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1.发明授权公开(公告)号：US08318535B2
公开(公告)日：2012-11-27
申请号：US11769942
申请日：2007-06-28
申请人： Ning Ye , Robert C. Miller , Cheemen Yu , Hem Takiar , Andre McKenzie
发明人： Ning Ye , Robert C. Miller , Cheemen Yu , Hem Takiar , Andre McKenzie
IPC分类号： H01L21/00
CPC分类号： H01L21/50 , B82Y10/00 , G11C29/1201 , G11C29/48 , H01L23/5388 , H01L24/48 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H05K1/117 , H05K1/141 , H05K1/147 , H05K2201/10159 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.
摘要翻译： 公开了一种由多模组件形成的便携式存储卡及其制造方法。 一个这样的多模组件包括LGA SiP半导体封装和两个贴在PCB上的基于引线框架的SMT封装。 如此形成的多模组件可以被封装在标准盖中以形成完整的便携式存储卡，例如标准SD TM卡。 LGA SiP封装上用于测试封装制造后的操作的测试焊盘也可用于将LGA SiP封装物理和电耦合到PCB。
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2.发明申请公开(公告)号：US20090004776A1
公开(公告)日：2009-01-01
申请号：US11769942
申请日：2007-06-28
申请人： Ning Ye , Robert C. Miller , Cheemen Yu , Hem Takiar , Andre McKenzie
发明人： Ning Ye , Robert C. Miller , Cheemen Yu , Hem Takiar , Andre McKenzie
IPC分类号： H01L21/60
CPC分类号： H01L21/50 , B82Y10/00 , G11C29/1201 , G11C29/48 , H01L23/5388 , H01L24/48 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H05K1/117 , H05K1/141 , H05K1/147 , H05K2201/10159 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.
摘要翻译： 公开了一种由多模组件形成的便携式存储卡及其制造方法。 一个这样的多模组件包括LGA SiP半导体封装和两个贴在PCB上的基于引线框架的SMT封装。 如此形成的多模组件可以被封装在标准盖中以形成完整的便携式存储卡，例如标准SD（TM）卡。 LGA SiP封装上用于测试封装制造后的操作的测试焊盘也可用于物理和电气耦合LGA SiP封装到PCB。
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公开(公告)号：US07772686B2
公开(公告)日：2010-08-10
申请号：US11769954
申请日：2007-06-28
申请人： Ning Ye , Robert C. Miller , Cheemen Yu , Hem Takiar , Andre McKenzie
发明人： Ning Ye , Robert C. Miller , Cheemen Yu , Hem Takiar , Andre McKenzie
CPC分类号： G11C29/48 , G11C29/1201 , H01L23/5388 , H01L2224/16225 , H05K1/0271 , H05K1/117 , H05K1/141 , H05K2201/09063 , H05K2201/10159
摘要： A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.
摘要翻译： 公开了一种由多模组件形成的便携式存储卡及其制造方法。 一个这样的多模组件包括LGA SiP半导体封装和两个贴在PCB上的基于引线框架的SMT封装。 如此形成的多模组件可以被封装在标准盖中以形成完整的便携式存储卡，例如标准SD TM卡。 LGA SiP封装上用于测试封装制造后的操作的测试焊盘也可用于将LGA SiP封装物理和电耦合到PCB。
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公开(公告)号：US20090001365A1
公开(公告)日：2009-01-01
申请号：US11769954
申请日：2007-06-28
申请人： Ning Ye , Robert C. Miller , Cheemen Yu , Hem Takiar , Andre McKenzie
发明人： Ning Ye , Robert C. Miller , Cheemen Yu , Hem Takiar , Andre McKenzie
CPC分类号： G11C29/48 , G11C29/1201 , H01L23/5388 , H01L2224/16225 , H05K1/0271 , H05K1/117 , H05K1/141 , H05K2201/09063 , H05K2201/10159
摘要： A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.
摘要翻译： 公开了一种由多模组件形成的便携式存储卡及其制造方法。 一个这样的多模组件包括LGA SiP半导体封装和两个贴在PCB上的基于引线框架的SMT封装。 如此形成的多模组件可以被封装在标准盖中以形成完整的便携式存储卡，例如标准SD（TM）卡。 LGA SiP封装上用于测试封装制造后的操作的测试焊盘也可用于将LGA SiP封装物理和电耦合到PCB。
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5.发明申请METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE HAVING THROUGH HOLES FOR MOLDING BACK SIDE OF PACKAGE 有权制造具有穿孔的半导体封装的方法，用于模制封装的背面公开(公告)号：US20090004785A1
公开(公告)日：2009-01-01
申请号：US11770078
申请日：2007-06-28
申请人： Chin-Tien Chiu , Hem Takiar , Chih-Chin Liao , Cheemen Yu , Ning Ye , Jack Chang Chien
发明人： Chin-Tien Chiu , Hem Takiar , Chih-Chin Liao , Cheemen Yu , Ning Ye , Jack Chang Chien
IPC分类号： H01L21/56
CPC分类号： H01L21/56 , G06K19/077 , H01L23/3121 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/1815 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A portable memory card and methods of manufacturing same are disclosed. The portable memory includes a substrate having a plurality of holes formed therein. During the encapsulation process, mold compound flows over the top surface of the substrate, through the holes, and down into a recessed section formed in the bottom mold cap plate to form a projection of mold compound on the bottom surface of the substrate.
摘要翻译： 公开了便携式存储卡及其制造方法。 便携式存储器包括其中形成有多个孔的基板。 在封装过程中，模塑料在衬底的顶表面上通过孔流动，并向下流入形成在底模盖板中的凹陷部分，以在基底的底表面上形成模具化合物的突起。
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公开(公告)号：US20080305577A1
公开(公告)日：2008-12-11
申请号：US11760385
申请日：2007-06-08
申请人： Chih-Chin Liao , Ning Ye , Cheemen Yu , Jack Chang Chien , Hem Takiar
发明人： Chih-Chin Liao , Ning Ye , Cheemen Yu , Jack Chang Chien , Hem Takiar
IPC分类号： H01L21/00
CPC分类号： H05K3/242 , H01L21/4846 , H01L23/49838 , H01L23/49855 , H01L2224/48227 , H01L2924/10253 , H01L2924/19105 , H05K1/117 , H05K3/0052 , H05K2203/175 , H01L2924/00
摘要： A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.
摘要翻译： 公开了半导体管芯衬底面板，其包括在面板上相邻的半导体封装轮廓之间的最小间隙宽度，同时确保电镀电端子的电隔离。 通过减小相邻封装轮廓之间的边界的宽度，在用于半导体封装的衬底面板上获得额外的空间。
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7.发明申请公开(公告)号：US20090001552A1
公开(公告)日：2009-01-01
申请号：US11770088
申请日：2007-06-28
申请人： Chin-Tien Chiu , Hem Takiar , Chih-Chin Liao , Cheemen Yu , Ning Ye , Jack Chang Chien
发明人： Chin-Tien Chiu , Hem Takiar , Chih-Chin Liao , Cheemen Yu , Ning Ye , Jack Chang Chien
IPC分类号： H01L23/12
CPC分类号： H01L23/49855 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01322 , H01L2924/30107 , H01L2924/00 , H01L2924/00014
摘要： A portable memory card and methods of manufacturing same are disclosed. The portable memory includes a substrate having a plurality of holes formed therein. During the encapsulation process, mold compound flows over the top surface of the substrate, through the holes, and down into a recessed section formed in the bottom mold cap plate to form a projection of mold compound on the bottom surface of the substrate.
摘要翻译： 公开了便携式存储卡及其制造方法。 便携式存储器包括其中形成有多个孔的基板。 在封装过程中，模塑料在衬底的顶表面上通过孔流动，并向下流入形成在底模盖板中的凹陷部分，以在基底的底表面上形成模具化合物的突起。
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8.发明申请TWO-SIDED SUBSTRATE LEAD CONNECTION FOR MINIMIZING KERF WIDTH ON A SEMICONDUCTOR SUBSTRATE PANEL 有权用于在半导体衬底面板上最小化KERF宽度的两面衬底引线连接公开(公告)号：US20080303166A1
公开(公告)日：2008-12-11
申请号：US11760405
申请日：2007-06-08
申请人： Chih-Chin Liao , Ning Ye , Cheemen Yu , Jack Chang Chien , Hem Takiar
发明人： Chih-Chin Liao , Ning Ye , Cheemen Yu , Jack Chang Chien , Hem Takiar
CPC分类号： H01L23/49838 , H01L21/4846 , H01L23/49855 , H01L24/48 , H01L25/0657 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2225/0651 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.
摘要翻译： 公开了半导体管芯衬底面板，其包括在面板上相邻的半导体封装轮廓之间的最小间隙宽度，同时确保电镀电端子的电隔离。 通过减小相邻封装轮廓之间的边界的宽度，在用于半导体封装的衬底面板上获得额外的空间。
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9.发明授权Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel 有权用于最小化半导体衬底面板上的切口宽度的双面衬底引线连接公开(公告)号：US08637972B2
公开(公告)日：2014-01-28
申请号：US11760405
申请日：2007-06-08
申请人： Chih-Chin Liao , Ning Ye , Cheemen Yu , Jack Chang Chien , Hem Takiar
发明人： Chih-Chin Liao , Ning Ye , Cheemen Yu , Jack Chang Chien , Hem Takiar
CPC分类号： H01L23/49838 , H01L21/4846 , H01L23/49855 , H01L24/48 , H01L25/0657 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2225/0651 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.
摘要翻译： 公开了半导体管芯衬底面板，其包括在面板上相邻的半导体封装轮廓之间的最小间隙宽度，同时确保电镀电端子的电隔离。 通过减小相邻封装轮廓之间的边界的宽度，在用于半导体封装的衬底面板上获得额外的空间。
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10.发明授权公开(公告)号：US07952179B2
公开(公告)日：2011-05-31
申请号：US11770088
申请日：2007-06-28
申请人： Chin-Tien Chiu , Hem Takiar , Chih-Chin Liao , Cheemen Yu , Ning Ye , Jack Chang Chien
发明人： Chin-Tien Chiu , Hem Takiar , Chih-Chin Liao , Cheemen Yu , Ning Ye , Jack Chang Chien
IPC分类号： H01L23/12
CPC分类号： H01L23/49855 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01322 , H01L2924/30107 , H01L2924/00 , H01L2924/00014
摘要： A portable memory card and methods of manufacturing same are disclosed. The portable memory includes a substrate having a plurality of holes formed therein. During the encapsulation process, mold compound flows over the top surface of the substrate, through the holes, and down into a recessed section formed in the bottom mold cap plate to form a projection of mold compound on the bottom surface of the substrate.
摘要翻译： 公开了便携式存储卡及其制造方法。 便携式存储器包括其中形成有多个孔的基板。 在封装过程中，模塑料在衬底的顶表面上通过孔流动，并向下流入形成在底模盖板中的凹陷部分，以在基底的底表面上形成模具化合物的突起。
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