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公开(公告)号：US08222082B2
公开(公告)日：2012-07-17
申请号：US12367297
申请日：2009-02-06
IPC分类号： H01L21/77 , H01L21/603
CPC分类号： H01L23/5286 , H01L22/32 , H01L23/522 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/12 , H01L24/48 , H01L24/49 , H01L27/0251 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05552 , H01L2224/05553 , H01L2224/05599 , H01L2224/05624 , H01L2224/13099 , H01L2224/1411 , H01L2224/16 , H01L2224/48227 , H01L2224/48463 , H01L2224/49171 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/1306 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A technique is provided which allows a chip mounted by wire bonding and a chip mounted by bump electrodes to share a manufacturing process. Both in a case where a chip is electrically coupled to an external circuit by bump electrodes and a case where the chip is electrically coupled to the external circuit by bonding wires, a bump coupling part and a bonding pad are both provided in a single uppermost wiring layer. When the bump electrodes are used, an opening is provided in an insulating film on the bump coupling part and a surface of the bonding pad is covered with the insulating film. On the other hand, when the bonding wires are used, an opening is provided in an insulating film on the bonding pad and a surface of the bump coupling part is covered with the insulating film.
摘要翻译： 提供了一种技术，其允许通过引线接合安装的芯片和由凸块电极安装的芯片共享制造工艺。 在通过凸块电极将芯片电耦合到外部电路的情况下，以及通过接合线将芯片电耦合到外部电路的情况，凸起耦合部分和接合焊盘都设置在单个最上面的布线 层。 当使用凸起电极时，在凸块接合部分上的绝缘膜中设置开口，并且用绝缘膜覆盖焊盘的表面。 另一方面，当使用接合线时，在接合焊盘上的绝缘膜中设置开口，并且凸起接合部的表面被绝缘膜覆盖。
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公开(公告)号：US08384185B2
公开(公告)日：2013-02-26
申请号：US13306659
申请日：2011-11-29
CPC分类号： H01L23/5286 , H01L22/32 , H01L23/522 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/12 , H01L24/48 , H01L24/49 , H01L27/0251 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05552 , H01L2224/05553 , H01L2224/05599 , H01L2224/05624 , H01L2224/13099 , H01L2224/1411 , H01L2224/16 , H01L2224/48227 , H01L2224/48463 , H01L2224/49171 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/1306 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A technique is provided which allows a chip mounted by wire bonding and a chip mounted by bump electrodes to share a manufacturing process. Both in a case where a chip is electrically coupled to an external circuit by bump electrodes and a case where the chip is electrically coupled to the external circuit by bonding wires, a bump coupling part and a bonding pad are both provided in a single uppermost wiring layer. When the bump electrodes are used, an opening is provided in an insulating film on the bump coupling part and a surface of the bonding pad is covered with the insulating film. On the other hand, when the bonding wires are used, an opening is provided in an insulating film on the bonding pad and a surface of the bump coupling part is covered with the insulating film.
摘要翻译： 提供了一种技术，其允许通过引线接合安装的芯片和由凸块电极安装的芯片共享制造工艺。 在通过凸块电极将芯片电耦合到外部电路的情况下，以及通过接合线将芯片电耦合到外部电路的情况，凸起耦合部分和接合焊盘都设置在单个最上面的布线 层。 当使用凸起电极时，在凸块接合部分上的绝缘膜中设置开口，并且用绝缘膜覆盖焊盘的表面。 另一方面，当使用接合线时，在接合焊盘上的绝缘膜中设置开口，并且凸起接合部的表面被绝缘膜覆盖。
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公开(公告)号：US20090212425A1
公开(公告)日：2009-08-27
申请号：US12367297
申请日：2009-02-06
IPC分类号： H01L23/498 , H01L21/60 , H01L21/78
CPC分类号： H01L23/5286 , H01L22/32 , H01L23/522 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/12 , H01L24/48 , H01L24/49 , H01L27/0251 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05552 , H01L2224/05553 , H01L2224/05599 , H01L2224/05624 , H01L2224/13099 , H01L2224/1411 , H01L2224/16 , H01L2224/48227 , H01L2224/48463 , H01L2224/49171 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/1306 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A technique is provided which allows a chip mounted by wire bonding and a chip mounted by bump electrodes to share a manufacturing process. Both in a case where a chip is electrically coupled to an external circuit by bump electrodes and a case where the chip is electrically coupled to the external circuit by bonding wires, a bump coupling part and a bonding pad are both provided in a single uppermost wiring layer. When the bump electrodes are used, an opening is provided in an insulating film on the bump coupling part and a surface of the bonding pad is covered with the insulating film. On the other hand, when the bonding wires are used, an opening is provided in an insulating film on the bonding pad and a surface of the bump coupling part is covered with the insulating film.
摘要翻译： 提供了一种技术，其允许通过引线接合安装的芯片和由凸块电极安装的芯片共享制造工艺。 在通过凸块电极将芯片电耦合到外部电路的情况下，以及通过接合线将芯片电耦合到外部电路的情况，凸起耦合部分和接合焊盘都设置在单个最上面的布线 层。 当使用凸起电极时，在凸块接合部分上的绝缘膜中设置开口，并且用绝缘膜覆盖焊盘的表面。 另一方面，当使用接合线时，在接合焊盘上的绝缘膜中设置开口，并且凸起接合部的表面被绝缘膜覆盖。
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公开(公告)号：US06274301B1
公开(公告)日：2001-08-14
申请号：US09174011
申请日：1998-10-16
IPC分类号： G03C1498
CPC分类号： G03C1/49863 , G03C1/002 , G03C1/04 , G03C1/34 , G03C1/49845 , G03C2200/22 , G03C2200/36
摘要： A photothermographic recording element having improved image tone and improved tone stability during storage is provided wherein at least one of constituent layers comprises (a) polymeric microparticulates containing a dyestuff, (b) microcapsules containing a dyestuff, and/or (c) an organic or inorganic pigment.
摘要翻译： 提供了具有改善的图像色调并且在存储期间具有改善的色调稳定性的光热记录元件，其中至少一个构成层包含（a）含有染料的聚合物微粒，（b）含有染料的微胶囊和/或（c）有机或 无机颜料。
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公开(公告)号：US6093529A
公开(公告)日：2000-07-25
申请号：US60881
申请日：1998-04-16
CPC分类号： G03C1/49845 , G03C1/49872 , G03C1/49863
摘要： An imaging material is provided in the form of a photothermographic or thermographic image forming layer containing an organic silver salt on one surface of a support and further comprising a polyvalent metal ion and a phthalic acid compound on the image forming layer-bearing surface of the support. The imaging material has improved shelf stability before and after image formation and the ease of handling and produces high-quality blue black tone images.
摘要翻译： 成像材料以支持体的一个表面上含有有机银盐的光热照相或热成像图像形式的形式提供，并且在载体的图像形成层承载表面上还包含多价金属离子和邻苯二甲酸化合物 。 成像材料在图像形成之前和之后具有改善的储存稳定性和易于处理并产生高质量的蓝黑色调图像。
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公开(公告)号：US5580713A
公开(公告)日：1996-12-03
申请号：US376446
申请日：1995-01-23
申请人： Takefumi Hara , Makoto Kikuchi , Hisashi Okamura
发明人： Takefumi Hara , Makoto Kikuchi , Hisashi Okamura
CPC分类号： G03C1/015 , G03C1/34 , G03C5/50 , G03C7/39296 , G03C7/305 , G03C7/3924
摘要： A silver halide color reversal photographic light-sensitive material includes at least one blue-sensitive silver halide emulsion layer, at least one green-sensitive silver halide emulsion layer, and at least one red-sensitive silver halide emulsion layer, formed on a support. At least one light sensitive emulsion layer contains silver halide grains having a silver halide phase formed in the presence of an iodide ion-releasing agent, under controlled release of iodide ions from the releasing agent. At least one hydrophilic colloid layer contains a certain heterocyclic compound or a certain DIR compound.
摘要翻译： 卤化银彩色反转照相感光材料包括形成在载体上的至少一种感蓝卤化银乳剂层，至少一种感绿卤化银乳剂层和至少一种感红卤化银乳剂层。 在碘离子释放剂的存在下，至少一种感光乳剂层含有卤化银颗粒，其在碘离子释放剂的存在下形成卤化银相。 至少一个亲水胶体层含有某种杂环化合物或某种DIR化合物。
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公开(公告)号：US5518862A
公开(公告)日：1996-05-21
申请号：US178296
申请日：1994-01-11
申请人： Hisashi Okamura
发明人： Hisashi Okamura
IPC分类号： G03C1/06
CPC分类号： G03C1/061
摘要： The object of the present invention is to provide a silver halide light-sensitive material capable of forming a ultra high gradation image by processing in a stable developing solution.The present invention is a silver halide photographic material containing at least one of the compounds represented by Formula (I) or (II): ##STR1## wherein X represents an aliphatic group, an aromatic group, or a heterocyclic group and may be substituted; R.sub.1 represents a hydrogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, or an amino group; R.sub.2 and R.sub.3 each represent an aliphatic group, an aromatic group, or a heterocyclic group and may be the same or different; and further R.sub.1, R.sub.2 and R.sub.3 may be substituted and combined with each other to form a ring; ##STR2## wherein X represents an aliphatic group, an aromatic group, or a heterocyclic group and may be substituted; Y represents a --O-- group, a --NR.sub.3 -- group, a --S-- group, a --SO-- group, a --SO.sub.2 -- group, or a --CO-- group; R.sub.1, R.sub.2 and R.sub.3 each represent an aliphatic group, an aromatic group, or a heterocyclic group and may be the same or different; and R.sub.1 and R.sub.3 may be a hydrogen atom; and further, R.sub.1, R.sub.2 and R.sub.3 may be substituted and combined with each other to form a ring, and in the case where R.sub.1 and R.sub.2 are combined to form a ring, any one of them may be a single bond.
摘要翻译： PCT No.PCT / JP93 / 00770 Sec。 371日期：1994年1月11日 102（e）日期1994年1月11日PCT 1993年12月9日PCT。本发明的目的是提供一种能够在稳定的显影液中加工形成超高浓度图像的卤化银感光材料。 本发明是含有式（I）或（II）表示的化合物中的至少一种化合物的卤化银照相材料：其中X表示脂族基团，芳族基团或杂环基团，式 可以替代; R1表示氢原子，烷基，芳基，烷氧基，芳氧基或氨基; R2和R3各自表示脂族基团，芳香族基团或杂环基团，可以相同或不同; 并且进一步的R 1，R 2和R 3可以相互取代并组合形成环; 式（II）其中X表示脂族基团，芳族基团或杂环基团并且可以被取代; Y表示-O-基，-NR3-基，-S-基，-SO-基，-SO2-基或-CO-基; R1，R2和R3各自表示脂族基团，芳香族基团或杂环基团，可以相同或不同; 并且R 1和R 3可以是氢原子; 此外，R 1，R 2和R 3可以相互取代并组合形成环，并且在R 1和R 2结合形成环的情况下，它们中的任一个可以是单键。
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公开(公告)号：US5498516A
公开(公告)日：1996-03-12
申请号：US59667
申请日：1993-05-12
申请人： Makoto Kikuchi , Hisashi Okamura
发明人： Makoto Kikuchi , Hisashi Okamura
CPC分类号： G03C1/0051 , G03C1/10
摘要： A silver halide photographic light-sensitive material having a silver halide emulsion layer on a support, wherein said silver halide emulsion layer contains a silver halide emulsion in which silver halide tabular grains (fringe-dislocation tabular grains), which have an aspect ratio of 2 to 40 and in which dislocation lines are localized essentially to only fringe portions, occupy 100% to 80% of a total projected area of all grains.
摘要翻译： 一种在载体上具有卤化银乳剂层的卤化银照相感光材料，其中所述卤化银乳剂层含有卤化银乳剂，其中卤化银片状颗粒（条纹位错片状颗粒）的纵横比为2 至40，并且位错线基本上仅局限于边缘部分，占所有晶粒总投影面积的100％至80％。
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公开(公告)号：US5286598A
公开(公告)日：1994-02-15
申请号：US967742
申请日：1992-10-28
申请人： Nobuaki Inoue , Minoru Sakai , Shigeru Ohno , Hisashi Okamura
发明人： Nobuaki Inoue , Minoru Sakai , Shigeru Ohno , Hisashi Okamura
CPC分类号： G03C7/30511 , G03C1/061 , G03C1/30 , Y10S430/158
摘要： Disclosed is a high-sensitive and super-high contrast silver halide photographic material suitable to use in photomechanical process. The material comprises a support having thereon having at least one light-sensitive silver halide emulsion layer and another hydrophilic colloid layer, wherein at least one of the emulsion layer or the other hydrophilic colloid layer contains a hydrazine derivative and a redox compound capable of releasing a development inhibitor by oxidation and further contains at least one hardening agent represented by formula (A): ##STR1## wherein R represents a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aralkyl group or a substituted or unsubstituted aryl group; and n represents 0 or 1.
摘要翻译： 公开了一种适用于光机械过程的高灵敏度和超高对比度的卤化银照相材料。 该材料包括其上具有至少一个感光卤化银乳剂层和另一亲水胶体层的载体，其中乳液层或另一亲水胶体层中的至少一个含有肼衍生物和能够释放 显影抑制剂，还含有至少一种由式（A）表示的硬化剂：（*化学结构*）（A）其中R表示氢原子，取代或未取代的烷基，取代或未取代的芳烷基或 取代或未取代的芳基; n表示0或1。
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公开(公告)号：US5278025A
公开(公告)日：1994-01-11
申请号：US931508
申请日：1992-08-21
申请人： Hisashi Okamura , Kazunobu Katoh , Tetsuro Kojima
发明人： Hisashi Okamura , Kazunobu Katoh , Tetsuro Kojima
CPC分类号： G03C1/061 , G03C1/34 , G03C1/43 , G03C5/305 , Y10S430/158
摘要： A method for forming an image comprising the steps of: (a) imagewise exposing silver halide photographic materials; where said photographic material contains (1) a compound represented by formula (I) ##STR1## wherein R.sub.1 represents an aliphatic group or an aromatic group; R.sub.2 represents a hydrogen atom, an alkyl group, or an aryl group, an alkoxy group, an aryloxy group, an amino group, a carbamoyl group, or an oxycarbonyl group; G.sub.1 represents a carbonyl group, a sulfonyl group, a sulfoxy group, ##STR2## or an iminomethylene group; and A.sub.1 and A.sub.2 both represent a hydrogen atom, or one of A.sub.1 or A.sub.2 represents a hydrogen atom and the other represents a substituted or unsubstituted alkylsulfonyl group, a substituted or unsubstituted arylsulfonyl group, or a substituted or unsubstituted acyl group, and (2) a redox compound that can release a development inhibitor when oxidized; and (b) subjecting said imagewise exposed silver halide photographic materials to development-processing where a bath used in said development-processing contains a nucleation development accelerator.
摘要翻译： 一种用于形成图像的方法，包括以下步骤：（a）成像曝光卤化银照相材料; 其中所述照相材料包含（1）由式（I）表示的化合物（*化学结构*）（I）其中R 1表示脂族基团或芳族基团; R2表示氢原子，烷基或芳基，烷氧基，芳氧基，氨基，氨基甲酰基或氧羰基; G1表示羰基，磺酰基，磺氧基，（*化学结构*）或亚氨基亚甲基; 和A1和A2均表示氢原子，或A1或A2中的一个表示氢原子，另一个表示取代或未取代的烷基磺酰基，取代或未取代的芳基磺酰基或取代或未取代的酰基，（2） 氧化还原化合物，当氧化时可释放显影抑制剂; 和（b）对所述成像曝光的卤化银照相材料进行显影处理，其中所述显影处理中使用的浴含有成核显影促进剂。
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