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公开(公告)号:US12199004B2
公开(公告)日:2025-01-14
申请号:US17702694
申请日:2022-03-23
Applicant: Navitas Semiconductor Limited
Inventor: Charles Bailley , George Chu , Daniel M. Kinzer
IPC: H01L23/367 , H01L21/48 , H01L25/00 , H01L25/07 , H01L23/498 , H01L23/538
Abstract: An electronic device includes a substrate and a first gallium nitride (GaN) transistor formed on a first semiconductor die that is electrically coupled to the substrate. A second GaN transistor is formed on a second semiconductor die and is also electrically coupled to the substrate. An integral heat spreader is thermally coupled to the first and the second gallium nitride semiconductor dies and is electrically coupled to the substrate. A first bias voltage is applied to the first GaN transistor via the integral heat spreader and a second bias voltage is applied to the second GaN transistor via the integral heat spreader.
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公开(公告)号:US12119739B2
公开(公告)日:2024-10-15
申请号:US17853746
申请日:2022-06-29
Applicant: Navitas Semiconductor Limited
Inventor: Marco Giandalia , Jason Zhang , Hongwei Jia , Daniel M. Kinzer
CPC classification number: H02M1/08 , G05F1/573 , H02M1/32 , H02M3/155 , H02M3/158 , H03K3/012 , H02H9/02 , H03K2217/0081
Abstract: An electronic circuit is disclosed. The electronic circuit includes a transistor having a gate terminal, a source terminal and a drain terminal, and a gate driver circuit including a pull-down transistor coupled to the gate terminal, and an input terminal arranged to receive an input signal and generate a corresponding output signal at an output terminal coupled to the gate terminal, where the gate driver circuit is arranged to store energy harvested from the input signal and use the stored energy to change a conductive state of the pull-down transistor. In one aspect, the transistor includes gallium nitride (GaN). In another aspect, the pull-down transistor includes GaN.
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公开(公告)号:US12057824B2
公开(公告)日:2024-08-06
申请号:US17850792
申请日:2022-06-27
Applicant: Navitas Semiconductor Limited
Inventor: Santosh Sharma , Daniel M. Kinzer , Ren Huei Tzeng
IPC: H03K17/082 , G05F3/26 , H01L29/20 , H03K17/687
CPC classification number: H03K17/0822 , G05F3/262 , H01L29/2003 , H03K17/6871
Abstract: An electronic device includes a semiconductor substrate and a bidirectional transistor switch formed on the substrate, the bidirectional switch including a first source node, a second source node and a common drain node. A first transistor is formed on the substrate and includes a first source terminal, a first drain terminal and a first gate terminal, wherein the first source terminal is connected to the substrate, the first drain terminal is connected to the first source node and the first gate terminal is connected to the second source node. A second transistor is formed on the substrate and includes a second source terminal, a second drain terminal and a second gate terminal, wherein the second source terminal is connected to the substrate, the second drain terminal is connected to the second source node and the second gate terminal is connected to the first source node.
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公开(公告)号:US11757290B2
公开(公告)日:2023-09-12
申请号:US17819608
申请日:2022-08-12
Applicant: Navitas Semiconductor Limited
Inventor: Daniel M. Kinzer , Santosh Sharma , Ju Jason Zhang
IPC: H02M1/088 , H02M3/158 , H03K3/012 , H01L27/088 , H01L23/528 , H02J7/00 , H01L23/495 , H01L27/02 , H01L23/62 , H01L29/20 , H03K17/10 , H03K19/0185 , H01L25/07 , H02M3/157 , H03K3/356 , H01L29/10 , H01L29/40 , H01L29/417 , H02M1/00 , H02M3/155
CPC classification number: H02J7/00 , H01L23/49503 , H01L23/49562 , H01L23/49575 , H01L23/528 , H01L23/62 , H01L25/072 , H01L27/0248 , H01L27/088 , H01L27/0883 , H01L29/1033 , H01L29/2003 , H01L29/402 , H01L29/41758 , H02M1/088 , H02M3/157 , H02M3/1584 , H02M3/1588 , H03K3/012 , H03K3/356017 , H03K17/102 , H03K19/018507 , H01L2924/00 , H01L2924/0002 , H02M1/0048 , H02M3/155 , Y02B40/00 , Y02B70/10 , H01L2924/0002 , H01L2924/00
Abstract: GaN-based half bridge power conversion circuits employ control, support and logic functions that are monolithically integrated on the same devices as the power transistors. In some embodiments a low side GaN device communicates through one or more level shift circuits with a high side GaN device. Various embodiments of level shift circuits and their inventive aspects are disclosed.
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公开(公告)号:US20230031402A1
公开(公告)日:2023-02-02
申请号:US17811797
申请日:2022-07-11
Applicant: Navitas Semiconductor Limited
Inventor: Daniel M. Kinzer , Santosh Sharma , Ju Jason Zhang
IPC: H02J7/00 , H01L23/495 , H01L27/02 , H01L23/62 , H02M1/088 , H02M3/158 , H03K3/012 , H01L29/20 , H03K17/10 , H03K19/0185 , H01L25/07 , H02M3/157 , H03K3/356 , H01L27/088 , H01L23/528 , H01L29/10 , H01L29/40 , H01L29/417
Abstract: GaN-based half bridge power conversion circuits employ control, support and logic functions that are monolithically integrated on the same devices as the power transistors. In some embodiments a low side GaN device communicates through one or more level shift circuits with a high side GaN device. Various embodiments of level shift circuits and their inventive aspects are disclosed.
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公开(公告)号:US20230006657A1
公开(公告)日:2023-01-05
申请号:US17853740
申请日:2022-06-29
Applicant: Navitas Semiconductor Limited
Inventor: Hongwei Jia , Santosh Sharma , Daniel M. Kinzer , Victor Sinow , Matthew Anthony Topp
IPC: H03K3/012
Abstract: Circuits and methods that control a rate of change of a drain voltage as a function of time in a transistor are disclosed. In one aspect, the circuit includes a transistor having a gate terminal that controls operation of the transistor, and a control circuit coupled to the gate terminal and arranged to change a voltage at the gate terminal at a first rate of voltage with respect to time from a first voltage to a first intermediate voltage, and further arranged to change the voltage at the gate terminal at a second rate of voltage with respect to time from the first intermediate voltage to a second intermediate voltage, where the first rate is different than the second rate.
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公开(公告)号:US20220393481A1
公开(公告)日:2022-12-08
申请号:US17820829
申请日:2022-08-18
Applicant: Navitas Semiconductor Limited
Inventor: Daniel M. Kinzer , Santosh Sharma , Ju Jason Zhang
IPC: H02J7/00 , H01L23/495 , H01L27/02 , H01L23/62 , H02M1/088 , H02M3/158 , H03K3/012 , H01L29/20 , H03K17/10 , H03K19/0185 , H01L25/07 , H02M3/157 , H03K3/356 , H01L27/088 , H01L23/528 , H01L29/10 , H01L29/40 , H01L29/417
Abstract: GaN-based half bridge power conversion circuits employ control, support and logic functions that are monolithically integrated on the same devices as the power transistors. In some embodiments a low side GaN device communicates through one or more level shift circuits with a high side GaN device. Various embodiments of level shift circuits and their inventive aspects are disclosed.
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公开(公告)号:US20220084978A1
公开(公告)日:2022-03-17
申请号:US17169320
申请日:2021-02-05
Applicant: NAVITAS SEMICONDUCTOR LIMITED
Inventor: Daniel M. Kinzer , Jason Zhang , Thomas Ribarich
IPC: H01L23/00 , H02M7/219 , H01L29/20 , H01L25/18 , H01L23/495
Abstract: An electronic power conversion component includes an electrically conductive package base comprising a source terminal, a drain terminal, at least one I/O terminal and a die-attach pad wherein the source terminal is electrically isolated from the die-attach pad. A GaN-based semiconductor die is secured to the die attach pad and includes a power transistor having a source and a drain, wherein the source is electrically coupled to the source terminal and the drain is electrically coupled to the drain terminal. A plurality of wirebonds electrically couple the source to the source terminal and the drain to the drain terminal. An encapsulant is formed over the GaN-based semiconductor die, the plurality of wirebonds and at least a top surface of the package base.
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公开(公告)号:US12243799B2
公开(公告)日:2025-03-04
申请号:US17738989
申请日:2022-05-06
Applicant: Navitas Semiconductor Limited
Inventor: Charles Bailley , George Chu , Daniel M. Kinzer
IPC: H01L25/00 , H01L21/48 , H01L23/367 , H01L25/07 , H01L23/498 , H01L23/538
Abstract: An electronic device includes a substrate and a first gallium nitride (GaN) transistor formed on a first semiconductor die that is electrically coupled to the substrate. A second GaN transistor is formed on a second semiconductor die and is also electrically coupled to the substrate. An integral heat spreader is thermally coupled to the first and the second gallium nitride semiconductor dies and is electrically coupled to the substrate. A first bias voltage is applied to the first GaN transistor via the integral heat spreader and a second bias voltage is applied to the second GaN transistor via the integral heat spreader.
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公开(公告)号:US20240421813A1
公开(公告)日:2024-12-19
申请号:US18754010
申请日:2024-06-25
Applicant: Navitas Semiconductor Limited
Inventor: Santosh Sharma , Daniel M. Kinzer , Ren Huei Tzeng
IPC: H03K17/082 , G05F3/26 , H01L29/20 , H03K17/687
Abstract: An electronic device includes a semiconductor substrate and a bidirectional transistor switch formed on the substrate, the bidirectional switch including a first source node, a second source node and a common drain node. A first transistor is formed on the substrate and includes a first source terminal, a first drain terminal and a first gate terminal, wherein the first source terminal is connected to the substrate, the first drain terminal is connected to the first source node and the first gate terminal is connected to the second source node. A second transistor is formed on the substrate and includes a second source terminal, a second drain terminal and a second gate terminal, wherein the second source terminal is connected to the substrate, the second drain terminal is connected to the second source node and the second gate terminal is connected to the first source node.
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