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    Multilayer board manufacturing method
    1.
    发明授权
    Multilayer board manufacturing method 有权
    多层板制造方法

    公开(公告)号：US07421779B2

    公开(公告)日：2008-09-09

    申请号：US10545731

    申请日：2004-02-13

    申请人： Osamu Nakao ,  Reiji Higuchi ,  Syouji Ito ,  Masahiro Okamoto

    发明人： Osamu Nakao ,  Reiji Higuchi ,  Syouji Ito ,  Masahiro Okamoto

    IPC分类号： H05K3/30

    CPC分类号： H05K3/4617 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0397 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0969 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive foil (40) is arranged underneath the base material (30), and subsequently these materials are colaminated for forming a colaminated body (80). While this colaminating operation, conductive portions being formed in the base materials 10, 30 are aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion (51) being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material (20) and the conductive foil (40) accordingly.

    摘要翻译： 基材（20）布置在至少一个第一内层基材（10）的顶部上，并且第二内基材（30）布置在基材（10）的下方。 此后，表面层电路导电箔（40）布置在基底材料（30）的下面，随后将这些材料进行混合以形成一个混合体（80）。 在这种分层操作中，形成在基材10,30中的导电部分被对齐以彼此电连接以形成内部电路。 此后，形成电连接到内部电路的层间导电部分（51），并且相应地在基底材料（20）的顶部和导电箔（40）上形成分电路。

    Multilayer board and its manufacturing method
    2.
    发明申请
    Multilayer board and its manufacturing method 有权
    多层板及其制造方法

    公开(公告)号：US20060191133A1

    公开(公告)日：2006-08-31

    申请号：US10545731

    申请日：2004-02-13

    申请人： Osamu Nakao ,  Reiji Higuchi ,  Syouji Ito ,  Masahiro Okamoto

    发明人： Osamu Nakao ,  Reiji Higuchi ,  Syouji Ito ,  Masahiro Okamoto

    IPC分类号： H05K3/36 ,  H05K3/20

    CPC分类号： H05K3/4617 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0397 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0969 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive foil (40) is arranged underneath the base material (30), and subsequently these materials are colaminated for forming a colaminated body (80). While this colaminating operation, conductive portions being formed in the base materials 10, 30 are aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion (51) being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material (20) and the conductive foil (40) accordingly.

    摘要翻译： 基材（20）布置在至少一个第一内层基材（10）的顶部上，并且第二内基材（30）布置在基材（10）的下方。 此后，表面层电路导电箔（40）布置在基底材料（30）的下面，随后将这些材料进行混合以形成一个混合体（80）。 在这种分层操作中，形成在基材10,30中的导电部分被对齐以彼此电连接以形成内部电路。 此后，形成电连接到内部电路的层间导电部分（51），并且相应地在基底材料（20）的顶部和导电箔（40）上形成分电路。

    Multi-layer board manufacturing method thereof
    3.
    发明授权
    Multi-layer board manufacturing method thereof 有权
    多层板制造方法

    公开(公告)号：US08726495B2

    公开(公告)日：2014-05-20

    申请号：US12140042

    申请日：2008-06-16

    申请人： Osamu Nakao ,  Reiji Higuchi ,  Syouji Ito ,  Masahiro Okamoto

    发明人： Osamu Nakao ,  Reiji Higuchi ,  Syouji Ito ,  Masahiro Okamoto

    IPC分类号： H05K3/20

    CPC分类号： H05K3/4617 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0397 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0969 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive foil (40) is arranged underneath the base material (30), and subsequently these materials are colaminated for forming a colaminated body (80). While this colaminating operation, conductive portions being formed in the base materials 10, 30 are aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion (51) being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material (20) and the conductive foil (40) accordingly.

    摘要翻译： 基材（20）布置在至少一个第一内层基材（10）的顶部上，并且第二内基材（30）布置在基材（10）的下方。 此后，表面层电路导电箔（40）布置在基底材料（30）的下面，随后将这些材料进行混合以形成一个混合体（80）。 在这种分层操作中，形成在基材10,30中的导电部分被对齐以彼此电连接以形成内部电路。 此后，形成电连接到内部电路的层间导电部分（51），并且相应地在基底材料（20）的顶部和导电箔（40）上形成分电路。

    Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method
    4.
    发明授权
    Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method 失效
    多层布线板，多层布线基板，印刷线路板及其制造方法

    公开(公告)号：US07312400B2

    公开(公告)日：2007-12-25

    申请号：US10505094

    申请日：2003-02-21

    申请人： Shoji Ito ,  Osamu Nakao ,  Reiji Higuchi ,  Masahiro Okamoto

    发明人： Shoji Ito ,  Osamu Nakao ,  Reiji Higuchi ,  Masahiro Okamoto

    IPC分类号： H05K1/00

    CPC分类号： H05K3/4617 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0191 ,  H05K2203/1453 ,  Y10T29/49165 ,  Y10T428/12181 ,  Y10T428/24917

    摘要： A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111); a conductive layer 112 formed on one surface of said insulating substrate component 111 in the form of an electrode pattern; an adhesive layer 113 formed on the other surface of said insulating substrate component 111; and a conductive resin composition 115 with which is filled a through hole passing through said insulating substrate component 111, said adhesive layer and said conductive layer in order to make interlayer interconnection. The bore diameter of the conductive layer portion 114b of the through hole 114 is smaller than the bore diameter of the insulating resin layer portion and the adhesive layer portion 114a to establish electrical connection between the conductive resin composition 115 and the conductive layer 112 by the rare surface 112a of the conductive layer 112.

    摘要翻译： 多层布线基板组件包括：绝缘基板部件（绝缘树脂层111）。 以电极图案的形式形成在所述绝缘基板部件111的一个表面上的导电层112; 形成在所述绝缘基板部件111的另一个表面上的粘合层113; 以及导电树脂组合物115，其填充有穿过所述绝缘基板部件111，所述粘合剂层和所述导电层的通孔，以形成层间互连。 通孔114的导电层部分114b的孔径小于绝缘树脂层部分和粘合剂层部分114a的孔径，以通过以下方式建立导电树脂组合物115和导电层112之间的电连接： 导电层112的稀有表面112a。

    Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method
    5.
    发明申请
    Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method 失效
    多层布线板，多层布线基板，印刷线路板及其制造方法

    公开(公告)号：US20050155792A1

    公开(公告)日：2005-07-21

    申请号：US10505094

    申请日：2003-02-21

    申请人： Shoji Ito ,  Osamu Nakao ,  Reiji Higuchi ,  Masahiro Okamoto

    发明人： Shoji Ito ,  Osamu Nakao ,  Reiji Higuchi ,  Masahiro Okamoto

    IPC分类号： H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11 ,  H05K3/42

    CPC分类号： H05K3/4617 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0191 ,  H05K2203/1453 ,  Y10T29/49165 ,  Y10T428/12181 ,  Y10T428/24917

    摘要： A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111); a conductive layer 112 formed on one surface of said insulating substrate component 111 in the form of an electrode pattern; an adhesive layer 113 formed on the other surface of said insulating substrate component 111; and a conductive resin composition 115 with which is filled a through hole passing through said insulating substrate component 111, said adhesive layer and said conductive layer in order to make interlayer interconnection. The bore diameter of the conductive layer portion 114b of the through hole 114 is smaller than the bore diameter of the insulating resin layer portion and the adhesive layer portion 114a to establish electrical connection between the conductive resin composition 115 and the conductive layer 112 by the rare surface 112a of the conductive layer 112.

    摘要翻译： 多层布线基板组件包括：绝缘基板部件（绝缘树脂层111）。 以电极图案的形式形成在所述绝缘基板部件111的一个表面上的导电层112; 形成在所述绝缘基板部件111的另一个表面上的粘合层113; 以及导电树脂组合物115，其填充有穿过所述绝缘基板部件111，所述粘合剂层和所述导电层的通孔，以形成层间互连。 通孔114的导电层部分114b的孔径小于绝缘树脂层部分和粘合剂层部分114a的孔径，以通过以下方式建立导电树脂组合物115和导电层112之间的电连接： 导电层112的稀有表面112a。