公开(公告)号：US20120308838A1

公开(公告)日：2012-12-06

申请号：US13577590

申请日：2011-02-02

申请人： Nobuhito Ito ,  Daichi Okamoto ,  Takahiro Yoshida ,  Masao Arima

发明人： Nobuhito Ito ,  Daichi Okamoto ,  Takahiro Yoshida ,  Masao Arima

IPC分类号： C09D133/08 ,  C08K5/5419 ,  B32B37/26 ,  C09D163/04 ,  B05D7/00 ,  B32B9/04 ,  C09D163/10

CPC分类号： C08F290/067 ,  C08F290/061 ,  C08F290/147 ,  G03F7/0047 ,  G03F7/032 ,  G03F7/033 ,  G03F7/035 ,  G03F7/0755 ,  H05K3/287

摘要： Disclosed are: a photocurable resin composition which may be developed with an alkali, has excellent resolution properties, and enables a cured article having excellent (humidity) heat resistance and thermal impact resistance to be formed; a dry film; a cured article thereof; and a printed wiring board using the cured article. The photocurable resin composition of the present invention is characterized by containing a carboxyl group-containing resin, a photopolymerization initiator, and surface-treated Neuburg siliceous earth particles.

摘要翻译： 公开了：可以用碱显影的光固化树脂组合物，具有优异的分辨性，并且能够形成具有优异的（湿度）耐热性和耐热冲击性的固化体; 干膜; 其固化制品; 以及使用该固化物的印刷线路板。 本发明的光固化性树脂组合物的特征在于含有含羧基的树脂，光聚合引发剂和表面处理的Neuburg硅质土粒子。

公开(公告)号：US08962712B2

公开(公告)日：2015-02-24

申请号：US13517648

申请日：2012-06-14

申请人： Nobuhito Ito ,  Kazuyoshi Yoneda ,  Masao Arima

发明人： Nobuhito Ito ,  Kazuyoshi Yoneda ,  Masao Arima

IPC分类号： C08K3/22 ,  C08K5/5313 ,  C08K5/5399 ,  G03F7/038 ,  H05K1/18 ,  H05K3/28 ,  C08G18/34 ,  C08G18/64 ,  C08G18/73 ,  C08G18/80 ,  C09D175/04 ,  G03F7/027 ,  G03F7/031 ,  G03F7/035 ,  C08L63/04

CPC分类号： H05K3/287 ,  C08G18/348 ,  C08G18/6407 ,  C08G18/73 ,  C08G18/80 ,  C09D175/04 ,  G03F7/027 ,  G03F7/031 ,  G03F7/035 ,  H05K2201/012

摘要： An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant. By using the photosensitive resin composition or a dry film thereof, a printed wiring board having a flame-retardant cured film, such as a solder resist, formed from the halogen-free composition can be provided while imposing little burden on the environment, the cured film being flame-retardant and reduced in warpage and having various excellent properties including bending characteristics, resistance to soldering heat, and resistance to gold plating.

摘要翻译： 碱显影性感光性树脂组合物包含具有联苯酚醛清漆结构的含羧基的聚氨酯树脂，光聚合引发剂和氢氧化铝和/或含磷化合物。 组合物可以配制成光固化性和热固性树脂组合物，除了上述组分之外，通过进一步掺入其中具有分子中具有多个环醚基和/或环硫醚基的热固性组分。 感光性树脂组合物还可以含有着色剂。 通过使用感光性树脂组合物或其干膜，可以提供由无卤素组合物形成的具有阻燃固化膜（例如阻焊剂）的印刷线路板，同时对环境施加很小的负担，固化 膜具有阻燃性并且翘曲变小并且具有各种优异的性能，包括弯曲特性，耐焊接热性和耐镀金性。

公开(公告)号：US09310680B2

公开(公告)日：2016-04-12

申请号：US14127078

申请日：2012-06-15

申请人： Nobuhito Ito ,  Masao Arima

发明人： Nobuhito Ito ,  Masao Arima

IPC分类号： B32B27/38 ,  B32B27/42 ,  C08L61/14 ,  C08L63/10 ,  H05K1/09 ,  G03F7/038 ,  H05K3/28 ,  C08F287/00

CPC分类号： G03F7/0384 ,  B32B27/38 ,  B32B27/42 ,  C08F287/00 ,  C08L61/14 ,  C08L63/10 ,  G03F7/038 ,  G03F7/0388 ,  H05K3/287 ,  H05K2201/0166

摘要： Provided is an alkali-developable photocurable/thermosetting resin composition from which a cured coating film that has excellent thermal shock resistance and exhibits excellent PCT resistance, HAST resistance and electroless gold plating resistance, which are important as a solder resist for semiconductor packages, can be formed. The alkali-developable photocurable/thermosetting resin composition is characterized by comprising (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a block copolymer and (D) a thermosetting component.

摘要翻译： 本发明提供一种可显影的光固化/热固性树脂组合物，其作为半导体封装的阻焊剂是重要的，具有优异的耐热冲击性和优异的耐PCT耐性，耐HAST电阻和无电镀金电镀的固化涂膜可以是 形成。 碱显影性光固化/热固性树脂组合物的特征在于包含（A）含羧基的感光性树脂，（B）光聚合引发剂，（C）嵌段共聚物和（D）热固性组分。

公开(公告)号：US20140147776A1

公开(公告)日：2014-05-29

申请号：US14127078

申请日：2012-06-15

申请人： Nobuhito Ito ,  Masao Arima

发明人： Nobuhito Ito ,  Masao Arima

IPC分类号： G03F7/038

CPC分类号： G03F7/0384 ,  B32B27/38 ,  B32B27/42 ,  C08F287/00 ,  C08L61/14 ,  C08L63/10 ,  G03F7/038 ,  G03F7/0388 ,  H05K3/287 ,  H05K2201/0166

摘要： Provided is an alkali-developable photocurable/thermosetting resin composition from which a cured coating film that has excellent thermal shock resistance and exhibits excellent PCT resistance, HAST resistance and electroless gold plating resistance, which are important as a solder resist for semiconductor packages, can be formed. The alkali-developable photocurable/thermosetting resin composition is characterized by comprising (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a block copolymer and (D) a thermosetting component.

摘要翻译： 本发明提供一种可显影的光固化/热固性树脂组合物，其作为半导体封装的阻焊剂是重要的，具有优异的耐热冲击性和优异的耐PCT耐性，耐HAST电阻和无电镀金电镀的固化涂膜可以是 形成。 碱显影性光固化/热固性树脂组合物的特征在于包含（A）含羧基的感光性树脂，（B）光聚合引发剂，（C）嵌段共聚物和（D）热固性组分。

公开(公告)号：US08642234B2

公开(公告)日：2014-02-04

申请号：US13231498

申请日：2011-09-13

申请人： Nobuhito Ito ,  Masao Arima ,  Syouji Nishiguchi ,  Kouji Ogawa ,  Masayuki Kobayashi ,  Atsushi Sakamoto

发明人： Nobuhito Ito ,  Masao Arima ,  Syouji Nishiguchi ,  Kouji Ogawa ,  Masayuki Kobayashi ,  Atsushi Sakamoto

IPC分类号： G03C1/72 ,  G03C1/73 ,  G03C1/00 ,  C08F2/46 ,  C08J3/28 ,  C08G63/195 ,  C08G63/193

CPC分类号： H05K3/287 ,  C08G8/30 ,  C08G8/32 ,  C08L61/14 ,  G03F7/0388

摘要： A carboxyl group-containing photosensitive resin is obtained by reacting an α,β-ethylenically unsaturated group-containing monocarboxylic acid (c) with a phenolic compound (a) containing the structure represented by the following general formula (I) and having at least two phenolic hydroxyl groups in its molecule, wherein part or the whole of the phenolic hydroxyl groups being modified into an oxyalkyl group, and further reacting a polybasic acid anhydride (d) with the resultant reaction product; wherein R1 represents either one of a hydrocarbon radical of 1 to 11 carbon atoms, a SO2 group, an oxygen atom and sulfur atom, R2 represents a hydrocarbon radical of 1 to 11 carbon atoms, “a” represents an integer of 0 to 3, “n” represents an integer of 1 to 2, and “m” represents an integer of 1 to 10.

摘要翻译： 含羧基的感光性树脂通过使含α，β-烯属不饱和基团的一元羧酸（c）与含有下述通式（I）所示的结构的酚类化合物（a）反应而得到，并具有至少两个 酚羟基分子中的酚羟基，其中部分或全部酚羟基被修饰成氧烷基，并进一步使多元酸酐（d）与所得反应产物反应; 其中R1表示1〜11个碳原子的烃基，SO2基，氧原子和硫原子，R2表示碳原子数为1〜11的烃基，“a”表示0〜3的整数， “n”表示1〜2的整数，“m”表示1〜10的整数。

公开(公告)号：US20090035591A1

公开(公告)日：2009-02-05

申请号：US12242250

申请日：2008-09-30

申请人： Takahiro NISHIKAWA ,  Masashi Nakano ,  Noriyuki Akane ,  Nobuhito Ito ,  Masaki Sasaki ,  Masao Arima

发明人： Takahiro NISHIKAWA ,  Masashi Nakano ,  Noriyuki Akane ,  Nobuhito Ito ,  Masaki Sasaki ,  Masao Arima

IPC分类号： B32B15/088

CPC分类号： B32B15/08 ,  B32B27/281 ,  B32B37/04 ,  B32B2038/0028 ,  B32B2307/202 ,  B32B2307/518 ,  B32B2311/00 ,  B32B2379/08 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1064 ,  C08G73/1071 ,  H05K1/0346 ,  H05K1/036 ,  H05K3/4635 ,  H05K3/4655 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/068 ,  H05K2203/065 ,  Y10T428/31681

摘要： In a flexible laminate containing a metal foil layer/a thermoplastic polyimide layer or/and a conductor circuit layer/a thermoplastic polyimide layer, the metal foil layer or the conductor circuit layer is bonded to at least one side of the thermoplastic polyimide layer. The thermoplastic polyimide layer is formed from a thermoplastic polyimide resin film or sheet produced by melt extrusion of a thermoplastic polyimide resin. Alternatively, the thermoplastic polyimide layer is formed from a biaxially oriented thermoplastic polyimide resin film or sheet. Such a flexible laminate can be easily manufactured by a lamination method which comprises bonding a thermoplastic polyimide resin film (1) to a metal foil (2) or a conductive circuit layer (4) by heating under pressure, and has excellent heat resistance, electrical properties and mechanical strength inherent in a polyimide. When the biaxially oriented thermoplastic polyimide resin film or sheet is used, the flexible laminate can be improved in dimensional stability and resistance to soldering heat.

摘要翻译： 在含有金属箔层/热塑性聚酰亚胺层或/和导体电路层/热塑性聚酰亚胺层的柔性层叠体中，金属箔层或导体电路层与热塑性聚酰亚胺层的至少一面接合。 热塑性聚酰亚胺层由热塑性聚酰亚胺树脂膜或通过热塑性聚酰亚胺树脂的熔融挤出制成的片形成。 或者，热塑性聚酰亚胺层由双轴取向的热塑性聚酰亚胺树脂膜或片形成。 这样的柔性层压体可以容易地通过层压方法制造，其包括通过在加压下加热将热塑性聚酰亚胺树脂膜（1）粘合到金属箔（2）或导电电路层（4），并且具有优异的耐热性，电 聚酰亚胺固有的性能和机械强度。 当使用双轴取向的热塑性聚酰亚胺树脂膜或片材时，可以提高柔性层压体的尺寸稳定性和耐焊接热能。