公开(公告)号：US20160218248A1

公开(公告)日：2016-07-28

申请号：US14915873

申请日：2014-08-08

申请人： OSRAM OPTO SEMICONDUCTORS GMBH

发明人： Frank Möllmer ,  Markus Arzberger ,  Michael Schwind ,  Thomas Höfer ,  Martin Haushalter ,  Mario Wiengarten ,  Tilmann Eckert

IPC分类号： H01L33/48 ,  H01L33/60 ,  H01L21/48 ,  H01L33/58 ,  H01L25/16 ,  H01L29/861 ,  H01L33/62 ,  H01L33/54

CPC分类号： H01L33/486 ,  H01L21/4817 ,  H01L21/4821 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/165 ,  H01L25/167 ,  H01L29/861 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2224/45099 ,  H01L2924/00

摘要： An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. The housing body extends in a vertical direction between a mounting side of the housing body and a front side of the housing body opposite the mounting side. The first connection conductor has a recess. A semiconductor chip configured to generate radiation is arranged within the housing, and the semiconductor chip is disposed in the recess and is affixed to the first connection conductor within the recess. A side face of the recess forms a reflector for reflecting the generated radiation. The first connection conductor protrudes from the housing body at the mounting side. The semiconductor chip is, in at least some regions, free of an encapsulation material adjoining the semiconductor chip.

摘要翻译： 实施方案光电子半导体器件包括具有带有第一和第二连接导体的引线框的外壳。 壳体还具有在一个或多个区域中围绕引线框架的壳体主体。 壳体在壳体的安装侧和与安装侧相对的壳体的前侧之间沿垂直方向延伸。 第一连接导体具有凹部。 构造成产生辐射的半导体芯片布置在壳体内，并且半导体芯片设置在凹部中并且固定到凹部内的第一连接导体。 凹部的侧面形成用于反射所产生的辐射的反射器。 第一连接导体在安装侧从壳体主体突出。 在至少一些区域中，半导体芯片没有与半导体芯片相邻的封装材料。