗摩擦轴承具有直径为30mm以下的外圈，其中构成抗摩擦轴承的高碳铬轴承钢包括以下组成：C为0.90-1.30wt％，Si为0.40-1.20wt％ ，Mn为0.90〜1.0重量％，Cr为0.90〜1.70重量％。 淬火后，用于该轴承的回火温度保持在170℃和250℃的范围内，使得热处理后的表面层中的残余奥氏体的量稳定在6体积％以下。

公开(公告)号：US5219608A

公开(公告)日：1993-06-15

申请号：US745074

申请日：1991-08-15

申请人： Kazumasa Aoki ,  Kazuya Fujita ,  Hirofumi Uchida ,  Takaaki Tsuda ,  Takamichi Maeda

发明人： Kazumasa Aoki ,  Kazuya Fujita ,  Hirofumi Uchida ,  Takaaki Tsuda ,  Takamichi Maeda

IPC分类号： B29C33/58 ,  B29C33/62 ,  B29C45/83 ,  B29L31/34 ,  H01L21/56

CPC分类号： B29C45/83 ,  B29C33/58 ,  H01L21/565 ,  H01L2924/0002

摘要： A method of spraying release agent on a semiconductor chip molding die. The die has a pot for supplying resin to be molded, cavities in which semiconductor chips to be packaged are disposed, respectively, and a runner disposed between the pot and the cavities, for conducting the resin from the pot to the cavities. This method includes the steps of spraying at least the pot and the runner mentioned above with non-silicone release agent and selectively spraying only the cavities with silicone-based release agent.

摘要翻译： 一种在半导体芯片成型模具上喷涂脱模剂的方法。 模具具有用于供给要成型的树脂的罐，分别设置有待包装的半导体芯片的空腔，以及设置在所述罐和所述空腔之间的流道，用于将所述树脂从所述罐传导到所述空腔。 该方法包括以下步骤：用非硅氧烷脱模剂至少喷洒上述罐和流道，并且仅使用硅氧烷基脱模剂仅喷射空腔。