公开(公告)号：US20190296201A1

公开(公告)日：2019-09-26

申请号：US16302614

申请日：2017-05-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Knoerr

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/48 ,  H01L25/075

Abstract: A method for manufacturing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment, a method includes applying a conversion layer including a luminescence conversion material to a support plate including a glass, arranging at least two optoelectronic semiconductor chips over the conversion layer on a side remote from the support plate and forming an envelope material free from a luminescence conversion material between the optoelectronic semiconductor chips, thereby forming a workpiece.

公开(公告)号：US20180076367A1

公开(公告)日：2018-03-15

申请号：US15564499

申请日：2016-04-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Knoerr

IPC: H01L33/60 ,  H01L33/54 ,  H01L33/62 ,  H01L33/00 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L25/167 ,  H01L33/0079 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/04105 ,  H01L2224/96 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip at least partly enclosed by a molded body, wherein a front side of the molded body is covered by a reflecting film, at least in some sections, and a section of the reflecting film is enclosed between the optoelectronic semiconductor chip and the molded body.

公开(公告)号：US20170222092A1

公开(公告)日：2017-08-03

申请号：US15487277

申请日：2017-04-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Matthias Knoerr ,  Klaus Mueller ,  Thomas Schwarz ,  Frank Singer ,  Michael Zitzlsperger

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/62 ,  H01L23/498 ,  H01L51/56 ,  H01L51/52

CPC classification number: H01L33/483 ,  H01L21/4828 ,  H01L21/565 ,  H01L23/49861 ,  H01L24/32 ,  H01L25/0753 ,  H01L33/62 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5296 ,  H01L51/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A housing for an optical component is provided in various embodiments. The housing has a leadframe section and a mold compound. The leadframe section is formed from an electrically conductive material and has a first side and a second side facing away from the first side. On the first side, the leadframe section has at least one first receiving region for receiving the optical component and/or at least one contact region for electrically contacting the optical component. The leadframe section has at least one trench which is formed in the leadframe section on the first side thereof alongside the receiving region and/or the contact region. The leadframe section is embedded in the mold compound. The mold compound has at least one receiving recess in which the first receiving region and/or the contact region and the trench are arranged.