公开(公告)号：US08318535B2

公开(公告)日：2012-11-27

申请号：US11769942

申请日：2007-06-28

申请人： Ning Ye ,  Robert C. Miller ,  Cheemen Yu ,  Hem Takiar ,  Andre McKenzie

发明人： Ning Ye ,  Robert C. Miller ,  Cheemen Yu ,  Hem Takiar ,  Andre McKenzie

IPC分类号： H01L21/00

CPC分类号： H01L21/50 ,  B82Y10/00 ,  G11C29/1201 ,  G11C29/48 ,  H01L23/5388 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K1/117 ,  H05K1/141 ,  H05K1/147 ,  H05K2201/10159 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.

摘要翻译： 公开了一种由多模组件形成的便携式存储卡及其制造方法。 一个这样的多模组件包括LGA SiP半导体封装和两个贴在PCB上的基于引线框架的SMT封装。 如此形成的多模组件可以被封装在标准盖中以形成完整的便携式存储卡，例如标准SD TM卡。 LGA SiP封装上用于测试封装制造后的操作的测试焊盘也可用于将LGA SiP封装物理和电耦合到PCB。

公开(公告)号：US20090004776A1

公开(公告)日：2009-01-01

申请号：US11769942

申请日：2007-06-28

申请人： Ning Ye ,  Robert C. Miller ,  Cheemen Yu ,  Hem Takiar ,  Andre McKenzie

发明人： Ning Ye ,  Robert C. Miller ,  Cheemen Yu ,  Hem Takiar ,  Andre McKenzie

IPC分类号： H01L21/60

CPC分类号： H01L21/50 ,  B82Y10/00 ,  G11C29/1201 ,  G11C29/48 ,  H01L23/5388 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K1/117 ,  H05K1/141 ,  H05K1/147 ,  H05K2201/10159 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.

摘要翻译： 公开了一种由多模组件形成的便携式存储卡及其制造方法。 一个这样的多模组件包括LGA SiP半导体封装和两个贴在PCB上的基于引线框架的SMT封装。 如此形成的多模组件可以被封装在标准盖中以形成完整的便携式存储卡，例如标准SD（TM）卡。 LGA SiP封装上用于测试封装制造后的操作的测试焊盘也可用于物理和电气耦合LGA SiP封装到PCB。

公开(公告)号：US07772686B2

公开(公告)日：2010-08-10

申请号：US11769954

申请日：2007-06-28

申请人： Ning Ye ,  Robert C. Miller ,  Cheemen Yu ,  Hem Takiar ,  Andre McKenzie

发明人： Ning Ye ,  Robert C. Miller ,  Cheemen Yu ,  Hem Takiar ,  Andre McKenzie

IPC分类号： H01L23/52 ,  H01L23/58 ,  H01L23/48

CPC分类号： G11C29/48 ,  G11C29/1201 ,  H01L23/5388 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/117 ,  H05K1/141 ,  H05K2201/09063 ,  H05K2201/10159

摘要： A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.

摘要翻译： 公开了一种由多模组件形成的便携式存储卡及其制造方法。 一个这样的多模组件包括LGA SiP半导体封装和两个贴在PCB上的基于引线框架的SMT封装。 如此形成的多模组件可以被封装在标准盖中以形成完整的便携式存储卡，例如标准SD TM卡。 LGA SiP封装上用于测试封装制造后的操作的测试焊盘也可用于将LGA SiP封装物理和电耦合到PCB。

公开(公告)号：US20090001365A1

公开(公告)日：2009-01-01

申请号：US11769954

申请日：2007-06-28

申请人： Ning Ye ,  Robert C. Miller ,  Cheemen Yu ,  Hem Takiar ,  Andre McKenzie

发明人： Ning Ye ,  Robert C. Miller ,  Cheemen Yu ,  Hem Takiar ,  Andre McKenzie

IPC分类号： H01L23/58 ,  H01L23/48

CPC分类号： G11C29/48 ,  G11C29/1201 ,  H01L23/5388 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/117 ,  H05K1/141 ,  H05K2201/09063 ,  H05K2201/10159

摘要： A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.

摘要翻译： 公开了一种由多模组件形成的便携式存储卡及其制造方法。 一个这样的多模组件包括LGA SiP半导体封装和两个贴在PCB上的基于引线框架的SMT封装。 如此形成的多模组件可以被封装在标准盖中以形成完整的便携式存储卡，例如标准SD（TM）卡。 LGA SiP封装上用于测试封装制造后的操作的测试焊盘也可用于将LGA SiP封装物理和电耦合到PCB。

公开(公告)号：US20070163109A1

公开(公告)日：2007-07-19

申请号：US11321426

申请日：2005-12-29

申请人： Hem Takiar ,  Manickam Thavarajah ,  Ken Wang ,  Chih-Chin Liao ,  Andre McKenzie ,  Shrikar Bhagath ,  Han-Shiao Chen ,  Chin-Tien Chiu

发明人： Hem Takiar ,  Manickam Thavarajah ,  Ken Wang ,  Chih-Chin Liao ,  Andre McKenzie ,  Shrikar Bhagath ,  Han-Shiao Chen ,  Chin-Tien Chiu

IPC分类号： H01R43/00

CPC分类号： H01L23/544 ,  H01L21/4857 ,  H01L21/50 ,  H01L21/561 ,  H01L23/49565 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54486 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  Y10T29/49117 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A strip on which a plurality of integrated circuit package outlines may be fabricated within a plurality of process tools. The strip includes one or more fiducial notches and/or guide pin notches formed in an outer edge of the strip. The one or more fiducial and/or guide pin notches allow a position of the strip to be identified within at least one process tool of the plurality of process tools. By forming the notches in the outer periphery of the strip, the usable area on the strip on which integrated circuit package outlines may be formed is increased. The strip may alternatively include conventional fiducial and/or guide pin holes, with the molding compound applied at least partially around the holes on one or more sides of the strip. The strip may further alternatively include fiducial holes filled with a translucent material that provides stability to the strip while allowing the strip to be used with an optical recognition sensor.

摘要翻译： 其上可以在多个处理工具内制造多个集成电路封装轮廓的条带。 带材包括形成在带的外边缘中的一个或多个基准凹口和/或导向销切口。 一个或多个基准和/或引导销凹口允许在多个处理工具的至少一个处理工具内识别条带的位置。 通过在带的外周形成切口，可以形成集成电路封装轮廓的带上的可用区域。 条带可替代地包括常规的基准和/或引导销孔，模制化合物至少部分地围绕带的一侧或多侧上的孔施加。 条带还可以包括填充有半透明材料的基准孔，其为条带提供稳定性，同时允许条带与光学识别传感器一起使用。