公开(公告)号：US06840435B2

公开(公告)日：2005-01-11

申请号：US10007797

申请日：2001-11-07

申请人： Nobuaki Ohara ,  Takeyoshi Doko ,  Masaki Shimizu ,  Satoshi Nohira ,  Hiroshi Nishikawa ,  Hiroshi Ogawa

发明人： Nobuaki Ohara ,  Takeyoshi Doko ,  Masaki Shimizu ,  Satoshi Nohira ,  Hiroshi Nishikawa ,  Hiroshi Ogawa

IPC分类号： B23K1/00 ,  B23K1/19 ,  B23K35/28 ,  B23K35/22 ,  C22C21/00

CPC分类号： B23K35/288 ,  B23K1/0012 ,  B23K1/19 ,  B23K2101/14 ,  B23K2103/10

摘要： A method for brazing aluminum alloy-assembled articles with a filler alloy having a liquidus temperature of 540° C. or lower and a difference of temperature between the liquidus temperature and the solidus temperature being 100° C. or lower, wherein the highest temperature reached in the assembled article at the time of heating for brazing being set 40° C. or more higher than the liquidus temperature but 585° C. or lower. An aluminum alloy-filler alloy usable at low temperature for brazing, which comprises Si in an amount of 4.0 wt % to 8.0 wt %, Zn in an amount of 7.0 wt % to 20.0 wt % and Cu in an amount of 10.0 wt % to 35.0 wt %, with the balance being made of aluminum.

摘要翻译： 一种用液态温度为540℃以下的液相线温度为100℃以下的液相线温度为100℃以下的填充合金钎焊铝合金组装制品的方法，其中达到最高温度 在加热钎焊时的组装制品中，设定为40℃以上，高于液相线温度585℃以下。 一种铝合金 - 填料合金，其在低温下可用于钎焊，其包含4.0重量％至8.0重量％的Si，7.0重量％至20.0重量％的Zn和10.0重量％的Cu，相对于 35.0重量％，余量由铝制成。

公开(公告)号：US06625886B2

公开(公告)日：2003-09-30

申请号：US10173301

申请日：2002-06-17

申请人： Syoji Iriyama ,  Koji Hirao ,  Hiroshi Ogawa ,  Takanori Takeda ,  Hiroshi Nishikawa ,  Satoshi Nohira

发明人： Syoji Iriyama ,  Koji Hirao ,  Hiroshi Ogawa ,  Takanori Takeda ,  Hiroshi Nishikawa ,  Satoshi Nohira

IPC分类号： B23P1526

CPC分类号： B23K1/0012 ,  Y10T29/49373 ,  Y10T29/4938 ,  Y10T29/49393

摘要： In a manufacturing method of a heat exchanger including a core portion having a plurality of tubes and a plurality of radiation fins connected to surfaces of the tubes, and a tank portion communicating with the tubes, a preheating step, a brazing step, a gradual cooling step and a cooling step are performed in this order. In the preheating step, temperature of the tank portion having a large heat capacity is increased earlier than that of the core portion having a small heat capacity. Therefore, the temperature of the tank portion is rapidly increased, and the temperature of the core portion is obediently increased in accordance with the temperature increase of the tank portion.

摘要翻译： 在一种热交换器的制造方法中，包括具有多个管的芯部和连接到管的表面的多个散热片，以及与管连通的罐部，预热步骤，钎焊步骤，逐渐冷却 按顺序执行步骤和冷却步骤。 在预热步骤中，具有大的热容量的罐部分的温度比具有小的热容量的芯部部分的温度升高。 因此，容器部分的温度快速增加，并且芯部分的温度根据罐部分的温度升高而顺从地增加。

公开(公告)号：US20150291364A1

公开(公告)日：2015-10-15

申请号：US14752349

申请日：2015-06-26

申请人： Hiroshi Nishikawa ,  Toshiyuki Iba

发明人： Hiroshi Nishikawa ,  Toshiyuki Iba

IPC分类号： B65G35/06

CPC分类号： B65G35/066 ,  B61B13/12

摘要： A screw-drive conveying apparatus has on a conveying traveling body side, a first driven roller pair having a shorter distance between two driven front and rear rollers and a second driven roller pair having a longer distance between two driven front and rear rollers. A first screw shaft row with which the respective driven rollers of the first driven roller pair are engaged and a second screw shaft row with which the respective driven rollers of the second driven roller pair are engaged are provided on a traveling path side. The length of screw discontinued spaces between both screw shaft rows is equal to the distance between the driven rollers of the driven roller pair engaged with the screw shaft row on the upstream side.

摘要翻译： 螺杆驱动输送装置具有输送行进体侧，在两个从动前后辊之间具有较短距离的第一从动辊对和在两个从动前辊和后辊之间具有较长距离的第二从动辊对。 第一从动辊对的从动辊与第一从动辊对啮合的第一螺纹轴列和第二从动辊对的各个从动辊与其啮合的第二螺杆轴列设置在行进路径侧。 两个螺杆轴列之间的螺钉中断空间的长度等于从动辊对的从动辊与上游侧的螺杆轴排啮合的距离。

公开(公告)号：US08792145B2

公开(公告)日：2014-07-29

申请号：US13016500

申请日：2011-01-28

申请人： Hiroshi Nishikawa

发明人： Hiroshi Nishikawa

IPC分类号： H04N1/04

CPC分类号： H04N1/203 ,  H04N1/00909 ,  H04N1/121 ,  H04N1/193 ,  H04N1/2032

摘要： An image reading apparatus includes a conveying unit for conveying documents one by one, a first reading unit for optically reading the conveyed document through a first transparent member provided at a first reading position on a conveying path in the conveying unit, a first cleaning unit for cleaning the first transparent member provided at the first reading position, a second reading unit for optically reading the conveyed document through a second transparent member provided at a second reading position on the conveying path in the conveying unit and on a downstream side of the first reading position, and a second cleaning unit for cleaning the second transparent member provided at the second reading position. The second cleaning unit is higher in cleaning ability than the first cleaning unit.

摘要翻译： 图像读取装置包括一个一个地传送文件的传送单元，用于通过设置在传送单元中的传送路径上的第一读取位置的第一透明构件光学地读取被传送文件的第一读取单元，用于 清洁设置在第一读取位置的第一透明构件，第二读取单元，用于通过设置在输送单元中的输送路径上的第二读取位置处的第二透明构件和第一读数的下游侧光学地读取被输送的原稿 位置，以及用于清洁设置在第二读取位置的第二透明构件的第二清洁单元。 第二清洁单元的清洁能力高于第一清洁单元。

公开(公告)号：US08724334B2

公开(公告)日：2014-05-13

申请号：US13547085

申请日：2012-07-12

申请人： Hiroshi Nishikawa ,  Makoto Fujita ,  Fumikiyo Kawahara

发明人： Hiroshi Nishikawa ,  Makoto Fujita ,  Fumikiyo Kawahara

IPC分类号： H05K7/00

CPC分类号： H05K3/284 ,  H01L21/561 ,  H01L23/29 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/095 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/381 ,  H05K2203/025 ,  H05K2203/1316 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49151 ,  Y10T29/49789 ,  Y10T29/49798 ,  H01L2224/85

摘要： A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.

摘要翻译： 电路模块及其制造方法可以降低屏蔽层中可能发生未涂覆导电性树脂的缺陷区域的可能性。 准备了一个母板。 多个电子部件安装在母板的主表面上。 绝缘体层被布置成覆盖母板和电子部件的主表面。 绝缘体层被切割成使得沟槽和突起形成在绝缘体层的主表面中并且在绝缘体层的主表面上并且绝缘体层具有预定的厚度H.导电树脂涂覆在绝缘体层的主表面上以形成屏蔽 层。 包括其上形成的绝缘体层和屏蔽层的母板被划分以获得多个电路模块。

公开(公告)号：US08527314B2

公开(公告)日：2013-09-03

申请号：US10890152

申请日：2004-07-14

申请人： Hiroshi Nishikawa ,  Youichi Araki ,  Kiichi Hama

发明人： Hiroshi Nishikawa ,  Youichi Araki ,  Kiichi Hama

IPC分类号： G06Q10/00

CPC分类号： G06Q10/06 ,  G06Q10/06311 ,  G06Q10/06375

摘要： A user terminal is connected through the Internet to a server. On the basis of the identification information of the client inputted from the client terminal, the server extracts an service selected by the client from a database for user management, further, extracts calculated maintenance contents for each service from a database for service management and sends them to the user terminal. Thus, the user can collect maintenance contents, such as the staff capable of providing service, the time until the user receives a service, and the charge, so that the user can utilize the information as indications to select an optimal service such as maintenance.

摘要翻译： 用户终端通过因特网连接到服务器。 根据从客户终端输入的客户端的识别信息，服务器从数据库中提取客户端选择的服务进行用户管理，并从服务管理数据库中提取每个服务的维护内容，并将其发送给 到用户终端。 因此，用户可以收集诸如能够提供服务的人员的维护内容，直到用户接收到服务的时间和费用，使得用户可以利用该信息作为选择诸如维护的最佳服务的指示。

公开(公告)号：US08503039B2

公开(公告)日：2013-08-06

申请号：US12981843

申请日：2010-12-30

申请人： Hiroshi Nishikawa

发明人： Hiroshi Nishikawa

IPC分类号： H04N1/04 ,  H04N1/40

CPC分类号： H04N1/12 ,  H04N1/00909 ,  H04N1/1235 ,  H04N1/125 ,  H04N1/193 ,  H04N2201/0081

摘要： In an image reading apparatus, a white reference member for obtaining a reference value used in shading correction in the reading mechanism and an elastic member for cleaning a surface of the transparent member are provided such that respective positions of the white reference member and the elastic member with respect to the transparent member are variable. A controller controls the positions of these members with respect to the transparent member to alternately achieve movement of the white reference member to a position where the white reference member faces the transparent member and movement of the elastic member to a position where the elastic member faces the transparent member. The controller calculates the above reference value using a plurality of detection values read by the reading mechanism through the above positional control.

摘要翻译： 在图像读取装置中，设置用于获得在读取机构中的阴影校正中使用的基准值的白色基准部件和用于清洁透明部件的表面的弹性部件，使得白色基准部件和弹性部件 相对于透明构件是可变的。 控制器控制这些构件相对于透明构件的位置，以交替地实现白色基准构件到白色基准构件面对透明构件的位置的移动，并且弹性构件移动到弹性构件面向的位置 透明会员 控制器使用通过上述位置控制由读取机构读取的多个检测值来计算上述基准值。

公开(公告)号：US08431827B2

公开(公告)日：2013-04-30

申请号：US13155463

申请日：2011-06-08

申请人： Hiroshi Nishikawa ,  Taro Hirai

发明人： Hiroshi Nishikawa ,  Taro Hirai

IPC分类号： H05K1/00

CPC分类号： H05K1/0266 ,  H05K2201/09927 ,  Y10T29/49108 ,  Y10T29/49115 ,  Y10T29/49121 ,  Y10T29/49155

摘要： Circuit modules including identification codes and a method of managing them are provided. A module substrate includes signal input output terminals and outer ground terminals provided at the peripheral portions of a surface which becomes a mounting surface when the circuit module is completed. An inner-ground-terminal formation area surrounded by the signal input output terminals and the outer ground terminals includes a plurality of inner ground terminals arranged in a matrix of rows and columns. One of the edge portions is a direction identification area. The inner ground terminal is not provided in the direction identification area, and a first identification code having information about the position of the module substrate is provided in the direction identification area.

摘要翻译： 提供了包括识别码的电路模块及其管理方法。 模块基板包括设置在电路模块完成时成为安装表面的表面的周边部分处的信号输入端子和外部接地端子。 由信号输入输出端子和外部接地端子包围的内部 - 地面端子形成区域包括以行和列为矩阵排列的多个内部接地端子。 边缘部分之一是方向识别区域。 内部接地端子不设置在方向识别区域，并且具有关于模块基板的位置的信息的第一识别码被提供在方向识别区域。

公开(公告)号：US08240035B2

公开(公告)日：2012-08-14

申请号：US13005018

申请日：2011-01-12

申请人： Hiroshi Nishikawa ,  Makoto Fujita ,  Fumikiyo Kawahara

发明人： Hiroshi Nishikawa ,  Makoto Fujita ,  Fumikiyo Kawahara

IPC分类号： H05K3/30

CPC分类号： H05K3/284 ,  H01L21/561 ,  H01L23/29 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/095 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/381 ,  H05K2203/025 ,  H05K2203/1316 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49151 ,  Y10T29/49789 ,  Y10T29/49798 ,  H01L2224/85

摘要： A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.

摘要翻译： 电路模块及其制造方法可以降低屏蔽层中可能发生未涂覆导电性树脂的缺陷区域的可能性。 准备了一个母板。 多个电子部件安装在母板的主表面上。 绝缘体层被布置成覆盖母板和电子部件的主表面。 绝缘体层被切割成使得沟槽和突起形成在绝缘体层的主表面中并且在绝缘体层的主表面上并且绝缘体层具有预定的厚度H.导电树脂涂覆在绝缘体层的主表面上以形成屏蔽 层。 包括其上形成的绝缘体层和屏蔽层的母板被划分以获得多个电路模块。

公开(公告)号：US20110281377A1

公开(公告)日：2011-11-17

申请号：US13089619

申请日：2011-04-19

申请人： Masahiro Yamada ,  Kenya Iwasaki ,  Hiroshi Nishikawa

发明人： Masahiro Yamada ,  Kenya Iwasaki ,  Hiroshi Nishikawa

IPC分类号： H01L21/78 ,  H01L21/66

CPC分类号： H01L21/82 ,  H01L21/3065 ,  H01L21/308 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/12 ,  H01L22/34 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/00

摘要： [Problems] There are provided a chip separation method and a chip transfer method using features of dry etching.[Means for Solving the Problems] In the chip separation method, a multiple number of semiconductor devices or semiconductor integrated circuits are separated from a wafer 100 on which the multiple number of semiconductor devices or semiconductor integrated circuits are formed. The method includes forming, on a surface of the wafer 100, a mask layer through which a line-shaped pattern to be removed for separating the semiconductor devices or semiconductor integrated circuits is exposed; and etching the exposed pattern to a depth equal to or larger than about ⅔ of a thickness of the wafer. One group of separated semiconductor devices or semiconductor integrated circuits has a distinguishable shape from another group of separated semiconductor devices or semiconductor integrated circuits.

摘要翻译： [问题]提供了使用干蚀刻特征的芯片分离方法和芯片转印方法。 解决问题的手段在芯片分离方法中，多个半导体器件或半导体集成电路与形成有多个半导体器件或半导体集成电路的晶片100分离。 该方法包括在晶片100的表面上形成掩模层，通过该掩模层露出用于分离半导体器件或半导体集成电路的要移除的线状图案; 并且将暴露图案蚀刻到等于或大于晶片厚度的约⅔的深度。 一组分离的半导体器件或半导体集成电路具有与另一组分离的半导体器件或半导体集成电路的区别的形状。