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公开(公告)号：US10333032B2
公开(公告)日：2019-06-25
申请号：US14915873
申请日：2014-08-08
发明人： Frank Möllmer , Markus Arzberger , Michael Schwind , Thomas Höfer , Martin Haushalter , Mario Wiengarten , Tilman Eckert
IPC分类号： H01L33/48 , H01L33/58 , H01L33/60 , H01L33/62 , H01L23/00 , H01L21/48 , H01L25/16 , H01L29/861 , H01L33/54 , H01L33/64
摘要： An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. The housing body extends in a vertical direction between a mounting side of the housing body and a front side of the housing body opposite the mounting side. The first connection conductor has a recess. A semiconductor chip configured to generate radiation is arranged within the housing, and the semiconductor chip is disposed in the recess and is affixed to the first connection conductor within the recess. A side face of the recess forms a reflector for reflecting the generated radiation. The first connection conductor protrudes from the housing body at the mounting side. The semiconductor chip is, in at least some regions, free of an encapsulation material adjoining the semiconductor chip.
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公开(公告)号：US20170170625A1
公开(公告)日：2017-06-15
申请号：US15325094
申请日：2015-06-16
CPC分类号： H01S5/0071 , H01L2224/48091 , H01S5/02208 , H01S5/02228 , H01S5/02252 , H01S5/0226 , H01S5/02268 , H01S5/02288 , H01S5/02292 , H01S5/02296 , H04N13/254 , H04N2213/001 , H01L2924/00014
摘要： Various embodiments may relate to a semiconductor laser device, including at least one laser diode, and at least one reflection surface which reflects diffusely and which is irradiated by the laser diode during operation, and an additional light-nontransmissive housing body having a cutout. The laser diode is the sole light source of the semiconductor laser device. The laser diode is mounted immovably relative to the at least one reflection surface. Light emitted by the semiconductor laser device during operation has the same spectral components as, or fewer spectral components than, light emitted by the laser diode. An interspace between the laser diode and the at least one reflection surface is free of an optical assembly. A light-emitting area of the semiconductor laser device is greater than a light-emitting area of the laser diode by at least a factor of 100.
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公开(公告)号：US10283929B2
公开(公告)日：2019-05-07
申请号：US15325094
申请日：2015-06-16
IPC分类号： H01S5/00 , H01S5/022 , H04N3/02 , H04N13/254
摘要： Various embodiments may relate to a semiconductor laser device, including at least one laser diode, and at least one reflection surface which reflects diffusely and which is irradiated by the laser diode during operation, and an additional light-nontransmissive housing body having a cutout. The laser diode is the sole light source of the semiconductor laser device. The laser diode is mounted immovably relative to the at least one reflection surface. Light emitted by the semiconductor laser device during operation has the same spectral components as, or fewer spectral components than, light emitted by the laser diode. An interspace between the laser diode and the at least one reflection surface is free of an optical assembly. A light-emitting area of the semiconductor laser device is greater than a light-emitting area of the laser diode by at least a factor of 100.
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公开(公告)号：US20160218248A1
公开(公告)日：2016-07-28
申请号：US14915873
申请日：2014-08-08
发明人： Frank Möllmer , Markus Arzberger , Michael Schwind , Thomas Höfer , Martin Haushalter , Mario Wiengarten , Tilmann Eckert
IPC分类号： H01L33/48 , H01L33/60 , H01L21/48 , H01L33/58 , H01L25/16 , H01L29/861 , H01L33/62 , H01L33/54
CPC分类号： H01L33/486 , H01L21/4817 , H01L21/4821 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/165 , H01L25/167 , H01L29/861 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2924/00014 , H01L2924/12041 , H01L2924/181 , H01L2933/005 , H01L2933/0066 , H01L2224/45099 , H01L2924/00
摘要： An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. The housing body extends in a vertical direction between a mounting side of the housing body and a front side of the housing body opposite the mounting side. The first connection conductor has a recess. A semiconductor chip configured to generate radiation is arranged within the housing, and the semiconductor chip is disposed in the recess and is affixed to the first connection conductor within the recess. A side face of the recess forms a reflector for reflecting the generated radiation. The first connection conductor protrudes from the housing body at the mounting side. The semiconductor chip is, in at least some regions, free of an encapsulation material adjoining the semiconductor chip.
摘要翻译： 实施方案光电子半导体器件包括具有带有第一和第二连接导体的引线框的外壳。 壳体还具有在一个或多个区域中围绕引线框架的壳体主体。 壳体在壳体的安装侧和与安装侧相对的壳体的前侧之间沿垂直方向延伸。 第一连接导体具有凹部。 构造成产生辐射的半导体芯片布置在壳体内，并且半导体芯片设置在凹部中并且固定到凹部内的第一连接导体。 凹部的侧面形成用于反射所产生的辐射的反射器。 第一连接导体在安装侧从壳体主体突出。 在至少一些区域中，半导体芯片没有与半导体芯片相邻的封装材料。
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