摘要:
A reference voltage generating circuit is constituted by resistors RE and RF each having a resistance not influenced by an application of pressure. The reference voltage generating circuit is connected between one and the other ends of a bridge circuit. A failure judgement of the bridge circuit is performed based on a comparison of a voltage difference VBC between two midpoints B and C of the bridge circuit and voltage differences VCE and VBE between a reference voltage level of the reference voltage generating circuit and the voltage levels of two midpoints B and C.
摘要:
A pressure detecting apparatus has a single-crystal semiconductor sensor chip disposed on a metallic diaphragm through a low melting point glass. The sensor chip has a planar shape selected from a circular shape, a first polygonal shape having more than five sides and having interior angles all less than 180°, and a second polygonal shape having a ratio of a circumscribed circle diameter relative to an inscribed circle diameter being less than 1.2. Four strain gauge resistors are disposed on X, Y axes passing through a center point O of the sensor chip in parallel with directions. Accordingly, thermal stress is reduced not to adversely affect a detection error and simultaneously high sensitivity is provided.
摘要:
An etching method for a silicon substrate, which can easily smooth the etching surface of the (110)-oriented silicon, is disclosed. A container is filled with KOH solution. In the KOH solution is immersed a (110)-oriented silicon wafer having a PN junction and is also disposed a platinum electrode plate to face the silicon wafer. To between a platinum electrode of the silicon wafer and the platinum electrode plate are connected a constant voltage power source, an ammeter and a contact in series. A controller starts etching from one surface on which the PN junction is formed, and terminates voltage application when the specified time lapses after the formation of an anodic oxide film is equilibrated with the etching of the anodic oxide film on the etching surface on the PN junction part. In this case, the controller detects flowing current through the ammeter, and the point of time when the equilibrium state is obtained is the point of inflection of the detected current to the constant current after the peak thereof.
摘要:
A sensor circuit includes an analog-to-digital converter, a control circuit, a calculation circuit, and a pulse width modulation converter. The analog-to-digital converter converts an electric signal associated with a detected physical quantity to sensor data by sampling the electric signal a predetermined sampling number times per a predetermined sampling section. The control circuit determines the sampling number based on a magnitude of the electric signal. The calculation circuit calculates an average value of all the sensor data per the sampling section. The pulse width modulation converter generates a pulse width modulation signal having a pulse width corresponding to the average value.
摘要:
An A/D converter circuit has a first ring delay line and a second ring delay line configured to vary respective characteristics in the same manner relative to a change in the ambient temperature. A reference voltage, which is free from a change in temperature, is fed as a power supply voltage to the second ring delay line. Digital data produced by the first ring delay line is temperature-compensated by digital data produced by the second ring delay line.
摘要:
Predetermined reference voltages v1, v2 are A/D-converted to achieve corresponding digital data d0, d1, d2. Any reference digital values y1, y2 are set in advance so as to satisfy y1/y2=(v1−v0)/(v2−v0)=½. Furthermore, calculations of x1=d1−d0 and x2=d2−d0 are carried out to achieve x1, x2. A quadratic curve (quadratic function expression y=f(x)) passing a point D (x1, y1) and a point E (x2, y2) and the origin on the xy coordinate system is set as a linearly correcting expression. A shift value x achieved by subtracting d0 from data ds having non-linearity from the A/D converting circuit is corrected by the linearly correcting expression thus achieved to achieve a linearly corrected value y to ds.
摘要:
Predetermined reference voltages v1, v2 are A/D-converted to achieve corresponding digital data d0, d1, d2. Any reference digital values y1, y2 are set in advance so as to satisfy y1/y2=(v1−v0)/(v2−v0)=1/2. Furthermore, calculations of x1=d1−d0 and x2=d2−d0 are carried out to achieve x1, x2. A quadratic curve (quadratic function expression y=f(x)) passing a point D (x1, y1) and a point E (x2, y2) and the origin on the xy coordinate system is set as a linearly correcting expression. A shift value x achieved by subtracting d0from data ds having non-linearity from the A/D converting circuit is corrected by the linearly correcting expression thus achieved to achieve a linearly corrected value y to ds.
摘要:
A compact structure of a pulse-width modulator is provided which includes a clock generator, a counter, a D/A converter, a comparator, and a latching circuit. The clock generator generates clock signals. The counter counts the clock signals and provides a count signal indicative thereof in a digital form. The D/A converter converts the count signal into an analog signal. The comparator compares the analog signal converted by said D/A converter with an input signal to be pulse-width modulated to provide an output indicative thereof. The latching circuit latches the output of the comparator in response to a latch signal shifted from a change in level of the count signal to provide a pulse-width modulated signal.
摘要:
A method for producing a semiconductor device that is capable of solving problems related to dicing a metal thin film used for electrochemical etching. According to the method, an n type epitaxial thin layer is formed on a p type single-crystal silicon wafer. An n.sup.+ type diffusion layer is formed in a scribe line area on the epitaxial layer. An n.sup.+ type diffusion layer is formed in an area of the epitaxial layer which corresponds to a predetermined portion of the wafer. An aluminum film is formed over the diffusion layers. The aluminum film has a clearance for passing a dicing blade. Portions of the wafer are electrochemically etched by supplying electricity through the aluminum film and the diffusion layers, to leave portions of the epitaxial layer. The wafer is diced into chips along the scribe line area. Each of the chips forms a separate semiconductor device. The electrochemical etching of the wafer is carried out after the formation of the aluminum film by immersing the wafer in a KOH aqueous solution and by supplying electricity through the aluminum film. The electrochemical etching is terminated at an inflection point where an etching current inflects to a constant level from a peak level. During the electrochemical etching, the diffusion layer reduces horizontal resistance in the epitaxial layer, so that the etched parts receive a sufficient potential to perform the etching.
摘要:
An A/D converter circuit includes first to fourth pulse circulation circuits and first and second counters and configured to provide high conversion accuracy irrespective of a temperature change. The first pulse circulation circuit operates with a difference voltage of a specified voltage and an analog input voltage. The first counter outputs a difference of the number of pulse circulation in the first and the second pulse circulation circuits. The third pulse circulation circuit operates with a difference voltage of the specified voltage and a set voltage. The fourth pulse circulation circuit operates with the set voltage. The second counter outputs a difference of the number of pulse circulation in the third and the fourth pulse circulation circuits. When an output value of the second counter reaches a specified value, an output value of the first counter at that time is outputted as A/D conversion data.