利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

9 条记录 (耗时 0.019 秒)

    SEMICONDUCTOR DEVICE
    2.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20200098673A1

    公开(公告)日：2020-03-26

    申请号：US16527448

    申请日：2019-07-31

    申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA

    发明人： Takanori KAWASHIMA ,  Makoto IMAI ,  Masaki AOSHIMA

    IPC分类号： H01L23/495 ,  H01L23/492 ,  H01L23/00

    摘要： A semiconductor device may include a first conductor plate on which a first semiconductor element, a second semiconductor element and a first circuit board are disposed, and a plurality of first signal terminals. A size of the second semiconductor is smaller than a size of the first semiconductor element. In a plan view along a direction perpendicular to the first conductor plate, the plurality of first signal terminals is located in a first direction with respect to the first semiconductor element. The second semiconductor element and the first circuit board are located between the plurality of first signal terminals and the first semiconductor element and are arranged along a second direction that is perpendicular to the first direction. A signal pad of the first semiconductor element is connected to a corresponding one of the plurality of first signal terminals via a signal transmission path of the first circuit board.

    COOLING-TYPE SWITCHING ELEMENT MODULE
    4.
    发明申请
    COOLING-TYPE SWITCHING ELEMENT MODULE 有权
    冷却型开关元件模块

    公开(公告)号：US20140198449A1

    公开(公告)日：2014-07-17

    申请号：US14145451

    申请日：2013-12-31

    申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA

    发明人： Hiroshi OSADA ,  Masanori USUI ,  Takahide SUGIYAMA ,  Tomoyuki SHOJI ,  Satoshi HIROSE ,  Makoto IMAI ,  Norimune ORIMOTO

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20927 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/371 ,  H01L2224/37599 ,  H01L2224/40137 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014

    摘要： A cooling type switching element module includes an outer conductor pipe, an inner conductor pipe that transmits electric power in conjunction with the outer conductor pipe, and first and second switching elements. The first switching elements are provided on outer surfaces of the outer conductor pipe, and the second switching elements are provided on outer surfaces of a projecting portion of the inner conductor pipe. A coolant flows within the inner conductor pipe, and outside the outer conductor pipe. The first and second switching elements are cooled from both sides by the coolant flowing within the inner conductor pipe, and by the coolant flowing outside the outer conductor pipe. By employing the above-described structure, it is possible to provide a switching element module having a cooling function, in which improved cooling performance, improved electrical performance, and downsizing are achieved.

    摘要翻译： 冷却型开关元件模块包括外部导体管，与外部导体管一起传输电力的内部导体管，以及第一和第二开关元件。 第一开关元件设置在外导体管的外表面上，第二开关元件设置在内导体管的突出部分的外表面上。 冷却剂在内导管内流动，外导体管外。 第一和第二开关元件由在内部导体管内流动的冷却剂以及流过外部导体管外部的冷却剂从两侧冷却。 通过采用上述结构，可以提供具有冷却功能的开关元件模块，其中实现了改善的冷却性能，改善的电性能和小型化。

    CONNECTOR
    5.
    发明申请
    CONNECTOR 有权

    公开(公告)号：US20170162970A1

    公开(公告)日：2017-06-08

    申请号：US15358365

    申请日：2016-11-22

    申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA

    发明人： Keita HATASA ,  Makoto IMAI

    IPC分类号： H01R13/11 ,  H01R13/405 ,  H01R12/57

    CPC分类号： H01R13/111 ,  H01R12/57 ,  H01R13/405 ,  H01R31/08

    摘要： A female connection terminal includes a first female terminal having a substantially cylindrical shape with openings at one end and another end, a second female terminal having a substantially cylindrical shape with openings at one end and another end, and a coupling spring coupling together the first female terminal and the second female terminal at the other end of the first female terminal and the other end of the second female terminal. The coupling spring connects the first female terminal and the second female terminal to each other without, when viewed from an upper side, overlapping at least one of the openings of the first female terminal on the other end side and at least one of the openings of the second female terminal on the other end side.

    SEMICONDUCTOR DEVICE
    6.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20140131845A1

    公开(公告)日：2014-05-15

    申请号：US14056148

    申请日：2013-10-17

    申请人： Makoto IMAI ,  Toru Tanaka

    发明人： Makoto IMAI ,  Toru Tanaka

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49589 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/49562 ,  H01L23/642 ,  H01L24/33 ,  H01L25/16 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A semiconductor device includes a semiconductor element, a capacitor, a first resin, lead frames and a second resin. The first resin forms a resin molding which covers the semiconductor element and the capacitor. The lead frames are attached to two surfaces of the resin molding and are connected to the semiconductor element and the capacitor. The second resin directly covers the capacitor and has a rigidity lower than a rigidity of the first resin. An outside of the second resin is directly covered with the first resin.

    摘要翻译： 半导体器件包括半导体元件，电容器，第一树脂，引线框架和第二树脂。 第一树脂形成覆盖半导体元件和电容器的树脂成形体。 引线框架连接到树脂模制件的两个表面并连接到半导体元件和电容器。 第二树脂直接覆盖电容器，刚性低于第一树脂的刚性。 第二树脂的外部被第一树脂直接覆盖。

    SEMICONDUCTOR MODULE
    8.
    发明申请
    SEMICONDUCTOR MODULE 有权
    半导体模块

    公开(公告)号：US20130062749A1

    公开(公告)日：2013-03-14

    申请号：US13554254

    申请日：2012-07-20

    申请人： Makoto IMAI

    发明人： Makoto IMAI

    IPC分类号： H01L23/34

    CPC分类号： H01L24/72 ,  H01L23/045 ,  H01L23/051 ,  H01L23/10 ,  H01L23/32 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/492 ,  H01L24/06 ,  H01L24/33 ,  H01L2224/04026 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/00

    摘要： A semiconductor module that can be connected with simple wiring is provided. A semiconductor device of the semiconductor module is provided with a semiconductor substrate, a first electrode formed on one surface of the semiconductor substrate, and a second electrode formed on a surface of the semiconductor substrate opposite to the one surface. The semiconductor module is provided with a first electrode plate being in contact with the first electrode, a second electrode plate being in contact with the second electrode, and a first wiring member connected to the second electrode plate and penetrating the first electrode plate in a state of being insulated from the first electrode plate. The first electrode plate, the semiconductor device, and the second electrode plate are fixed with each other by an application of a pressure pressurizing the semiconductor device on the first electrode plate and the second electrode plate.

    摘要翻译： 提供可以与简单布线连接的半导体模块。 半导体模块的半导体器件设置有半导体衬底，形成在半导体衬底的一个表面上的第一电极和形成在与该表面相对的半导体衬底的表面上的第二电极。 半导体模块设置有与第一电极接触的第一电极板，与第二电极接触的第二电极板和连接到第二电极板并且以一种状态穿透第一电极板的第一配线构件 与第一电极板绝缘。 第一电极板，半导体器件和第二电极板通过在第一电极板和第二电极板上施加加压半导体器件的压力彼此固定。